Epoxy Adhesive
DeepMaterial inopa nyowani capillary inoyerera underfills yeflip chip, CSP uye BGA zvishandiso. DeepMaterial's new capillary flow underfills ndeye yakakwira fluidity, yakakwirira-kuchena, imwe-chikamu chehari zvinhu zvinoumba yunifomu, isina-isina-isina underfill layers iyo inovandudza kuvimbika uye mechanical zvimiro zvezvikamu nekubvisa kushushikana kunokonzerwa ne solder zvinhu. DeepMaterial inopa maumbirwo ekukurumidza kuzadza kweakanyanya kunaka zvikamu, kukurumidza kurapa kugona, kushanda kwenguva refu uye hupenyu hwehupenyu, pamwe nekushandazve. Reworkability inochengetedza mari nekubvumira kubviswa kweiyo underfill kuti ishandiswezve bhodhi.
Flip chip assembly inoda kuzorora kwekushushikana kweiyo welding seam zvakare kune yakawedzera kupisa kuchembera uye kutenderera hupenyu. CSP kana BGA gungano inoda kushandiswa kweiyo underfill kuti ivandudze kutendeseka kwemuchina wegungano panguva yeflex, vibration kana kudonha kuyedzwa.
DeepMaterial's flip-chip underfills ine yakakwira yekuzadza mukati ichichengetedza nekukurumidza kuyerera mumapikisi madiki, nekugona kuve nepamusoro girazi tembiricha yekuchinja uye yakakwirira modulus. Yedu CSP underfills inowanikwa mune akasiyana mafirita mazinga, akasarudzirwa tembiricha yegirazi yekuchinja uye modulus yeiyo yakarongwa application.
COB encapsulant inogona kushandiswa kune waya yekubatanidza kupa kuchengetedzwa kwezvakatipoteredza uye kuwedzera simba remagetsi. Iyo yekuvharira chisimbiso yewaya-yakasungwa machipisi inosanganisira yepamusoro encapsulation, cofferdam, uye gap kuzadza. Adhesives ane yakanaka-tuning flow function inodiwa, nekuti kugona kwavo kuyerera kunofanirwa kuve nechokwadi chekuti waya dzakavharwa, uye chinonamira hachizoyerera kubva muchip, uye chengetedza icho chinogona kushandiswa kune yakanakisa pitch lead.
DeepMaterial's COB yakavharira anonamira inogona kuve inopisa kana UV yakarapwa DeepMaterial's COB encapsulation adhesive inogona kupisa kupisa kana UV-kuporeswa nekuvimbika kwakanyanya uye yakadzikira yekuzvimba yekudziya coefficient, pamwe nekukwira kwegirazi kutendeuka tembiricha uye yakaderera ion zvirimo. DeepMaterial's COB yakavharira adhesives inodzivirira inotungamira uye plumbum, chrome uye silicon wafers kubva kune ekunze nharaunda, kukuvara kwemagetsi uye ngura.
DeepMaterial COB encapsulating adhesives akagadzirwa neheat-curing epoxy, UV-curing acrylic, kana silicone chemistries yekuvharisa magetsi. DeepMaterial COB encapsulating adhesives inopa yakanaka yakakwira tembiricha kugadzikana uye kupisa kutyisa kuramba, magetsi ekudzivirira zvivakwa pamusoro pehupamhi hwekushisa, uye kuderera kuderera, kuderera kushushikana, uye makemikari kuramba kana arapwa.
Deepmaterial yakanakisa yepamusoro isingapindi mvura inonamira glue yepurasitiki kune simbi uye girazi mugadziri, shandisa isina conductive epoxy adhesive sealant glue ye underfill pcb yemagetsi zvinhu, semiconductor adhesives emagetsi gungano, yakaderera tembiricha kurapa bga flip chip underfill pcb epoxy process adhesive glue zvinhu zvichingodaro. on
DeepMaterial Epoxy Resin Base Chip Pazasi Kuzadza Uye Cob Packaging Material Sarudzo Tafura
Epoxy Underfill Chigadzirwa Sarudzo
| Product Series | Product zita | Yakajairika kushandiswa kwechigadzirwa |
| Epoxy Underfill | DM-6308 | Imwe-chikamu epoxy primer yekugadzira yeLED splicing skrini muCOB yekurongedza maitiro. Chigadzirwa chine shoma viscosity, kunamatira kwakanaka uye simba rekukotama rakakwirira, rinogona kukurumidza uye zvinobudirira kuzadza iro diki pakati pemachipisi uye zvinobudirira kusimudzira kuvimbika kweiyo chip mounting. |
| DM-6303 | Imwe-chikamu epoxy primer yekugadzira yeLED splicing skrini muCOB yekurongedza maitiro. Chigadzirwa chacho chine yakaderera viscosity, yakanaka kunamatira uye yakakwirira kukotama simba, iyo inogona kukurumidza uye zvinobudirira kuzadza iro diki mukaha pakati pemachipisi uye zvinobudirira kusimbisa kuvimbika kwekuiswa kwechip. | |
