1. Home
2.  >
3. Industries
4.  >
5. Underfill Epoxy

Underfill Epoxy

Underfill epoxy imhando yekunamira inoshandiswa kuwedzera kuvimbika kwezvinhu zvemagetsi, kunyanya mumasemiconductor ekurongedza maapplication. Iyo inozadza mukaha pakati pepakeji uye yakadhindwa yedunhu bhodhi (PCB), ichipa tsigiro yemagetsi uye zororo rekushushikana kudzivirira kuwedzera kwekupisa uye kukanganisa kukanganiswa. Underfill epoxy zvakare inovandudza mashandiro emagetsi epasuru nekudzikisa iyo parasitic inductance uye capacitance. Muchikamu chino, tinoongorora mashandisirwo akasiyana-siyana epoxy underfill, marudzi akasiyana aripo, uye mabhenefiti avo.

Iko kukosha kweUnderfill Epoxy muSemiconductor Packaging

Underfill epoxy yakakosha mukurongedza semiconductor, ichipa kusimbaradza kwemakanika uye kudzivirira kune yakatetepa microelectronic zvikamu. Iyo yakasarudzika inonamira zvinhu inoshandiswa kuzadza gaka pakati pe semiconductor chip uye pasuru substrate, inosimudzira kuvimbika uye kushanda kwemidziyo yemagetsi. Pano, isu tichaongorora kukosha kwe underfilled epoxy mu semiconductor packaging.

Rimwe remabasa ekutanga epoxy isina kuzadzwa ndeyekuvandudza simba remakanika uye kuvimbika kwepakeji. Panguva yekushanda, semiconductor machipisi anoiswa pasi pekunetseka kwakasiyana-siyana kwemagetsi, sekuwedzera kwekupisa uye kuputika, vibration, uye kuvhunduka kwemuchina. Izvi zvinonetsa zvinogona kutungamira mukugadzirwa kwemajoini anotsemuka, izvo zvinogona kukonzera kutadza kwemagetsi uye kuderedza hupenyu hwese hwechigadzirwa. Underfill epoxy inoshanda senge inoderedza kushushikana nekugovanisa iyo mechanical stress zvakaenzana pane chip, substrate, uye solder majoini. Iyo inobudirira inoderedza kuumbwa kwekuputika uye inodzivirira kupararira kwezvimedu zviripo, kuve nechokwadi chekuvimbika kwenguva refu kwepakiti.

Chimwe chinhu chakakosha che underfill epoxy kugona kwayo kusimudzira mashandiro emafuta emidziyo yesemiconductor. Kupisa kupisa kunova kunetseka kwakanyanya sezvo michina yemagetsi inoderera muhukuru uye kuwedzera simba remagetsi, uye kupisa kwakanyanya kunogona kukanganisa kushanda uye kuvimbika kweiyo semiconductor chip. Underfill epoxy ine yakanakisa yekupisa conductivity zvivakwa, ichiibvumira kutamisa kupisa kubva kune chip uye kuiparadzira mukati mepakeji. Izvi zvinobatsira kuchengetedza tembiricha yakakwana yekushanda uye inodzivirira hotspots, nekudaro inovandudza iyo yakazara yekupisa manejimendi yechishandiso.

Underfill epoxy zvakare inodzivirira kubva kune unyoro uye zvinosvibisa. Kupinda munyoro kunogona kutungamirira mukuora, kubuda kwemagetsi, uye kukura kwezvinhu zvinoitisa, zvichikonzera kusashanda zvakanaka kwemudziyo. Underfill epoxy inoita sechivharo, kuvhara nzvimbo dzisina njodzi uye kudzivirira hunyoro kupinda mupakeji. Inopawo dziviriro kubva kuguruva, tsvina, uye zvimwe zvinosvibisa zvinogona kukanganisa kushanda kwemagetsi kwe semiconductor chip. Nekuchengetedza chip uye kubatana kwayo, underfill epoxy inovimbisa kuvimbika kwenguva refu uye kushanda kwechigadzirwa.

Uyezve, underfilled epoxy inogonesa miniaturization mu semiconductor packaging. Nekugara kuri kudiwa kwezvidiki uye zvakanyanya compact zvishandiso, underfilled epoxy inobvumira kushandisa flip-chip uye chip-scale yekurongedza nzira. Aya matekiniki anosanganisira kukwirisa zvakananga chip pane pasuru substrate, kubvisa kudiwa kwewaya yekubatanidza uye kuderedza saizi yepakeji. Underfill epoxy inopa tsigiro yezvimiro uye inochengetedza kutendeseka kweiyo chip-substrate interface, ichigonesa kuita kwakabudirira kweaya epamberi ekurongedza matekinoroji.

Sei Underfill Epoxy Inogadzirisa Matambudziko

Semiconductor packaging inoita basa rakakosha mukuita kwemagetsi mudziyo kuita, kuvimbika, uye hupenyu hurefu. Inosanganisira encapsulating Integrated circuits (ICs) mumakasi ekudzivirira, kupa magetsi ekubatanidza, uye kupisa kupisa kunogadzirwa panguva yekushanda. Nekudaro, semiconductor packaging inotarisana nematambudziko akati wandei, kusanganisira yekupisa kushushikana uye warpage, iyo inogona kukanganisa zvakanyanya kushanda uye kuvimbika kwemidziyo yakaputirwa.

Rimwe rematambudziko makuru kushushikana kwekushisa. Maseketi akabatanidzwa anogadzira kupisa panguva yekushanda, uye kusakwana kuparara kunogona kuwedzera tembiricha mukati mepakeji. Uku kusiyanisa kwetembiricha kunokonzeresa kushushikana kwekupisa sezvo zvinhu zvakasiyana mukati mepakeji zvinowedzera uye chibvumirano pamitengo yakasiyana. Iyo isiri-uniform yekuwedzera uye chibvumirano inogona kukonzera mechanical strain, zvichiita kuti solder joint kukundikana, delamination, uye makatsemuka. Thermal stress inogona kukanganisa kutendeseka kwemagetsi uye mechanical yepakeji, pakupedzisira kukanganisa kushanda uye kuvimbika kwechigadzirwa.

Warpage nderimwe dambudziko rakakosha mune semiconductor packaging. Warpage inoreva kukotama kana deformation yepakeji substrate kana pasuru yese. Inogona kuitika panguva yekurongedza kana nekuda kwekushushikana kwekupisa. Warpage inonyanya kukonzerwa nekusawirirana mune coefficient of thermal expansion (CTE) pakati pezvinhu zvakasiyana mupakeji. Semuenzaniso, iyo CTE yesilicon kufa, substrate, uye mold compound inogona kusiyana zvakanyanya. Kana ichiiswa mukushanduka kwekushisa, zvinhu izvi zvinowedzera kana chibvumirano pamitengo yakasiyana, zvichitungamira kune warpage.

Warpage inokonzeresa akati wandei matambudziko kune semiconductor mapakeji:

1. Zvinogona kukonzera kushushikana kwepfungwa, kuwedzera mukana wekutadza kwemakanika uye kuderedza kuvimbika kwebhokisi.
2. Warpage inogona kutungamirira kumatambudziko mumusangano wegungano, sezvo inokanganisa kurongeka kwepakeji nezvimwe zvikamu, zvakadai sebhodhi rakadhindwa redunhu (PCB). Iyi misalignment inogona kukanganisa kubatanidza magetsi uye kukonzera nyaya dzekuita.
3. Warpage inogona kukanganisa iyo yakazara fomu yepakeji, zvichiita kuti zviome kubatanidza chishandiso kuita diki fomu factor application kana maPCB ane vanhu vakawanda.

Maitiro akasiyana-siyana uye mazano anoshandiswa mu semiconductor packaging kugadzirisa matambudziko aya. Izvi zvinosanganisira kushandisa zvigadzirwa zvepamberi zvine maCTE anoenderana kuderedza kushushikana kwekupisa uye warpage. Thermo-mechanical simulations uye modeling inoitwa kufanotaura maitiro epakeji pasi pemamiriro akasiyana ekupisa. Magadzirirwo edhizaini, sekuunza zvimiro zvekuyamura uye magadzirirwo akakwenenzverwa, anoitwa kudzikisa kushushikana kwekupisa uye warpage. Pamusoro pezvo, kuvandudzwa kwemaitiro ekugadzira uye michina inobatsira kuderedza kuitika kwewarpage panguva yekuungana.

