Adhesives for Potting uye Encapsulation
Adhesive inoyerera ichipfuura nekutenderedza chikamu kana inozadza mukamuri kuchengetedza zvikamu mairi. Mienzaniso inosanganisira tambo dzemagetsi dzinorema uye zvinobatanidza, zvemagetsi mumakesi epurasitiki, mabhodhi edunhu uye kugadzirisa kongiri.
Chisimbiso chinofanira kunge chakareba uye chinochinjika, chakasimba, uye chinokurumidza kuseta. Netsanangudzo, ma mechanical fasteners anogara achida chisimbiso chechipiri nekuti kupinda mukati kunobvumira mvura nemhute kuyerera zvakasununguka mugungano.
Peel, Kudzvanya uye Kushushikana Kwekushushikana kana Kuvhara, Kuputira kana Kuvhara
Kana iyo gungano ichida kupindirana kuviri kana majoini ebutt kuti avharwe, chisimbiso chinowanzo kuoneswa kune peel mauto. Kufamba kwetsoka pamusoro pemusuwo wemusuwo kana mhepo padenga renjanji inoramba ichiedza kupepeta chisimbiso, ingave tepi kana anonamira, kubva pachikamu. Kana iyo application iri mupoto kana yakavharirwa, chinonamira (matepi hachina kukwana pano) chinowanzoona kudzvanywa uye kukakavara sezvo chikamu chinosangana nekuwedzera kwekupisa kana kuputika. Zvikamu zvakawanda zvehari, pamabhodhi edunhu semuenzaniso, zvinogona kuona zvese zvinonetsa zvitatu - peel, kudzvanya uye kushushikana..
Deepmaterial mutsara wezvigadzirwa une epoxies, silicones, polyurethanes uye UV inorapika masisitimu. Iwo anoshandiswa mune yakaderera, yepakati, yakakwira voltage application uye inoratidzira yakatanhamara magetsi ekudzivirira zvivakwa, epamusoro anonamira simba, kugadzikana kwemafuta uye yakakwira makemikari kuramba. Zvigadzirwa zvinopa kuvimbika kwenguva refu kuita kwemicroelectronic, zvemagetsi, zvemagetsi zvishandiso, zvikamu zvinosanganisira:
*Magetsi emagetsi
*Kuchinja
*Ignition coils
* Electronic modules
*Mota
*Zvibatanidza
*Sensors
*Kubatanidza matambo etambo
*Capacitors
*Transformers
* Rectifiers
Zvivakwa zvePotting, Encapsulation uye Casting Systems
Kubva "pasi pehood" kusvika ku photovoltaic junction box assembly LED packaging kusvika kumarine modules kusvika kune submersible pombi Master Bond potting, encapsulation, zvinhu zvekukanda hazvipindiki kune hutsinye hwemamiriro ekunze. Vanopa zvinotevera zvakanakira:
* Yakakwidziridzwa thermal manejimendi zvivakwa
* Yakanyanya kuderera coefficients yekuwedzera kwekupisa
*Kuramba mutswe
* Dziviriro kubva mukuora
* Yakakwira tembiricha uye cryogenic serviceability
* Kumirisana nekuomarara kuchovha bhasikoro uye kuvhunduka
Magiredhi chaiwo anoshandiswa kutamper proofing, kupinza zvinhu zvakazara zvakazara, kuvhara maronda macoils, underfills, kune yakakwira voltage mukati / yekunze maapplication uko arcing / tracking iri kunetseka uye yakakwirira vacuum mamiriro. Pamusoro pezvo Master Bond inopa optically yakajeka UV inorapika masisitimu anosanganisira maviri ekurapa (UV / kupisa kunorapika) makomisheni enzvimbo "dzine mumvuri" dzinopfuura maawa e1000 pa85 ° C / 85% RH kuyedzwa.
Low viscosity, self leveling rigid, semi-rigid and flexible compements inobvisa kuvharirwa kwegasi uye yakanakira kukwirisa mavhoriyamu ekugadzira maapplication. Aya emahara emahara 100% akasimba masisitimu anoratidza yakaderera shrinkage, yakasarudzika dimensional kugadzikana, yakanakisa michina zvivakwa uye inogona kupihwa nemaoko / otomatiki. Ivo vanodzivirira kubva kune abrasion, kuvhunduka, vibration, kukanganisa, UV, fungus, kuratidzwa kwemwando kunosanganisira kunyudzwa kwemvura yemunyu. Magiredhi chaiwo anoratidza hunhu hwepamusoro hwekupisa kwekushisa uye ane tembiricha yepamusoro yegirazi. Heat activiated systems inogona kurapwa panguva yakaderera tembiricha uye kuratidza yakaderera exotherm kunyange akasiyana siyana yakafara muchinjikwa chikamu ukobvu. Yakapfava, yakaderera durometer, inotsiga nziyo ine yakanakisa yekuzorodza zvimiro zvezvisina kusimba, zvinonzwa zvinhu. Zvese zvigadzirwa zvinoenderana neROHS.
Iva nechokwadi chekushanda kwemagetsi kwenguva refu neDeepmaterial potting
Kubva pamidziyo inotakurika yedhijitari kuenda kune zvekufambisa, zvemagetsi zviri kuwedzera kuvepo muhupenyu hwedu hwezuva nezuva. Zvingave zvemotokari, zvemagetsi zvevatengi kana maindasitiri emagetsi masisitimu, matekinoroji atinovimba nawo anoshandisa zvinhu zvakasiyana-siyana senge masensor, maactuator nemabhodhi edunhu anoda kuchengetedzwa.
Deepmaterial's one- and two-part potting compound materials inokodzera zvaunoda neDeepmaterial solutions. Izvi zvinogadzira hermetic-sechisimbiso chekudzivirira midziyo yemagetsi inonzwisisika kubva kune zvakatipoteredza zvakaita seguruva, hunyoro uye kusiyanisa kwekushisa kuchengetedza kutendeseka kwezvikamu zvavo uye kuve nechokwadi chekuita kwenguva yakareba.
macompounds ndeyekusimbisa zvikamu ne:
* Kuvandudza mashandiro emuchina uye ekupisa;
* Kupa insulation uye kuramba vibration uye kuvhunduka;
*Kudzivirira ngura kubva mukunyorova;
*Kupa makemikari kuramba;
*Kuvandudza kupisa kwekupisa.
Sei uchishandisira Deepmaterial kune inonzwisisika zvemagetsi?
* Ita shuwa kuchengetedzwa kwezvinhu kubva kune zvakatipoteredza zvinhu;
* Kuvandudza kuvimbika kwekupedzisira application;
* Chengetedza kutendeseka kwezvikamu;
* Chengetedza kushanda kwenguva yakareba.
Yakajairika potting application
*PCBs uye junction mabhokisi;
* LED encapsulation;
*Solar modules;
*Magetsi emagetsi;
*Kutamisa kupisa kwekutonga kwekupisa.
