Analysis of Differences in Flame Retardant Performance Test Methods for Fireproof Adhesives and Their Impacts In the field of flame retardant performance testing for materials, fireproof adhesives, as a critical fire-resistant material, require accurate evaluation of their flame retardant properties. Internationally, standards such as UL and EN, and domestically, the...
Understanding Underfill Epoxy in BGA Applications Introduction to BGA and Underfill Epoxy Ball Grid Array (BGA) is a type of surface-mount packaging used for integrated circuits. It offers several advantages over traditional packages, including better thermal and electrical performance, higher pin density, and smaller package size. However, the reliability of BGA...
How To Find The Right Consumer Electronics Bonding Adhesive Glue For Wearables Device Assembly The best consumer electronics bonding adhesive simply depends on the application you are working on. I do not think that there is any one solution that is considered fit for all applications. What qualifies a bonding...
Why Electronics Assembly Adhesives Are Perfect For Electronic Manufacturing Why are electronic assembly adhesives designed to function the way they do? This is a concept you must understand if you wish to succeed in the electronics assembly industry. Adhesives meant for electronic assembly are unique in their own way. They...