Zvakanakira zve Underfill Epoxy

Underfill epoxy chinhu chakakosha mune semiconductor packaging inopa akati wandei mabhenefiti. Iyi yakasarudzika epoxy zvinhu inoiswa pakati pe semiconductor chip uye pasuru substrate, ichipa kusimbiswa kwemakanika uye kugadzirisa matambudziko akasiyana. Heano mamwe emabhenefiti akakosha e underfilled epoxy:

1. Yakavandudzwa Mechanical Kuvimbika: Imwe yemabhenefiti ekutanga epoxy underfill kugona kwayo kukwidziridza kuvimbika kwemakanika kwema semiconductor mapakeji. Underfill epoxy inogadzira chisungo chakabatana chinonatsiridza hunhu hwese hwese nekuzadza mapundu uye voids pakati pechip uye substrate. Izvi zvinobatsira kudzivirira pasuru yehondo, inoderedza njodzi yekutadza kwemakanika, uye inosimudzira kuramba kushushikana kwekunze senge vibrations, kudedera, uye kupisa bhasikoro. Iyo yakagadziridzwa mechanical kuvimbika inotungamira kune yakawedzera chigadzirwa kusimba uye hupenyu hurefu hwechigadzirwa.
2. Thermal Stress Dissipation: Underfill epoxy inobatsira kubvisa kushushikana kwekupisa mukati mepakeji. Masekete akabatanidzwa anogadzira kupisa panguva yekushanda, uye kusakwana kuparara kunogona kukonzera kusiyana kwekushisa mukati memudziyo. Iyo underfill epoxy material, ine yakaderera coefficient yekuwedzera kwemafuta (CTE) ichienzaniswa nechip uye substrate zvinhu, inoita senge buffer layer. Iyo inotora iyo mechanic dhizaini inokonzerwa nekupisa kushushikana, ichidzikisa njodzi yekutadza kwemajoini, delamination, uye kuputika. Nekubvisa kushushikana kwekupisa, underfilled epoxy inobatsira kuchengetedza pasuru yemagetsi uye mekiniki kuperera.
3. Kuwedzeredzwa KweMagetsi Kushanda: Underfill epoxy zvakanaka inokanganisa mashandiro emagetsi emidziyo yesemiconductor. Iyo epoxy zvinhu inozadza mikaha pakati pechip uye substrate, ichideredza parasitic capacitance uye inductance. Izvi zvinoguma nekuvandudzwa kwechiratidzo chekutendeseka, kuderedzwa kwechiratidzo kurasikirwa, uye kuwedzeredzwa kwemagetsi ekubatanidza pakati pechip uye yese pasuru. Iyo yakaderedzwa parasitic mhedzisiro inobatsira pakuita zvirinani magetsi, huwandu hwekufambisa data, uye kuwedzera kuvimbika kwechishandiso. Pamusoro pezvo, underfilled epoxy inopa insulation uye dziviriro kubva kune hunyoro, zvinosvibisa, uye zvimwe zvakatipoteredza zvinogona kukanganisa kushanda kwemagetsi.
4. Stress Relief uye Yakavandudzwa Gungano: Underfill epoxy inoita senzira yekuyamura kunetseka panguva yegungano. Iyo epoxy zvinhu inotsiva iyo CTE mismatch pakati pe chip uye substrate, ichideredza kushushikana kwemagetsi panguva yekushanduka kwekushisa. Izvi zvinoita kuti chirongwa chegungano chive chakavimbika uye chinoshanda, kuderedza njodzi yekukuvadzwa kwepakeji kana kusarongeka. Iyo inodzorwa yekushushikana yekugovera yakapihwa underfill epoxy inobatsirawo kuve nechokwadi kurongeka kwakaringana nezvimwe zvikamu pane yakadhindwa redunhu bhodhi (PCB) uye inovandudza goho regungano rose.
5. Miniaturization uye Form Factor Optimization: Underfill epoxy inogonesa iyo miniaturization yemasemiconductor mapakeji uye optimization yefomu chinhu. Nekupa kusimbaradza kwemaitiro uye kuzorora kwekushushikana, underfill epoxy inobvumira kugadzira nekugadzira zvidiki, zvitete, uye zvakawanda compact mapakeji. Izvi zvinonyanya kukosha kune maapplication akadai senge nharembozha uye zvinopfekeka zvemagetsi, uko nzvimbo iri pamubhadharo. Iko kugona kukwirisa fomu zvinhu uye kuwana yakakwirira chikamu densities kunopa kune yakawedzera yepamusoro uye inovandudza zvigadzirwa zvemagetsi.

Mhando dzeUnderfill Epoxy

Mhando dzinoverengeka dze underfill epoxy formulations anowanikwa mune semiconductor packaging, imwe neimwe yakagadzirirwa kusangana nezvinodiwa uye kugadzirisa matambudziko akasiyana. Heano mamwe anowanzo shandiswa marudzi e underfill epoxy:

1. Capillary Underfill Epoxy: Capillary underfill epoxy ndiyo yakajairika uye inoshandiswa zvakanyanya mhando. Iyo yakaderera-viscosity epoxy inoyerera ichipinda pakati pechip uye substrate kuburikidza necapillary chiito. Capillary underfill inowanzoiswa pamupendero wechip, uye sezvo pasuru ichipisa, epoxy inoyerera pasi pechip, ichizadza voids. Iri rudzi rwe underfill rwakakodzerwa nemapakeji ane madiki madiki uye inopa yakanaka mechanical reinforcement.
2. No-Flow Underfill Epoxy: No-flow underfill epoxy is high-viscosity formulation isingayerere panguva yekurapa. Inoshandiswa senge pre-applied epoxy kana sefirimu pakati pe chip ne substrate. Kwete-kuyerera underfill epoxy inonyanya kubatsira kune flip-chip mapakeji, uko solder bumps inopindirana neiyo substrate. Inobvisa kudiwa kwekuyerera kwecapillary uye inoderedza njodzi yekukuvara kwejoint solder panguva yekuungana.
3. Wafer-Level Underfill (WLU): Wafer-level underfill is underfill epoxy inoiswa pawafer level isati yaiswa machipisi ega. Zvinosanganisira kuparadzira iyo underfill zvinhu pamusoro pese wafer pamusoro uye nekuirapa. Wafer-level underfill inopa akati wandei mabhenefiti, anosanganisira yunifomu underfill kufukidzwa, yakaderedzwa nguva yegungano, uye yakagadziridzwa maitiro ekutonga. Inowanzoshandiswa pakugadzirwa kwepamusoro-soro yezvigadzirwa zviduku-diki.
4. Molded Underfill (MUF): Molded underfill is an underfill epoxy inoshandiswa panguva ye encapsulation molding. Iyo underfill zvinhu inopihwa pane substrate, uye ipapo iyo chip uye substrate inoputirwa mumubatanidzwa wekuumbwa. Munguva yekuumbwa, iyo epoxy inoyerera uye inozadza mukaha pakati pe chip uye substrate, ichipa underfill uye encapsulation mune imwe nhanho. Molded underfill inopa yakanakisa mechaniki yekusimbisa uye inorerutsa maitiro egungano.
5. Non-Conductive Underfill (NCF): Non-conductive underfill epoxy yakanyatsogadzirwa kuti ipe magetsi ega ega pakati peanotengeswa majoini pane chip uye substrate. Iine insulating fillers kana additives inodzivirira conductivity yemagetsi. NCF inoshandiswa mumashandisirwo apo kushomeka kwemagetsi pakati pemajoini epadhuze ekutengesa kunonetsa. Inopa zvose mechanical reinforcement uye magetsi ega ega.
6. Thermally Conductive Underfill (TCU): Thermally conductive underfill epoxy yakagadzirirwa kusimudzira kupisa kwekupisa kugona kwepakeji. Iyo ine thermally conductive mafirita, akadai seceramic kana simbi zvimedu, izvo zvinovandudza kupisa kwekupisa kweiyo underfill zvinhu. TCU inoshandiswa muzvishandiso uko kufambiswa kwekushisa kwakakosha kwakakosha, senge midziyo ine simba repamusoro kana izvo zvinoshanda munzvimbo dzinopisa.

Iyi ingori mienzaniso mishoma yemhando dzakasiyana dze underfill epoxy inoshandiswa mu semiconductor packaging. Kusarudzwa kweiyo yakakodzera underfill epoxy kunoenderana nezvinhu zvakaita sepakeji dhizaini, maitiro egungano, zvinodikanwa zvekupisa, uye kufunga kwemagetsi. Imwe neimwe underfill epoxy inopa chaiwo mabhenefiti uye akarongedzerwa kusangana neakasarudzika zvinodiwa zveakasiyana maapplication.

Capillary Underfill: Low Viscosity uye High Kuvimbika

Capillary underfill inoreva maitiro anoshandiswa muindasitiri yekurongedza semiconductor kuwedzera kuvimbika kwemidziyo yemagetsi. Zvinosanganisira kuzadza mapeji pakati pemicroelectronic chip uye pasuru yayo yakatenderedza ine yakaderera-viscosity mvura zvinhu, kazhinji epoxy-based resin. Iyi underfill zvinhu inopa tsigiro yechimiro, inovandudza kupisa kwemafuta, uye inodzivirira chip kubva kumakanika kushushikana, hunyoro, uye zvimwe zvakatipoteredza zvinhu.

Imwe yeakakosha maitiro ecapillary underfill ndeye yakaderera viscosity. Iyo underfill material inogadzirwa kuti ive nedensity yakadzikira, ichibvumira kuti iyerere nyore mumigero yakamanikana pakati pechip uye pasuru panguva yekuzadza pasi. Izvi zvinogonesa kuti iyo underfill material inogona kunyatsopinda uye kuzadza ese mavhodhi nemhepo mapundu, kuderedza njodzi yekuumbwa isina chinhu uye nekuvandudza kutendeseka kwese kweiyo chip-package interface.

