Low temperature curing epoxy adhesive for sensitive devices and circuit protection

This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.

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Description

Product Specification Parameters

Product Model Product Name Color Typical Viscosity (cps) Curing Time Use Distinction
DM-6128 Low temperature curing epoxy adhesive Black 7000-27000 @80℃ 20min

60℃ 60min

CCD/CMOS/Sensitive Electronic Components Low temperature curing adhesive, typical applications include memory card, CCD or CMOS assembly. This product is suitable for low temperature curing and can provide good adhesion to various materials in a fairly short period of time. Typical applications include memory cards, CCD/CMOS assemblies. Particularly suitable for thermal components that require low temperature curing.
DM-6129 Low temperature curing epoxy adhesive Black 12,000-46,000 @80℃ 5~10min CCD/CMOS/Sensitive Electronic Components It is a one-component heat-curing epoxy resin. It is suitable for low temperature curing and has good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermally sensitive components where low curing temperatures are required.
DM-6220 Low temperature curing epoxy adhesive Black 2500 @80℃ 5~10min Backlight module fixing Classic low temperature curing adhesive for LCD backlight module assembly.
DM-6280 Low temperature curing epoxy adhesive White 8700 @80℃ 2min CCD or CMOS components, VCM motor fixing Low temperature fast curing for assembly of CCD or CMOS components, VCM motors. 3280 is designed for thermal applications requiring low temperature curing. It can quickly provide customers with high throughput applications , such as laminating light diffusion lenses to leds, and assembling image sensing devices (including camera modules). This material is white to provide greater reflectivity.

 

Product Features

Good adhesion High production efficiency (fast curing)
Fast delivery of high throughput applications Suitable for low temperature curing applications

 

Product Advantages

Low temperature curing adhesive is a single component heat curing epoxy resin. It is fast curing at low temperature and is used for the assembly of CCD or CMOS components and VCM motors. This product is suitable for low temperature curing and has good adhesion to a wide range of materials in a very short period of time. It is especially suitable for thermal components where low temperature curing is required.