Epoxy Encapsulant

Chigadzirwa chacho chine yakanakisa kupikisa kwemamiriro ekunze uye ine yakanaka kuchinjika kune yakasikwa nharaunda. Yakanakisa magetsi ekudzivirira kushanda, inogona kudzivirira kuita pakati pezvikamu uye mitsetse, yakakosha yekudzivirira mvura, inogona kudzivirira zvikamu kubva pakukanganiswa nehunyoro uye hunyoro, kugona kwakanaka kwekupisa kupisa, kunogona kuderedza tembiricha yezvikamu zvemagetsi kushanda, uye kurebesa hupenyu hwesevhisi.

Category: Epoxy Adhesive

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tsananguro

Chigadzirwa Rondedzero Parameter

chigadzirwa mhando	chigadzirwa zita	ruvara	Typical Viscosity (cps)	Kurapa nguva	shandisa	Kusiyanisa
DM-6016E	Epoxy potting adhesive	Nhema	58000 ~ 62000	@150 ℃ 20min	PCB bhodhi inopinza inopinza, transistors, smart kadhi IC kadhi kurongedza	Zvemaapplication uko kwakanakisa kubata zvivakwa zvinodiwa. Zvinhu zvakarapwa zviripo zvekuvhunduka kwakanyanya kupisa uye zvinopa kuenderera kwekupisa kwe177 ° C. Kunyanya akakodzera kurongedza ma transistors uye akafanana semiconductors, inogona kushandiswa kurongedza yewachi yakasanganiswa maseketi, component encapsulation adhesive, yePCB board inonzwa inopinza, transistors, smart kadhi IC kadhi kurongedza.
DM-6058E	Epoxy potting adhesive	Nhema	50,000	@120 ℃ 12min	Packaging ye sensors uye zvakarurama Components	Ichi chigadzirwa chinopa yakanakisa kuchengetedzwa kwemamiriro ekunze uye kupisa kwemidziyo yekurongedza, uye inonyanya kukodzera kuchengetedzwa kwema sensors uye chaiyo zvikamu zvinoshandiswa munzvimbo dzakaomarara senge mota.
DM-6061E	Epoxy potting adhesive	Nhema	32500 ~ 50000	@ 140°C 3H	PCB bhodhi inopinza inopinza, transistors, smart kadhi IC kadhi kurongedza	Component encapsulation glue, inoshandiswa kurongedza plug-in PCB mabhodhi, yakanakisa viscosity kugadzikana, nyore kudzora saizi yeglue. Mushure mekupfuura 1000H tembiricha / humidity / kutsauka bvunzo uye kupisa kutenderera kusvika 125 ℃. Iyo yakakosha viscosity yakagadzikana pa 25 ° C inopa saizi inodzorwa zviri nyore uchishandisa yakajairwa nguva / kudzvanywa midziyo yekuparadzira.
DM-6086E	Epoxy potting adhesive	Nhema	62500	@120℃ 30min 150℃ 15min	IC uye Semiconductor Packaging	Inoshandiswa mumashandisirwo anoda zvakanakisa kubata zvivakwa. Kune IC uye semiconductor packaging ine yakanaka kupisa kutenderera kugona, zvinhu zvinokwanisa kutsungirira kupisa kwemhepo kuenderera kusvika 177 ° C.

Product Features
· Inopa kuchengetedzwa kwepamusoro kwezvakatipoteredza uye kupisa
· Yakanakisa viscosity kugadzikana, nyore kudzora kugovera saizi
· Yakanaka kupisa bhasikoro kugona, zvinhu zvinokwanisa kumira kutyisa kusvika 177 ° C nguva dzose.
· Yezvikumbiro zvinoda hukuru hwekugadzirisa

Mutengo Unobatsira
Chigadzirwa ndeye epoxy resin encapsulant, yakakodzera kune maapplication anoda yakanakisa kubata zvivakwa. Component encapsulation glue, inoshandiswa kuPCB board inonzwisisika plug-in packaging, yakanakisa viscosity kugadzikana, nyore kudzora saizi yeglue. Epoxy resin encapsulants yakagadzirirwa zvikumbiro zvinoda zvakanakisa kubata zvivakwa. Inoshandiswa IC uye semiconductor packaging, ine yakanaka kupisa kutenderera kugona, uye zvinhu zvinokwanisa kutsungirira kuvhunduka kwekushisa kusvika 177 ° C.