Low-viscosity capillary underfill zvinhu zvinopawo akati wandei mabhenefiti. Chekutanga, ivo vanofambisa kuyerera kwakanaka kwezvinhu pasi pe chip, izvo zvinotungamira kuderedzwa kwekuita nguva uye kuwedzera kwekugadzirwa kwekugadzira. Izvi zvinonyanya kukosha munzvimbo dzekugadzirwa kwepamusoro-soro uko nguva nemutengo wemari zvakakosha.

Kechipiri, iyo yakaderera viscosity inogonesa zvirinani wetting uye adhesion zvivakwa zve underfill zvinhu. Inobvumira kuti zvinhu zvipararire zvakaenzana uye zvigadzire zvisungo zvakasimba ne chip uye pasuru, zvichigadzira yakavimbika uye yakasimba encapsulation. Izvi zvinoita kuti chip ichi chengetedzwe zvakachengeteka kubva kumakanika zvinonetsa senge thermal cycling, shocks, uye vibrations.

Chimwe chinhu chakakosha checapillary underfills kuvimbika kwavo kwepamusoro. Iyo yakaderera-viscosity underfill zvinhu yakanyatso kugadzirwa kuti iratidze yakanakisa kupisa kugadzikana, magetsi ekudzivirira zvivakwa, uye kuramba hunyoro nemakemikari. Aya maitiro akakosha pakuona kuti akaiswa mumidziyo yemagetsi 'yenguva refu uye kuvimbika, kunyanya mukuda maapplication akadai semotokari, aerospace, uye nharembozha.

Zvakare, capillary underfill zvinhu zvakagadzirirwa kuve nepamusoro mechanicha simba uye yakanakisa kunamatira kune akasiyana substrate zvinhu, zvinosanganisira simbi, ceramics, uye organic zvinhu zvinowanzo shandiswa semiconductor packaging. Izvi zvinogonesa iyo underfill zvinhu kuita senge bhafa yekushushikana, inonyatso kunwisa uye kubvisa ma mechanic stress inogadzirwa panguva yekushanda kana kuratidzwa kwezvakatipoteredza.

 

No-Flow Underfill: Kuzvipa uye Kupfuura Kwepamusoro

Kwete-kuyerera underfill yakasarudzika maitiro anoshandiswa mune semiconductor yekurongedza indasitiri kusimudzira kuvimbika uye kugona kwemidziyo yemagetsi. Kusiyana necapillary underfills, iyo inotsamira pane yakaderera-viscosity zvinhu 'kuyerera, hapana-kuyerera underfills anoshandisa nzira yekuzvipa yega ine yakakwirira-viscosity zvinhu. Iyi nzira inopa mabhenefiti akati wandei, anosanganisira kuzvigadzirisa, kukwirira kwepamusoro, uye kuvimbika kwakavandudzwa.

Chimwe chezvinhu zvakakosha zve-no-flow underfill kugona kwayo kuzvipa. Iyo underfill material inoshandiswa mukuita uku inogadzirwa nepamusoro viscosity, iyo inodzivirira kuti irege kuyerera zvakasununguka. Panzvimbo iyoyo, iyo underfill zvinhu inopihwa pane chip-package interface nenzira inodzorwa. Iyi inodzorwa kugovera inogonesa kunyatsoiswa kweiyo underfill zvinhu, kuve nechokwadi kuti inoshandiswa chete kune dzinodiwa nzvimbo pasina kufashukira kana kupararira zvisingadzoreki.

Iyo yekuzvipa yega yega ye-no-flow underfill inopa akati wandei mabhenefiti. Chekutanga, inobvumira kuzvigadzirisa kweiyo underfill zvinhu. Sezvo iyo underfill ichigoverwa, inongozvigadzirisa pachayo ne chip uye package, ichizadza mapundu uye voids zvakafanana. Izvi zvinobvisa kudiwa kweiyo chaiyo yekumisikidzwa uye kurongeka kweiyo chip panguva yekuzadza pasi, kuchengetedza nguva uye kushanda nesimba mukugadzira.

Kechipiri, iyo yekuzvipa yega yega yeasina-kuyerera underfills inogonesa kukwira kwepamusoro mukugadzira. Maitiro ekuparadzira anogona kuve otomatiki, achibvumira kukurumidza uye kunoenderana kushandiswa kweiyo underfill zvinhu mumachipi akawanda panguva imwe chete. Izvi zvinovandudza kugadzirwa kwese kwese uye kunoderedza mutengo wekugadzira, zvichiita kuti zvive zvakakosha kune yakakwirira-vhoriyamu yekugadzira nharaunda.

Uyezve, hapana-kuyerera underfill zvinhu zvakagadzirirwa kupa kuvimbika kwakanyanya. Iyo yakakwira-viscosity underfill zvinhu zvinopa yakagadziridzwa kuramba kune inopisa bhasikoro, mechaniki kushushikana, uye zvakatipoteredza zvinhu, kuve nechokwadi chekushanda kwenguva refu kwezvishandiso zvemagetsi zvakaputirwa. Izvo zvinhu zvinoratidzira zvakanakisa kugadzikana kwemafuta, magetsi ekudzivirira zvivakwa, uye kuramba hunyoro nemakemikari, zvichipa kuvimbika kwese kwemidziyo.

Pamusoro pezvo, iyo yakakwira-viscosity underfill zvinhu zvinoshandiswa mukusa-kuyerera underfill zvakawedzera simba remagetsi uye adhesion zvivakwa. Ivo vanogadzira zvisungo zvakasimba ne chip uye pasuru, zvinonyatso kunwisa uye kubvisa madhiraivha emagetsi anogadzirwa panguva yekushanda kana kuratidzwa kwezvakatipoteredza. Izvi zvinobatsira kuchengetedza chip kubva pakukuvara kunogona kuitika uye inosimudzira kuramba kwechishandiso kune zvekuvhunduka kwekunze uye vibrations.

Molded Underfill: Kudzivirirwa Kwepamusoro uye Kubatanidzwa

Molded underfill inzira yepamberi inoshandiswa muindasitiri yekurongedza semiconductor kupa yakakwira mazinga ekudzivirira uye kubatanidzwa kwemidziyo yemagetsi. Zvinosanganisira kuvhara iyo chip yese uye pasuru yayo yakatenderedza ine mold compound inosanganisira underfill material. Iyi nzira inopa zvakakosha zvakakosha maererano nekuchengetedzwa, kubatanidzwa, uye kuvimbika kwese.

Imwe yemabhenefiti akakosha eakaumbwa underfill kugona kwayo kupa yakazara dziviriro yechip. Mushonga unoshandiswa mukuita uku unoshanda sechivharidzo chakasimba, uchivharira chip yese uye pasuru mugoko rekudzivirira. Izvi zvinopa dziviriro inoshanda kubva kune zvakatipoteredza zvinhu zvakaita sehunyoro, guruva, uye zvinosvibisa zvinogona kukanganisa mashandiro uye kuvimbika kwechishandiso. Iyo encapsulation inobatsirawo kudzivirira chip kubva kumagetsi kushushikana, kupisa bhasikoro, uye mamwe masimba ekunze, kuve nechokwadi chekugara kwayo kwenguva refu.

Pamusoro pezvo, yakaumbwa underfill inogonesa yakakwirira yekubatanidza mazinga mukati me semiconductor package. Iyo underfill zvinhu inosanganiswa yakananga mukomboni ye mold, ichibvumira kusanganisa kusanganisa kweiyo underfill uye encapsulation maitiro. Kubatanidzwa uku kunobvisa kudiwa kwedanho rakasiyana rekuzadza pasi, kurerutsa maitiro ekugadzira uye kuderedza nguva yekugadzira uye mutengo. Iyo zvakare inova nechokwadi chakafanana uye chakafanana underfill kugovera mukati mepakeji, kuderedza voids uye kusimbisa iyo yakazara chimiro kutendeseka.

Zvakare, yakaumbwa underfill inopa yakanakisa thermal dissipation zvivakwa. Iyo mold compound yakagadzirirwa kuve nepamusoro yekupisa conductivity, ichiibvumira kutamisa kupisa kure nechip zvakanaka. Izvi zvakakosha pakuchengetedza tembiricha yakakwana yekushandisa yechishandiso uye kudzivirira kupisa, izvo zvinogona kutungamira mukuderera kwekuita uye nyaya dzekuvimbika. Iyo yakakwidziridzwa yekupisa yekupisa zvimiro zveyakaumbwa underfill inobatsira pakuvimbika kwese uye hupenyu hurefu hwechigadzirwa chemagetsi.

Uyezve, yakaumbwa underfill inogonesa yakawanda miniaturization uye fomu factor optimization. Iyo encapsulation process inogona kugadzirwa kuti igare akasiyana epasuru masaizi uye maumbirwo, kusanganisira yakaoma 3D zvimiro. Uku kuchinjika kunobvumira kubatanidza akawanda machipi uye zvimwe zvikamu mu compact, nzvimbo-inoshanda pasuru. Iko kugona kuwana mazinga epamusoro ekubatanidza pasina kukanganisa kuvimbika kunoita kuti yakaumbwa isazadzike zvakanyanya kukosha mumashandisirwo uko saizi uye huremu zvinomanikidza zvakakosha, senge nharembozha, zvinopfekeka, uye zvemagetsi zvemotokari.

