tsananguro
Chigadzirwa Rondedzero Parameter
| Product Model |
Product Name |
ruvara |
Typical
Viscosity (cps) |
Nguva Yekudyara |
shandisa |
Kusiyanisa |
| DM-6513 |
Epoxy underfill bonding adhesive |
Opaque Creamy Yero |
3000 ~ 6000 |
@100℃
30min
120 ℃ 15 min
150 ℃ 10 min |
Reusable CSP (FBGA) kana BGA filler |
Chimwe-chikamu epoxy resin adhesive is reusable yakazadzwa resin CSP (FBGA) kana BGA. Inorapa nokukurumidza kana yapisa. Yakagadzirirwa kupa kuchengetedzwa kwakanaka kudzivirira kukundikana nekuda kwe mechanical stress. Low viscosity inobvumira kuzadza mapundu pasi peCSP kana BGA. |
| DM-6517 |
Epoxy pasi filler |
Nhema |
2000 ~ 4500 |
@120℃ 5min 100℃ 10min |
CSP (FBGA) kana BGA yakazadzwa |
Imwe-chikamu, thermosetting epoxy resin ndeye reusable CSP (FBGA) kana BGA filler inoshandiswa kuchengetedza masolder majoini kubva kumakanika kushushikana mumagetsi anobatwa ruoko. |
| DM-6593 |
Epoxy underfill bonding adhesive |
Nhema |
3500 ~ 7000 |
@150℃ 5min 165℃ 3min |
Kuyerera KweCapillary Yakazadza Chip Size Packaging |
Kukurumidza kurapa, inokurumidza kuyerera mvura epoxy resin, yakagadzirirwa capillary inoyerera ichizadza chip saizi kurongedza. Yakagadzirirwa kumhanyisa kumhanya sechinhu chakakosha mukugadzira. Iyo rheological dhizaini inoibvumira kupinda mukati meiyo 25μm gap, kuderedza induced kushushikana, kunatsiridza tembiricha yebhasikoro kuita, uye kuve neakanakisa makemikari kuramba. |
| DM-6808 |
Epoxy underfill adhesive |
Nhema |
360 |
@130℃ 8min 150℃ 5min |
CSP (FBGA) kana BGA pasi zadza |
Classic underfill adhesive ine Ultra-yakaderera viscosity kune akawanda underfill application. |
| DM-6810 |
Reworkable epoxy underfill adhesive |
Nhema |
394 |
@130℃ 8min |
Reusable CSP (FBGA) kana BGA pasi
zadza |
Iyo reusable epoxy primer yakagadzirirwa CSP uye BGA zvikumbiro. Inorapa nekukurumidza pakudziya kwepakati kuderedza kushushikana pane zvimwe zvikamu. Kana yangoporeswa, zvinhu zvacho zvine zvakanakisa zvemuchina zvekuchengetedza majoini ekutengesa panguva yekupisa bhasikoro. |
| DM-6820 |
Reworkable epoxy underfill adhesive |
Nhema |
340 |
@130℃ 10min 150℃ 5min 160℃ 3min |
Reusable CSP (FBGA) kana BGA pasi
zadza |
The reusable underfill yakanyatsogadzirirwa CSP, WLCSP uye BGA zvikumbiro. Yakagadzirirwa kurapa nekukurumidza pane tembiricha ine mwero kuderedza kushushikana pane zvimwe zvikamu. Izvo zvinhu zvine tembiricha yekuchinjisa girazi uye yakanyanya kuputsika kusimba kwekudzivirira kwakanaka kwemajoini anotengeswa panguva yekupisa bhasikoro. |
Product Features
| Inogona kudzoka |
Kurumidza kupora pane tembiricha ine mwero |
| Yepamusoro girazi tembiricha tembiricha uye yakakwirira kutyoka kuoma |
Ultra-yakaderera viscosity kune akawanda underfill application |
Mutengo Unobatsira
Iyo inogona kushandiswa zvakare CSP (FBGA) kana BGA filler inoshandiswa kuchengetedza masolder majoini kubva kumakanika kushushikana mumidziyo yemagetsi inobatwa. Inorapa nokukurumidza kana yapisa. Yakagadzirirwa kupa kudzivirirwa kwakanaka kubva pakukundikana nekuda kwekunetseka kwemagetsi. Low viscosity inobvumira magapu kuzadzwa pasi peCSP kana BGA.
