DeepMaterial Electronic Adhesive Pruducts
DeepMaterial, semaindasitiri epoxy adhesive anogadzira, tinorasikirwa netsvagiridzo nezve underfill epoxy, non conductive glue yemagetsi, non conductive epoxy, adhesives emagetsi assembly, underfill adhesive, high refractive index epoxy. Kubva pane izvo, isu tine yazvino tekinoroji yeindasitiri epoxy adhesive.
DeepMaterial yakagadzira maindasitiri anonamira ekurongedza uye kuyedza, edunhu bhodhi-level adhesives, uye anonamira ezvigadzirwa zvemagetsi. Zvichienderana nezvinonamira, yakagadzira mafirimu ekudzivirira, semiconductor mafirita, uye zvinhu zvekurongedza zve semiconductor wafer processing uye chip kurongedza uye kuyedzwa.
Kupa zvekunamira zvemagetsi uye zvitete-firimu zvemagetsi zvekushandisa zvigadzirwa uye mhinduro kumakambani ekutaurirana, makambani emagetsi evatengi, semiconductor ekurongedza uye makambani ekuyedza, uye vagadziri vemidziyo yekutaurirana, kugadzirisa vatengi vataurwa pamusoro mukudzivirira, chigadzirwa chakanyanya-chaiyo bonding. , uye kushanda kwemagetsi.
DeepMaterial inopa mhando dzakasiyana dzezvigadzirwa nezve maindasitiri anonamira emagetsi, UV kurapa UV adhesive akateedzana, reactive rudzi rwekupisa kunyunguduka adhesive uye kudzvanywa kusinganzwisisike inopisa melt adhesiveseries, epoxy-based chip underfill uye COB encapsulation zvinhu zvakatevedzana, redunhu bhodhi kudzivirira potting uye conformal coating adhesive. series, epoxy based conductive silver adhesive series, structural bonding adhesive series, functional protective film series, semiconductor protective film series.
Deepmaterial inodhirowa kubva kwakasiyana siyana yekunamira tekinoroji kuti ipe inonamira mhinduro dzekubatanidza, kumisa chisimbiso, uye kupinza maapplication. Isu tinopa akajairwa anonamira masevhisi pane zvaunoda, tsika yemagetsi anonamira, PUR chimiro chinonamira, UV mwando inorapa inonamira, epoxy adhesive, conductive sirivheri guruu, epoxy underfill adhesive, epoxy encapsulant, inoshanda inodzivirira firimu, semiconductor inodzivirira firimu.