Incazelo
Amapharamitha Wokucaciswa Komkhiqizo
| Product
imodeli |
Product
Igama |
Color |
Ngiyazifela
I-Viscosity (cps) |
Isikhathi sokulapha |
Sebenzisa |
Ukuhlukanisa |
| I-DM-6016E |
I-epoxy potting adhesive |
Black |
58000 ~ 62000 |
@ 150 ℃ 20min |
Okufakiwe okuzwelayo kwebhodi le-PCB, ama-transistors, i-smart card IC
ukupakisha ikhadi |
Ngezinhlelo zokusebenza lapho izakhiwo zokuphatha ezihamba phambili zidingeka. Izinto ezilahliwe zikhona ngenxa yokushaqeka okukhulu kokushisa futhi zinikeza ukumelana nokushisa okuqhubekayo ku-177°C. Ifaneleka ngokukhethekile ukupakishwa kwama-transistors nama-semiconductors afanayo, ingasetshenziselwa ukupakishwa kwamasekethe ahlanganisiwe wewashi, ingcina ye-encapsulation yengxenye, okokufaka okuzwelayo kwebhodi le-PCB, ama-transistors, ukupakishwa kwekhadi le-IC elihlakaniphile. |
| I-DM-6058E |
I-epoxy potting adhesive |
Black |
50,000 |
@ 120 ℃ 12min |
Ukupakishwa kwe
izinzwa kanye
ngokunemba
izingxenye |
Lo mkhiqizo uhlinzeka ngokuvikeleka okuhle kakhulu kwemvelo nokushisayo kwezingxenye zokupakisha, futhi ufaneleka ngokukhethekile ukuvikelwa kwezinzwa nezingxenye ezinembayo ezisetshenziswa ezindaweni ezinokhahlo njengezimoto. |
| I-DM-6061E |
I-epoxy potting adhesive |
Black |
32500 ~ 50000 |
@ 140°C 3H |
Okufakiwe okuzwelayo kwebhodi le-PCB, ama-transistors, i-smart card IC
ukupakisha ikhadi |
Iglue ye-encapsulation, esetshenziselwa ukupakisha amabhodi e-PCB e-plug-in abucayi, ukuzinza okuhle kakhulu kwe-viscosity, ukulawula usayizi weglue kalula. Ngemva kokudlula 1000H lokushisa/umswakama/ukuhlolwa kokuchezuka kanye nomjikelezo oshisayo ukuya ku-125℃. I-viscosity ekhethekile ezinzile ku-25 ° C inikeza usayizi olawulwa kalula kusetshenziswa imishini evamile yokukhipha isikhathi/ingcindezi. |
| I-DM-6086E |
I-epoxy potting adhesive |
Black |
62500 |
@ 120℃ 30min 150℃ 15min |
I-IC kanye ne-Semiconductor Packaging |
Isetshenziselwa izinhlelo zokusebenza ezidinga izakhiwo zokuphatha ezinhle kakhulu. Emaphaketheni e-IC kanye ne-semiconductor enamandla omjikelezo wokushisa omuhle, impahla ingamelana nokushaqeka okushisayo ngokuqhubekayo kufika ku-177°C. |
Izici Product
· Ihlinzeka ngokuvikeleka okuphezulu kwemvelo kanye nokushisa
· Ukuqina okuhle kwe-viscosity, kulula ukulawula usayizi wokukhipha
· Ikhono elihle lokuhamba ngebhayisikili elishisayo, impahla ingamelana nokushaqeka okushisayo kufika ku-177°C ngokuqhubekayo
· Ngezinhlelo zokusebenza ezidinga ukucubungula ukusebenza okuphakeme
Izinzuzo zomkhiqizo
Umkhiqizo uyi-epoxy resin encapsulant, ilungele izinhlelo zokusebenza ezidinga izakhiwo zokuphatha ezinhle kakhulu. Iglue ye-encapsulation, esetshenziselwa ukupakishwa kwe-plug-in ebucayi ye-PCB, ukuqina okuhle kakhulu kwe-viscosity, ukulawula usayizi weglue kalula. Ama-encapsulants e-epoxy resin aklanyelwe izinhlelo zokusebenza ezidinga izakhiwo zokuphatha ezinhle kakhulu. Isetshenziselwa ukufakwa kwe-IC kanye ne-semiconductor, inamandla amahle omjikelezo wokushisa, futhi okokusebenza kungamelana nokushaqeka okushisayo ngokuqhubekayo ukuya ku-177°C.