Chip Scale Package (CSP) Underfill: Miniaturization uye High Density

Chip Scale Package (CSP) underfill ndiyo yakakosha tekinoroji inogonesa miniaturization uye yakakwirira-density yemagetsi mudziyo kubatanidzwa. Sezvo michina yemagetsi ichiramba ichidzikira muhukuru ichipa kuwedzera kushanda, CSP inozadzisa basa rakakosha mukuona kuvimbika uye kuita kweaya macompact midziyo.

CSP tekinoroji yekurongedza inobvumira iyo semiconductor chip kuti igadzirwe zvakananga pane substrate kana yakadhindwa redunhu bhodhi (PCB) pasina kuda imwe pasuru. Izvi zvinobvisa kudiwa kwepurasitiki yechinyakare kana chigadziko checeramic, kudzikisa huwandu hwese uye huremu hwechishandiso. CSP inozadza maitiro ekuti mvura kana encapsulant zvinhu zvinoshandiswa kuzadza gaka riri pakati pechip uye substrate, ichipa tsigiro yemuchina uye kuchengetedza chip kubva kune zvakatipoteredza zvinhu senge unyoro uye mekiniki kusagadzikana.

Miniaturization inowanikwa kuburikidza neCSP underfill nekudzikisa chinhambwe pakati pechip uye substrate. Iyo underfill zvinhu inozadza mukaha wakatetepa pakati pechip uye substrate, ichigadzira chisungo chakasimba uye inovandudza kugadzikana kwemichina yechip. Izvi zvinobvumira zvidiki uye zvitete zvishandiso, zvichiita kuti zvikwanise kurongedza mashandiro akawanda munzvimbo shoma.

High-density yekubatanidza ndeimwe mukana weCSP underfill. Nekubvisa kudiwa kwepasuru yakaparadzana, CSP inogonesa chip kuti igadzirwe padyo nezvimwe zvikamu paPCB, kuderedza kureba kwekubatanidza magetsi nekuvandudza kutendeseka kwechiratidzo. Iyo underfill zvinhu zvakare inoshanda seyekupisa conductor, inonyatso bvisa kupisa kunogadzirwa nechip. Uku kugona kwekutonga kwemafuta kunobvumira kusimba kwesimba repamusoro, zvichiita kuti kubatanidzwa kweakanyanya kuoma uye ane simba machipisi mumidziyo yemagetsi.

CSP underfill zvinhu zvinofanirwa kuve nehunhu chaihwo hwekusangana nezvinodiwa zveminiaturization uye yakakwirira-density yekubatanidza. Ivo vanofanirwa kuve neakaderera viscosity kuti vafambise kuzadzwa kweakamanikana, pamwe neakanakisa kuyerera zvivakwa kuti ave nechokwadi chekufukidzwa kweyunifomu uye kubvisa voids. Izvo zvinhu zvinofanirwawo kuve nekunamatira kwakanaka kune chip uye substrate, ichipa yakasimba mechanical rutsigiro. Pamusoro pezvo, ivo vanofanirwa kuratidza yakakwira yekupisa conductivity kuendesa kupisa kure kubva kune chip zvakanaka.

Wafer-Level CSP Underfill: Mutengo-Unoshanda uye Wepamusoro-soro

Wafer-level chip scale package (WLCSP) underfill inzira inodhura uye ine goho rekurongedza inopa zvakati wandei zvakanakira mukugadzira uye kunaka kwechigadzirwa. WLCSP underfill inoshandisa underfill material kumachipi akawanda panguva imwe chete ichiri muwafer form isati yaiswa mumapakeji ega ega. Iyi nzira inopa mabhenefiti akawanda maererano nekuderedza mutengo, kuvandudzwa kwemaitiro ekugadzirisa, uye nepamusoro pegoho rekugadzira.

Imwe yemabhenefiti akakosha eWLCSP underfill ndeyekudhura-kushanda. Kushandisa iyo underfill zvinhu padanho rewafer kunoita kuti maitiro ekurongedza awedzere kurongeka uye anoshanda. Iyo isina kuzara zvinhu inopihwa pawafer uchishandisa inodzorwa uye otomatiki maitiro, kuderedza marara emidziyo uye kuderedza mutengo wevashandi. Pamusoro pezvo, kubvisa ega ega ega kubata uye kurongeka nhanho kunoderedza iyo yakazara nguva yekugadzira uye kuoma, zvichikonzera kuchengetwa kwemutengo uchienzaniswa nemaitiro echinyakare ekurongedza.

Uyezve, WLCSP underfill inopa yakagadziridzwa maitiro ekutonga uye yakakwirira kugadzirwa goho. Sezvo iyo underfill zvinhu ichiiswa padanho rewafer, inogonesa kutonga kurinani pamusoro pemaitiro ekuparadzira, kuve nechokwadi chisingachinjiki uye yunifomu yekuzadza pasi yekuvhara yega yega chip pawafer. Izvi zvinoderedza njodzi yevoids kana isina kukwana underfill, izvo zvinogona kutungamirira kuzvinhu zvekuvimbika. Iko kugona kuongorora uye kuyedza iyo underfill hunhu padanho rewafer zvakare inobvumira kukurumidza kuonekwa kwehurema kana kuita shanduko, kugonesa zviito zvekugadzirisa panguva uye kuderedza mukana wemapakeji asina kunaka. Nekuda kweizvozvo, WLCSP underfill inobatsira kuwana goho repamusoro rekugadzira uye zvirinani zvemhando yechigadzirwa.

Iyo wafer-level maitiro zvakare inogonesa kuvandudzwa kwekupisa uye mechini kuita. Iyo underfill material inoshandiswa muWLCSP inenge yakadzikira-viscosity, capillary-flowing material inogona kunyatsozadza maburi matete pakati pemachipisi newafer. Izvi zvinopa tsigiro yakasimba yemakina kumachipi, ichiwedzera kuramba kwavo kumichina kusagadzikana, vibrations, uye tembiricha bhasikoro. Pamusoro pezvo, iyo underfill material inoshanda senge thermal conductor, kufambisa kupera kwekupisa kunogadzirwa nemachipisi, nekudaro kunatsiridza kutungamira kwekupisa uye kuderedza njodzi yekupisa.

Flip Chip Underfill: High I/O Density uye Performance

Flip chip underfill tekinoroji yakakosha inogonesa kupinza kwepamusoro / kubuda (I/O) density uye kuita kwakasarudzika mumidziyo yemagetsi. Inoita basa rakakosha mukusimudzira kuvimbika uye kushanda kweflip-chip packaging, iyo inoshandiswa zvakanyanya mumhando yepamusoro semiconductor application. Ichi chinyorwa chichaongorora kukosha kweflip chip underfill uye maitiro ayo pakuwana yakakwira I/O density nekuita.

Flip chip tekinoroji inosanganisira yakananga magetsi yekubatanidza yedunhu rakasanganiswa (IC) kana semiconductor inofa kune substrate, ichibvisa kudiwa kwewaya bonding. Izvi zvinoguma mune imwe compact uye inoshanda pasuru, sezvo maI/O pads ari pazasi pekufa. Nekudaro, flip-chip kurongedza inopa akasarudzika matambudziko anofanirwa kugadziriswa kuti ave nechokwadi chekuita kwakakwana uye kuvimbika.

Imwe yematambudziko akanyanya muflip chip kurongedza ndeye kudzivirira mechaniki kusagadzikana uye kupisa kusawirirana pakati pekufa uye substrate. Munguva yekugadzira uye kushanda kunotevera, kusiyana kwe coefficients yekuwedzera kwekushisa (CTE) pakati pekufa uye substrate kunogona kukonzera kushushikana kukuru, zvichiita kuti kuderedzwa kwekushanda kana kunyange kukundikana. Flip chip underfill chinhu chinodzivirira chinoputira chip, chichipa tsigiro yemuchina uye kuzorodza kushushikana. Iyo inogovera zvinobudirira zvinonetsa zvinogadzirwa panguva yekupisa bhasikoro uye zvinozvidzivirira kubva pakukanganisa hukama hwakatetema.

Yakakwira I/O density yakakosha mumidziyo yemagetsi yemazuva ano, uko madiki emafomu maficha uye kuwedzera kushanda kwakakosha. Flip chip underfill inogonesa yakakwira I/O densities nekupa epamusoro magetsi ekudzivirira uye nekugona kutonga kwemafuta. Iyo underfill zvinhu inozadza mukaha pakati pekufa uye substrate, ichigadzira yakasimba interface uye kuderedza njodzi yemapfupi maseketi kana kubuda kwemagetsi. Izvi zvinobvumira nzvimbo yepedyo yeI/O pads, zvichikonzera kuwedzera I/O density pasina kupa kuvimbika.

Uyezve, flip chip underfill inobatsira kuvandudza kushanda kwemagetsi. Iyo inoderedza maparasitiki emagetsi pakati pekufa uye substrate, kuderedza kunonoka kwechiratidzo uye kuwedzera chiratidzo chekuvimbika. Iyo underfill zvinhu zvakare inoratidza yakanakisa yekupisa conductivity zvivakwa, zvinonyatso bvisa kupisa kunogadzirwa nechip panguva yekushanda. Kubudirira kwekupisa kupisa kunoita kuti kutonhora kurambe kuri mukati memiganhu inogamuchirwa, kudzivirira kupisa uye kuchengetedza kushanda kwakakwana.

