Low temperature curing epoxy adhesive for sensitive devices and circuit protection
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Product Specification Parameters
|High production efficiency (fast curing)
|Fast delivery of high throughput applications
|Suitable for low temperature curing applications
Low temperature curing adhesive is a single component heat curing epoxy resin. It is fast curing at low temperature and is used for the assembly of CCD or CMOS components and VCM motors. This product is suitable for low temperature curing and has good adhesion to a wide range of materials in a very short period of time. It is especially suitable for thermal components where low temperature curing is required.