Semiconductor Packaging & Testing UV Viscosity Reduction Special Film

The product uses PO as the surface protection material, mainly used for QFN cutting, SMD microphone substrate cutting, FR4 substrate cutting (LED).



Product Specification Parameters

Product Model Product Type Thickness Peel Force Before UV Peel Force After UV
DM-208A PO+UV tack reduction 170μm 800gf/25mm 15gf/25mm
DM-208B PO+UV tack reduction 170μm 1200gf/25mm 20gf/25mm
DM-208C PO+UV tack reduction 170μm 1500gf/25mm 30gf/25mm