Kufambira mberi kweflip chip underfill zvinhu kwakagonesa kunyange yakakwira I/O densities uye mazinga ekuita. Nanocomposite underfills, semuenzaniso, wedzera nanoscale mafirita kuti uwedzere kupisa conductivity uye simba remuchina. Izvi zvinobvumira kuvandudzwa kwekupisa uye kuvimbika, zvichiita kuti zvigadziriswe zvepamusoro.

Ball Grid Array (BGA) Underfill: High Thermal uye Mechanical Performance

Bhora Grid Array (BGA) inozadza tekinoroji yakakosha inopa yakanyanya kupisa uye mechaniki kuita mumidziyo yemagetsi. Inoita basa rakakosha mukusimudzira kuvimbika uye kushanda kweBGA mapakeji, ayo anoshandiswa zvakanyanya mumashandisirwo akasiyana siyana. Muchinyorwa chino, isu tichaongorora kukosha kweBGA underfill uye mabatiro ayo pakuwana yakakwira yekupisa uye mashandiro emuchina.

BGA tekinoroji inosanganisira pasuru dhizaini apo iyo yakabatanidzwa yedunhu (IC) kana semiconductor inofa yakagadzikwa pane substrate, uye magetsi ekubatanidza anogadzirwa kuburikidza nemhando dzakasiyana dzemabhora anotengeswa ari pasi pepasi pepakeji. BGA inozadza zvinhu zvakagoverwa mumukana pakati pekufa uye substrate, inovhara mabhora ekutengesa uye inopa tsigiro yemagetsi uye kudzivirira kugungano.

Rimwe rematambudziko akanyanya muBGA kurongedza ndiko manejimendi ekupisa kwekushushikana. Panguva yekushanda, IC inogadzira kupisa, uye kuwedzera kwekushisa uye kuderera kunogona kukonzera kudzvinyirira kukuru pamajoini ekutengesa anobatanidza kufa uye substrate. BGA inozadzisa basa rakakosha mukudzikamisa kushushikana uku nekugadzira chisungo chakasimba nekufa uye substrate. Inoita senge bhafa yekushushikana, inotora kuwedzera kwekupisa uye kuputika uye kuderedza kunetsa pamajoini ekutengesa. Izvi zvinobatsira kuvandudza kuvimbika kwepakeji uye kuderedza njodzi yekutadza kwejoints.

Chimwe chinhu chakakosha cheBGA underfill kugona kwayo kusimudzira mashandiro emuchina wepakeji. BGA mapakeji anowanzo kuisirwa kushushikana kwemagetsi panguva yekubata, kusangana, uye kushanda. Iyo underfill zvinhu inozadza mukaha pakati pekufa uye substrate, ichipa tsigiro yechimiro uye kusimbiswa kune masolder majoini. Izvi zvinovandudza simba rose remuchina wegungano, zvichiita kuti rirambe richishingirira kumakanika kuvhunduka, kutenheka, uye mamwe masimba ekunze. Nekugovera zvinobudirira zvinonetsa zvemakanika, BGA underfill inobatsira kudzivirira kuparuka kwepakeji, delamination, kana kumwe kutadza kwemakanika.

High thermal performance yakakosha mumidziyo yemagetsi kuve nechokwadi chekushanda kwakakodzera uye kuvimbika. BGA underfill zvinhu zvakagadzirirwa kuve nemhando yepamusoro yekupisa conductivity zvivakwa. Izvi zvinovatendera kuti vakwanise kutamisa kupisa kure nekufa uye kuiparadzira kune iyo substrate, ichisimudzira iyo yakazara yekupisa kutonga kwepakeji. Kushanda kupisa kupisa kunobatsira kuchengetedza kuderera kwekushisa kwekushanda, kudzivirira hotspots yekupisa uye inogona kukanganisa kushanda. Iyo inobatsirawo kuhupenyu hurefu hwebhokisi nekuderedza zvikamu 'kushushikana kwekupisa.

Kufambira mberi muBGA underfill zvinhu kwakatungamira kune yakanyanya kupisa uye mechanic kuita. Magadzirirwo akavandudzwa uye zvinhu zvekuzadza, senge nanocomposites kana yakakwira thermal conductivity mafirita, yagonesa kupisa kurinani uye simba remagetsi, zvichiwedzera kusimudzira kushanda kweBGA mapakeji.

Quad Flat Package (QFP) Underfill: Yakakura I / O Kuverenga uye Kusimba

Quad Flat Package (QFP) idunhu rakasanganiswa (IC) rinoshandiswa zvakanyanya mumagetsi. Iyo inoratidzira sikweya kana rectangular chimiro ine mitungamiriri inotambanukira kubva kumativi mana, ichipa akawanda ekupinda/kubuda (I/O) anongedzo. Kuwedzera kuvimbika uye kusimba kweQFP mapakeji, underfill zvinhu zvinowanzo shandiswa.

Underfill chinhu chinodzivirira chinoshandiswa pakati peIC uye substrate kusimbisa simba remagetsi rezvibatanidza zvinotengesa uye kudzivirira kukanganisa-kunokonzera kukanganisa. Izvo zvakanyanya kukosha kune maQFP ane hombe I/O kuverenga, sezvo huwandu hwepamusoro hwekubatanidza hunogona kutungamira kune akakosha ma mechanic stress panguva yekupisa bhasikoro uye mamiriro ekushanda.

Iyo underfill zvinhu inoshandiswa pamapakeji eQFP inofanirwa kuve nehunhu chaihwo kuti ive nechokwadi chekusimba. Chekutanga, inofanirwa kunge iine yakanakisa kunamatira kune ese ari maviri IC uye substrate kugadzira chisungo chakasimba uye kuderedza njodzi yeku delamination kana kumisa. Uyezve, inofanira kunge iine yakaderera coefficient of thermal expansion (CTE) kuti ienderane neCTE yeIC uye substrate, kuderedza kushungurudzika kusawirirana kunogona kutungamirira kune kuputika kana kuputsika.

Uyezve, iyo underfill zvinhu zvinofanirwa kunge zvine yakanaka yekuyerera zvivakwa kuti ive nechokwadi chekufukidzira yunifomu uye kuzadza kwakazara kwegeji pakati peIC uye substrate. Izvi zvinobatsira mukubvisa voids, izvo zvinogona kunetesa majoini e solder uye zvichikonzera kuderera kwekuvimbika. Izvo zvinhu zvinofanirwa zvakare kuve neakanaka ekurapa zvimiro, zvichizvibvumira kuti igadzire yakasimba uye yakasimba yekudzivirira layer mushure mekushandisa.

Panyaya yekusimba kwemakanika, iyo underfill inofanirwa kuve neyakakwira shear uye kusvuura simba rekumira kunze kwemasimba uye kudzivirira pasuru deformation kana kupatsanura. Inofanirawo kuratidza kuramba kwakanaka kune unyoro uye zvimwe zvakatipoteredza kuti zvichengetedze zvimiro zvayo zvekudzivirira nekufamba kwenguva. Izvi zvinonyanya kukosha mumashandisirwo apo iyo QFP package inogona kuoneswa kune yakaoma mamiriro kana kusangana nekusiyana kwekushisa.

Yakasiyana-siyana underfill zvinhu zviripo kuti uwane aya anodiwa maitiro, kusanganisira epoxy-based formulations. Zvichienderana nezvinodiwa zvechishandiso, zvinhu izvi zvinogona kugoverwa uchishandisa hunyanzvi hwakasiyana, senge capillary kuyerera, jetting, kana kudhinda skrini.

System-in-Package (SiP) Underfill: Kubatanidzwa uye Kuita

System-in-Package (SiP) ndeyepamusoro yekurongedza tekinoroji inobatanidza akawanda semiconductor machipisi, passive components, uye zvimwe zvinhu mupakeji imwechete. SiP inopa akawanda mabhenefiti, anosanganisira yakaderedzwa fomu chinhu, yakagadziridzwa mashandiro emagetsi, uye nekuwedzera mashandiro. Kuve nechokwadi chekuvimbika uye kuita kweSiP magungano, underfill zvinhu zvinowanzoshandiswa.

Underfill muSiP zvikumbiro zvakakosha mukupa kugadzikana kwemakanika uye yekubatanidza magetsi pakati pezvakasiyana zvikamu mukati mepakeji. Inobatsira kuderedza dambudziko rekushungurudzika-kunokonzerwa nekukundikana, zvakadai sekutengesa majoini kuputika kana kuputsika, izvo zvinogona kuitika nekuda kwekusiyana kwekoefficients yekuwedzera kwekushisa (CTE) pakati pezvikamu.

Kubatanidza akawanda zvikamu muSiP package inotungamira kune yakaoma interconnectivity, ine akawanda solder majoini uye yakakwirira-density wedunhu. Underfill zvinhu zvinobatsira kusimbisa aya ekubatanidza, kuwedzera simba remakanika uye kuvimbika kwegungano. Vanotsigira majoini ekutengesa, kuderedza njodzi yekuneta kana kukuvadzwa kunokonzerwa nekupisa bhasikoro kana mechanical stress.