| DM-6322 | Imwe-chikamu epoxy primer yekugadzira yeLED splicing skrini muCOB yekurongedza maitiro. Chigadzirwa chine shoma viscosity, kunamatira kwakanaka uye simba rekukotama rakakwirira, rinogona kukurumidza uye zvinobudirira kuzadza iro diki pakati pemachipisi uye zvinobudirira kusimudzira kuvimbika kweiyo chip mounting. |
OLED Edge Banding Chigadzirwa Sarudzo
| Product Series | Product zita | Yakajairika kushandiswa kwechigadzirwa |
| EpoxyZvisimbiso | DM-6930 | Chinhu chimwe-chinodzikira tembiricha inorapa epoxy sealant, yakagadzirirwa kuvharwa kumucheto kweOLED kuratidzwa, ine yakaderera mvura mhute transmittance uye hunyoro kuramba, inogona zvinobudirira kuvandudza hupenyu hweOLED kuratidzwa, uye inogona zvakare kushandiswa kuvharira kumucheto kwemagetsi bepa kuratidza. inki skrini). |
| DM-6931 | Chinhu chimwe-chinodzikira tembiricha inorapa epoxy sealant, yakagadzirirwa kuvharwa kumucheto kweOLED kuratidzwa, ine yakaderera mvura mhute transmittance uye hunyoro kuramba, inogona zvinobudirira kuvandudza hupenyu hweOLED kuratidzwa, uye inogona zvakare kushandiswa kuvharira kumucheto kwemagetsi bepa kuratidza. inki skrini). |
Cold-yakadzvanywa Packaging Adhesive Chigadzirwa Sarudzo
| Product Series | Product zita | Yakajairika kushandiswa kwechigadzirwa |
| Zvikamu zviviri epoxy adhesive | DM-6986 | Iyo miviri-yechikamu epoxy adhesive, yakanyatsogadzirirwa iyo yakabatanidzwa induction inotonhora yekutsikirira, ine simba rakakura, kuita kwakanakisa kwemagetsi uye kusimba kwakasiyana-siyana. |
| DM-6988 | Iyo miviri-yepamusoro-yakasimba epoxy adhesive, yakanyatso kugadzirirwa iyo yakabatanidzwa induction kutonhora kudzvanya maitiro, ine simba rakawanda, kuita kwakanakisa kwemagetsi uye kusimba kwakasimba. | |
| DM-6987 | Iyo miviri-chikamu epoxy adhesive yakanyatsogadzirirwa iyo yakabatanidzwa induction inotonhora yekutsikirira maitiro. Chigadzirwa chine simba rakawanda, maitiro akanaka egranulation uye goho rehupfu. | |
| DM-6989 | Iyo miviri-chikamu epoxy adhesive yakanyatsogadzirirwa iyo yakabatanidzwa induction inotonhora yekutsikirira maitiro. Chigadzirwa chacho chine simba rakawanda, rakanakisa kuputika kuramba uye kuchembera kwakanaka. |
Kupisa-kudzvanywa Packaging Adhesive Chigadzirwa Sarudzo
| Product Series | Product zita | Yakajairika kushandiswa kwechigadzirwa |
| Zvikamu zviviri epoxy adhesive | DM-6997 | Iyo miviri-chikamu epoxy adhesive yakanyatsogadzirirwa iyo yakabatanidzwa induction inopisa-kudzvanya maitiro. Chigadzirwa chacho chine dhimoni yakanaka yekuita uye yakasimba kuita zvakasiyana. |
| DM-6998 | Iyo miviri-chikamu epoxy adhesive yakanyatsogadzirirwa iyo yakabatanidzwa induction inopisa-kudzvanya maitiro. Ichi chigadzirwa chine kuita kwakanaka kwedemoulding, simba repamusoro uye yakanakisa kupisa kuchembera kuramba. |
NR Magnetic Adhesive Product Selection
| Product Series | Product zita | Yakajairika kushandiswa kwechigadzirwa |
| Zvikamu zviviri epoxy adhesive | DM-6971 | Imwe-chikamu epoxy adhesive yakanyatsogadzirirwa NR inductance coil encapsulation. Chigadzirwa chacho chine kuburitsa kwakatsetseka, kukurumidza kurapa kukurumidza, kwakanaka kuumbwa kwekuita, uye inoenderana nemarudzi ese emagineti particles. |
High Temperature Resistant Insulating Coating Product Selection
| Product Series | Product zita | Yakajairika kushandiswa kwechigadzirwa |
| Zvitatu-zvikamu epoxy adhesive | DM-7317 | DM-7317 chikamu chetatu chepamusoro-tembiricha insulation yakakosha coating, iyo inokodzera kuchengetedzwa kwepamusoro kweakasiyana magineti zvikamu. Iyo yakanyatsogadzirirwa iyo roll yekupfapfaidza process uye ine yakanakisa yepamusoro-tembiricha kuramba uye insulation kuita. |