Panyaya yekushanda kwemagetsi, underfill zvinhu zvakakosha mukuvandudza kutendeseka kwechiratidzo uye kuderedza ruzha rwemagetsi. Nokuzadza mapeji pakati pezvikamu uye kuderedza chinhambwe chiri pakati pazvo, underfill inobatsira kuderedza parasitic capacitance uye inductance, zvichiita kuti kukurumidza uye kunyatsoshanda kwechiratidzo kutapurirana.

Pamusoro pezvo, zvigadziriso zvepasi zveSiP application zvinofanirwa kunge zvine yakanakisa yekupisa yekupisa yekubvisa kupisa kunogadzirwa neyakasanganiswa zvikamu zvakanaka. Kubudirira kupisa kupisa kwakakosha kudzivirira kupisa uye kuchengetedza kuvimbika kwese uye kushanda kweSiP musangano.

Underfill zvinhu muSiP kurongedza inofanirwa kunge iine chaiyo zvivakwa kuti isangane neizvi zvekubatanidza uye kuita zvinodiwa. Ivo vanofanirwa kuve nekuyerera kwakanaka kuti ive nechokwadi chekuvharika kwakazara uye kuzadza mapundu pakati pezvikamu. Iyo underfill zvinhu zvinofanirwa zvakare kuve neakadzika-viscosity kuumbwa kubvumira kugovera nyore uye kuzadza mumakomba madiki kana nzvimbo diki.

Uyezve, iyo underfill material inofanirwa kuratidza kunamatira kwakasimba kune dzakasiyana nzvimbo, kusanganisira semiconductor machipisi, substrates, uye passives, kuve nechokwadi chekubatana kwakavimbika. Inofanirwa kuenderana nezvinhu zvakasiyana-siyana zvekurongedza, senge organic substrates kana Ceramics, uye inoratidzira yakanaka mechanic zvivakwa, kusanganisira yakakwirira shear uye peel simba.

Iyo underfill zvinhu uye nzira yekushandisa sarudzo zvinoenderana neiyo chaiyo SiP dhizaini, chikamu chinodiwa, uye maitiro ekugadzira. Maitiro ekuparadzira akadai sekuyerera kwecapillary, jetting, kana nzira dzinobatsirwa nefirimu dzinowanzo shandisa underfill mumagungano eSiP.

Optoelectronics Underfill: Optical Alignment uye Dziviriro

Optoelectronics underfill inosanganisira encapsulating uye kudzivirira optoelectronic madivayiri uku uchiona chaiyo yekuona kurongeka. Optoelectronic zvishandiso, senge lasers, photodetectors, uye optical switches, kazhinji inoda kurongeka kwakatetepa kwezvikamu zvemaziso kuti uwane kuita kwakakwana. Panguva imwecheteyo, ivo vanofanirwa kuchengetedzwa kubva kune zvakatipoteredza izvo zvinogona kukanganisa mashandiro avo. Optoelectronics underfill inogadzirisa zvese izvi zvinodiwa nekupa kurongeka kwemaziso uye kudzivirira mune imwechete maitiro.

Optical alignment chinhu chakakosha chekugadzira optoelectronic mudziyo. Inosanganisira kuenzanisa zvinhu zvinoonekwa, senge fiber, waveguides, lenzi, kana gratings, kuve nechokwadi chekufambisa kwechiedza uye kugamuchirwa. Kurongeka chaiko kunodiwa kuti uwedzere kuita kwechishandiso uye kuchengetedza chiratidzo chekuvimbika. Nzira dzechinyakare dzekugadzirisa dzinosanganisira kurongeka kwemaoko uchishandisa kuongorora kwekuona kana kurongeka kwega uchishandisa matanho ekugadzirisa. Zvisinei, nzira idzi dzinogona kutora nguva, kushanda nesimba, uye dzinowanzokanganisa.

Optoelectronics inozadza mhinduro yekuvandudza nekubatanidza kurongeka maficha zvakananga mune underfill zvinhu. Underfill zvinhu zvinowanzoita mvura kana semi-mvura makomisheni anogona kuyerera uye kuzadza mapundu pakati pezvinhu zvemaziso. Nekuwedzera kurongeka maficha, senge microstructures kana fiducial mamaki, mukati meiyo underfill zvinhu, iyo yekumisikidza maitiro inogona kurerutswa uye otomatiki. Aya maficha anoshanda senge madhairekitori panguva yekuungana, kuve nechokwadi kurongeka chaiko kwezvikamu zvemaziso pasina kudikanwa kwemaitiro akaomarara ekumisikidza.

Mukuwedzera kune kurongeka kwemaziso, zvigadziriso zvepasi zvinodzivirira optoelectronic zvishandiso. Optoelectronic components anowanzo kuoneswa kune hutsinye nharaunda, kusanganisira tembiricha kuchinjika, mwando, uye mechanical stress. Izvi zvekunze zvinhu zvinogona kukanganisa kushanda uye kuvimbika kwemidziyo nekufamba kwenguva. Underfill zvinhu zvinoshanda sechidziviriro chinodzivirira, chinoputira zvinhu zvemaziso uye nekudzivirira kubva kune zvinosvibisa zvakatipoteredza. Ivo zvakare vanopa mechanical kusimbaradza, kuderedza njodzi yekukuvara nekuda kwekuvhunduka kana kudedera.

Underfill zvinhu zvinoshandiswa mune optoelectronics application zvinowanzo gadzirwa kuti ive yakaderera refractive index uye yakanakisa yekuona pachena. Izvi zvinovimbisa kukanganiswa kudiki nemasaini optical anopfuura nepamudziyo. Pamusoro pezvo, ivo vanoratidza kunamatira kwakanaka kune akasiyana substrates uye vane yakaderera thermal yekuwedzera coefficients kuderedza kushushikana kwechishandiso panguva yekupisa bhasikoro.

Iyo underfill process inosanganisira kuparadzira iyo underfill zvinhu pamudziyo, ichibvumira kuyerera uye kuzadza mapundu pakati pezvinhu zvemaziso, uye wobva wairapa kuti igadzire yakasimba encapsulation. Zvichienderana nechishandiso chaicho, iyo underfill material inogona kushandiswa uchishandisa hunyanzvi hwakasiyana, senge capillary flow, jet dispensing, kana kudhinda skrini. Iyo nzira yekurapa inogona kuwanikwa kuburikidza nekupisa, UV mwaranzi, kana zvese zviri zviviri.

Medical Electronics Underfill: Biocompatibility uye Kuvimbika

Zvemagetsi zvekurapa zvinozadzisa hurongwa hwakasarudzika hunosanganisira kuvhara nekudzivirira zvinhu zvemagetsi zvinoshandiswa mumidziyo yekurapa. Midziyo iyi inoita basa rakakosha mumashandisirwo akasiyana siyana ekurapa, akadai semidziyo inoisirwa, michina yekuongorora, masisitimu ekutarisa, uye masisitimu ekutumira zvinodhaka. Medical electronics underfill inotarisa pazvinhu zviviri zvakakosha: biocompatibility uye kuvimbika.

Biocompatibility chinhu chakakosha chinodiwa kumidziyo yekurapa inosangana nemuviri wemunhu. Iyo underfill zvinhu zvinoshandiswa mumagetsi ekurapa zvinofanirwa kuve biocompatible, zvichireva kuti hazvifanirwe kukonzera zvinokuvadza kana kuita kwakashata kana zvasangana nenyama mhenyu kana mvura yemuviri. Zvishandiso izvi zvinofanirwa kutevedzera mirau uye zviyero, senge ISO 10993, iyo inotsanangura biocompatibility kuyedzwa uye maitiro ekuongorora.

Underfill zvinhu zvemagetsi ekurapa zvinonyatsosarudzwa kana kuumbwa kuti ive nechokwadi chekuenderana. Izvo zvakagadzirirwa kuti zvive zvisina-chepfu, zvisingagumburi, uye kwete-allergenic. Zvinhu izvi hazvifanirwe kudonhedza chero zvinhu zvinokuvadza kana kushatisa nekufamba kwenguva, nekuti izvi zvinogona kutungamira mukukuvadzwa kwematishu kana kuzvimba. Biocompatible underfill zvinhu zvakare zvine yakaderera mvura yekunyudza kudzivirira kukura kwebhakitiriya kana fungi inogona kukonzera hutachiona.

Kuvimbika chimwe chinhu chakakosha chemagetsi ekurapa underfill. Zvishandiso zvekurapa zvinowanzosangana nemamiriro ekushanda akaoma, anosanganisira kupisa kwakanyanya, hunyoro, mvura dzemuviri, uye kushushikana kwemagetsi. Underfill zvinhu zvinofanirwa kuchengetedza zvikamu zvemagetsi, kuve nechokwadi chekuvimbika kwavo kwenguva refu uye kushanda. Kuvimbika kwakakosha mumashandisirwo ekurapa uko kutadza kwemudziyo kunogona kukanganisa zvakanyanya kuchengetedzeka kwemurwere uye kugara zvakanaka.

Underfill zvinhu zvemagetsi zvekurapa zvinofanirwa kuve nekupokana kwakanyanya kunyoro uye makemikari kuti amire kuratidzwa kumvura yemuviri kana sterilization maitiro. Ivo vanofanirwawo kuratidza kunamatira kwakanaka kune akasiyana substrates, kuve nechokwadi chekuchengetedza encapsulation yemagetsi zvikamu. Mechanical zvimiro, senge yakaderera coefficients yekuwedzera kwemafuta uye yakanaka kushomeka kuramba, yakakosha kudzikisa kushushikana pane iyo ruzivo panguva yekupisa bhasikoro kana kurodha otomatiki.

Iyo underfill process yemishonga yemagetsi inosanganisira:

• Kuparadzira underfill zvinhu pane zvemagetsi zvikamu.
• Kuzadza maburi.
• Kuirapa kuti igadzire inodzivirira uye yakagadzikana yakagadzikana encapsulation.

Kuchengetedza kunofanirwa kutorwa kuti ive nechokwadi chekuvharwa kwakakwana kwezvimiro uye kusavapo kwevoids kana mahomwe emhepo anogona kukanganisa kuvimbika kwemudziyo.

Uyezve, zvimwe zvinotariswa zvinotariswa kana uchizadza midziyo yekurapa. Semuyenzaniso, iyo underfill material inofanirwa kufambirana nemaitiro esterilization anoshandiswa pamudziyo. Zvimwe zvekushandisa zvinogona kuve nehanya kune chaiwo sterilization matekiniki, senge chiutsi, ethylene oxide, kana mwaranzi, uye zvimwe zvinhu zvingangoda kusarudzwa.

Aerospace Electronics Underfill: High Temperature uye Vibration Resistance

Zvemagetsi zvemuchadenga zvinozadza maitiro akasarudzika ekuputira nekudzivirira zvinhu zvemagetsi mune zvemuchadenga application. Nzvimbo dzemuchadenga dzinounza matambudziko akasiyana, anosanganisira tembiricha yakakwira, kuzunguzika kwakanyanya, uye kushushikana kwemagetsi. Naizvozvo, aerospace electronics underfill inotarisa pazvinhu zviviri zvakakosha: yakakwirira-tembiricha kuramba uye vibration kuramba.

Kupikisa kwepamusoro-tembiricha kwakakosha mumagetsi emuchadenga nekuda kwekukwirisa tembiricha inowanikwa panguva yekushanda. Iyo underfill zvinhu zvinoshandiswa muaerospace application zvinofanirwa kushingirira kudziya kwakanyanya pasina kukanganisa kuita uye kuvimbika kwezvikamu zvemagetsi. Dzinofanirwa kuratidza kuwedzera kudiki kwekupisa uye kuramba dzakatsiga pane yakakura tembiricha renji.

Underfill zvinhu zveaerospace zvemagetsi zvinosarudzwa kana kugadzirirwa yakakwirira girazi tembiricha yekuchinja (Tg) uye kugadzikana kwekupisa. Iyo yakakwira Tg inova nechokwadi chekuti zvinhu zvinochengeta zvigadziriso zvaro pamatembiricha akakwira, kudzivirira deformation kana kurasikirwa kwekunamatira. Zvinhu izvi zvinokwanisa kutsungirira tembiricha yakanyanyisa, senge panguva yekusimuka, kupindazve mumhepo, kana kushanda mumakamuri einjini inopisa.

Pamusoro pezvo, zvinhu zvinozadza pasi zvemagetsi zvemuchadenga zvinofanirwa kunge zvine yakaderera coefficients yekuwedzera kwekushisa (CTE). Iyo CTE inoyera kuti yakawanda sei chinhu chinowedzera kana zvibvumirano nekuchinja kwekushisa. Nekuva neCTE yakaderera, underfill zvinhu zvinogona kuderedza kushushikana pane zvemagetsi zvikamu zvinokonzerwa nekupisa bhasikoro, izvo zvinogona kukonzeresa kutadza kwemagetsi kana solder joint kuneta.

Vibration kuramba ndechimwe chakakosha chinodiwa kune aerospace yemagetsi underfill. Mota dzemuchadenga dziri pasi pekuzunguzika kwakasiyana siyana, kusanganisira injini, kundengendeka-kukonzeresa kubhururuka, uye kuvhunduka kwemagetsi panguva yekuvhurwa kana kumhara. Aya mavibrations anogona kukanganisa kushanda uye kuvimbika kwezvikamu zvemagetsi kana zvisina kuchengetedzwa zvakakwana.

Underfill zvinhu zvinoshandiswa muaerospace zvemagetsi zvinofanirwa kuratidza yakanakisa vibration-inonyorovesa zvivakwa. Vanofanira kutora uye kubvisa simba rinogadzirwa nekudengenyeka, kuderedza kushushikana uye kushungurudza pamagetsi emagetsi. Izvi zvinobatsira kudzivirira kuumbwa kwekutsemuka, kutsemuka, kana kumwe kutadza kwemuchina nekuda kwekunyanya kudengenyeka kuratidzwa.

Uyezve, zvinhu zvekuzadza pasi zvine kunamatira kwakanyanya uye kusimba kwakabatana zvinofarirwa mune aerospace application. Izvi zvivakwa zvinovimbisa kuti underfill zvinhu zvinoramba zvakasungwa zvakasimba kune zvemagetsi zvikamu uye substrate, kunyangwe pasi pemamiriro ekudengenyeka. Kunamatira kwakasimba kunodzivirira iyo underfill zvinhu kubva pakusvibisa kana kupatsanura kubva kune zvinhu, kuchengetedza kutendeseka kweiyo encapsulation uye kudzivirira kubva kune hunyoro kana marara ingress.

Iyo underfill process yeaerospace yemagetsi inowanzo sanganisira kuparadzira iyo underfill zvinhu pane zvemagetsi zvikamu, zvichibvumira kuti iyerere nekuzadza mapundu, uye nekuiporesa kuti igadzire yakasimba encapsulation. Iyo nzira yekurapa inogona kuitwa uchishandisa inopisa kana UV nzira dzekurapa, zvichienderana nezvinodiwa chaizvo zvekushandisa.

Thermal cycling kuramba ndechimwe chakakosha chinodiwa kune mota dzemagetsi underfill. Mota dzemotokari dzinogara dzichichinja tembiricha, kunyanya panguva yekutanga injini uye kushanda, uye idzi tembiricha dzinotenderera dzinogona kukonzeresa kushushikana kwemagetsi pazvinhu zvemagetsi uye zvakatenderedza underfill zvinhu. Iyo underfill zvinhu zvinoshandiswa mumotokari application zvinofanirwa kuve neakanakisa kupisa bhasikoro kuramba kutsungirira uku kushanduka kwetembiricha pasina kukanganisa kuita kwavo.

Underfill zvinhu zvemotokari zvemagetsi zvinofanirwa kunge zvine yakaderera thermal expansion (CTE) coefficients kuderedza kushushikana kwezvikamu zvemagetsi panguva yekupisa bhasikoro. A yakanyatsoenderana CTE pakati underfill zvinhu uye zvokubikisa anoderedza ngozi solder joint kuneta, kuputika, kana zvimwe mechanical kukundikana kunokonzerwa nokupisa kunetseka. Pamusoro pezvo, izvo zvepasi pasi zvinofanirwa kuratidza yakanaka yekupisa yekupisa kupisa zvakanaka, kudzivirira nzvimbo dzenzvimbo dzinogona kukanganisa kushanda uye kuvimbika kwezvikamu.

Zvakare, zvemagetsi zvemagetsi underfill zvinhu zvinofanirwa kuramba hunyoro, makemikari, uye zvinwiwa. Vanofanira kunge vane mvura yakaderera kunyura kudzivirira kukura kwe mold kana kuora kwezvinhu zvemagetsi. Kemikari kuramba inovimbisa kuti iyo underfill material inoramba yakagadzikana kana yakafumurwa kumvura dzemotokari, semafuta, mafuta, kana ekuchenesa, kudzivirira kuparara kana kurasikirwa kwekunamatira.

Iyo underfill maitiro emagetsi emotokari anowanzo sanganisira kuparadzira iyo underfill zvinhu pane zvemagetsi zvikamu, zvichibvumira kuti iyerere nekuzadza mapundu, uye nekuirapa kuti iite yakasimba encapsulation. Maitiro ekurapa anogona kuitwa kuburikidza nekupisa kana UV nzira dzekurapa, zvichienderana nezvinodiwa chaizvo zvekushandisa uye underfill zvinhu zvinoshandiswa.

Kusarudza Kurudyi Underfill Epoxy

Kusarudza iyo yakakodzera underfill epoxy isarudzo yakakosha mukusangana uye kuchengetedzwa kwemagetsi zvikamu. Underfill epoxies inopa kusimbiswa kwemagetsi, kutonga kwekupisa, uye kudzivirira kubva kune zvakatipoteredza zvinhu. Heano mamwe akakosha ekufunga kana uchisarudza yakakodzera underfill epoxy:

1. Thermal Properties: Rimwe remabasa ekutanga epoxy underfill ndeyekubvisa kupisa kunogadzirwa nemagetsi zvikamu. Naizvozvo, zvakakosha kufunga nezve epoxy's thermal conductivity uye kupisa kwekudzivirira. High thermal conductivity inobatsira kunyatsopisa kupisa, kudzivirira hotspots uye kuchengetedza chikamu chakavimbika. Iyo epoxy inofanirwawo kuve nekushomeka kwekushisa kwekudzivirira kuderedza kushushikana kwekushisa pane zvikamu panguva yekushisa bhasikoro.
2. CTE Match: The underfill epoxy's thermal expansion coefficient (CTE) inofanira kunyatsoenderana neCTE yemagetsi emagetsi uye substrate kuderedza kupisa kwemhepo uye kudzivirira solder joint kukundikana. CTE yakanyatsoenderana inobatsira kuderedza njodzi yekutadza kwemagetsi nekuda kwekupisa bhasikoro.
3. Kuyerera uye Gap-Kuzadza Mano: Iyo underfilled epoxy inofanira kuva yakanaka kuyerera hunhu uye kugona kuzadza mapundu pakati pezvikamu zvinobudirira. Izvi zvinogonesa kufukidzwa kwakazara uye kuderedza ma voids kana mahomwe emhepo anogona kukanganisa kugadzikana kwemichina yegungano uye kuita kwekupisa. Iyo viscosity ye epoxy inofanirwa kuve yakakodzera kune chaiyo application uye nzira yekubatanidza, ingave iri capillary flow, jet dispensing, kana screen printing.
4. Adhesion: Kunamatira kwakasimba kwakakosha kune underfilling epoxy kuti ive nechokwadi chekubatana pakati pezvikamu uye substrate. Inofanirwa kuratidza kunamatira kwakanaka kune akasiyana zvinhu, zvinosanganisira simbi, ceramics, uye mapurasitiki. Iyo epoxy's adhesion properties inobatsira kumusangano wekugadzirisa kutendeseka uye kuvimbika kwenguva refu.
5. Kurapa Nzira: Funga nezve nzira yekurapa inonyatsokodzera maitiro ako ekugadzira. Underfill epoxies inogona kurapwa kuburikidza nekupisa, UV mwaranzi, kana musanganiswa wezvose. Imwe neimwe nzira yekurapa ine zvakanakira uye zvinogumira, uye kusarudza iyo inoenderana nezvako zvekugadzira zvinodiwa kwakakosha.
6. Environmental Resistance: Ongorora iyo underfill epoxy kupokana kune zvakatipoteredza zvinhu zvakaita sehunyoro, makemikari, uye tembiricha yakanyanyisa. Iyo epoxy inofanira kukwanisa kumira kutarisana nemvura, kudzivirira kukura kwe mold kana corrosion. Kemikari kuramba inovimbisa kugadzikana kana yasangana nemvura yemotokari, maajenti ekuchenesa, kana zvimwe zvinogona kuita ngura. Pamusoro pezvo, iyo epoxy inofanirwa kuchengetedza mashandiro ayo emagetsi uye emagetsi pane yakakura tembiricha renji.
7. Kuvimbika uye Hurefu Hwehupenyu: Funga nezve underfill epoxy's track rekodhi uye kuvimbika data. Tarisa epoxy zvinhu zvakaedzwa uye zvakaratidzwa kuti zvinoshanda zvakanaka mumashandisirwo akafanana kana kuve nezvitupa zveindasitiri uye kutevedzera zvinoenderana nemitemo. Funga zvinhu zvakaita sehunhu hwekuchembera, kuvimbika kwenguva refu, uye kugona kwe epoxy kuchengetedza zvimiro zvayo nekufamba kwenguva.

Paunenge uchisarudza iyo chaiyo underfill epoxy, zvakakosha kuti utarise izvo chaizvo zvinodikanwa zvechikumbiro chako, zvinosanganisira kutonga kwekupisa, kugadzikana kwemuchina, kuchengetedza kwezvakatipoteredza, uye kuenderana kwekugadzira maitiro. Kubvunzana nevashambadziri ve epoxy kana kutsvaga zano renyanzvi kunogona kubatsira mukuita sarudzo ine ruzivo inosangana nezvido zvechikumbiro chako uye inova nechokwadi chekushanda kwakakwana uye kuvimbika.

Ramangwana Trends mu Underfill Epoxy

Underfill epoxy iri kuramba ichishanduka, ichitungamirwa nekufambira mberi muhunyanzvi hwemagetsi, maapplication ari kubuda, uye kudiwa kwekuvandudzwa kwekuita uye kuvimbika. Akawanda emangwana maitiro anogona kucherechedzwa mukuvandudza uye kushandiswa kwe underfill epoxy:

1. Miniaturization uye Yakakwira Density Packaging: Sezvo zvigadzirwa zvemagetsi zvichiramba zvichidzika uye zvichiratidza yakakwirira chikamu densities, underfill epoxies inofanirwa kuenderana. Mafambiro emangwana anozotarisana nekugadzira underfill zvinhu zvinopinda nekuzadza madiki madiki pakati pezvikamu, kuve nechokwadi chekuvhara kwakakwana uye kuchengetedzwa kwakavimbika mukuwedzera miniaturized magungano emagetsi.
2. Yakakwira-Frequency Zvishandiso: Nekuwedzera kuri kudiwa kweakakwira-frequency uye yakakwirira-yekumhanya zvigadzirwa zvemagetsi, underfill epoxy formulations inozoda kugadzirisa izvo chaizvo zvinodiwa zvezvikumbiro izvi. Underfill zvinhu zvine yakaderera dielectric inogara uye yakaderera kurasikirwa tangents ichave yakakosha kuderedza kurasikirwa kwechiratidzo uye kuchengetedza kutendeseka kweakakwira-frequency masaini mumasisitimu epamusoro ekutaurirana, 5G tekinoroji, uye mamwe maapplication ari kubuda.
3. Enhanced Thermal Management: Kupisa kupisa kunoramba kuri kunetseka kwakanyanya kune zvigadzirwa zvemagetsi, kunyanya nekuwedzera kwesimba remagetsi. Remangwana underfill epoxy formulations inotarisisa pane yakagadziridzwa yekupisa conductivity yekuwedzera kupisa kutamisa uye kugadzirisa zvinopisa zvinobudirira. Yepamberi mafirita uye ekuwedzera anobatanidzwa mune underfill epoxies kuti awane yakakwirira yekupisa conductivity uchichengetedza zvimwe zvinodiwa.
4. Flexible uye Stretchable Electronics: Kusimuka kwemagetsi anochinjika uye anotambanuka anovhura mikana mitsva yekuzadza underfilling epoxy zvinhu. Flexible underfill epoxies inofanirwa kuratidza yakanakisa adhesion uye michina zvivakwa kunyangwe pasi pekudzokorora kukotama kana kutambanudza. Zvishandiso izvi zvinogonesa kuvharirwa uye kudzivirira kwemagetsi mumidziyo inopfekeka, inobhenda maratidziro, uye mamwe maapplication anoda mechanic kuchinjika.
5. Environmental Hushamwari Solutions: Sustainable uye fungidziro kwezvakatipoteredza ichaita basa rinowedzera kukosha mukuvandudza underfill epoxy zvinhu. Pachave nekutarisa mukugadzira epoxy maumbirwo asina zvinhu zvine njodzi uye akadzikisa kukanganisa kwezvakatipoteredza mukati mehupenyu hwavo hwose, kusanganisira kugadzira, kushandiswa, uye kuraswa. Bio-yakavakirwa kana kuvandudzwa zvinhu zvinogona zvakare kuwana mukurumbira sedzimwe nzira dzinogoneka.
6. Yakavandudzwa Magadzirirwo Ekugadzira: Mafambiro emangwana mune underfill epoxy anotarisisa pazvinhu zvenyama uye kufambira mberi mukugadzira maitiro. Matekinoroji akadai sekuwedzera kugadzira, kugovera kwakasarudzika, uye nzira dzepamusoro dzekurapa dzinozoongororwa kukwirisa mashandisirwo uye kuita kwe underfill epoxy mune akasiyana emagetsi magungano maitiro.
7. Kubatanidzwa kweYepamberi Yekuyedza uye Hunhu Tekinoroji: Nekuwedzera kuoma uye zvinodiwa zvemidziyo yemagetsi, pachave nekudikanwa kwekuyedzwa kwepamusoro uye nzira dzehunhu kuti ive nechokwadi chekuvimbika uye kuita kweiyo underfilled epoxy. Matekinoroji akadai seasina-kuparadza kuyedza, in-situ yekutarisa, uye simulation maturusi anozobatsira mukuvandudza uye kudzora kwemhando yezvinhu zvisina kuzadzwa epoxy.

mhedziso

Underfill epoxy inoita basa rakakosha mukusimudzira kuvimbika uye kuita kwezvikamu zvemagetsi, kunyanya mu semiconductor packaging. Mhando dzakasiyana dze underfill epoxy dzinopa huwandu hwemabhenefiti, anosanganisira kuvimbika kwepamusoro, kuzvipa wega, kusimba kwepamusoro, uye yakanyanya kupisa uye mashandiro emuchina. Kusarudza iyo yakakodzera underfill epoxy yekushandisa uye package inovimbisa yakasimba uye inogara kwenguva refu chisungo. Sezvo tekinoroji ichifambira mberi uye saizi yepasuru inoderera, isu tinotarisira zvakatonyanya kuvandudza underfill epoxy mhinduro dzinopa hukuru hwekuita, kusanganisa, uye miniaturization. Underfill epoxy yakagadzirirwa kuita basa rinowedzera kukosha mune ramangwana remagetsi, zvichiita kuti tikwanise kuwana mazinga epamusoro ekuvimbika uye kuita mumaindasitiri akasiyana.