Ingxenye eyodwa ye-Epoxy Adhesive
I-DeepMaterial One Part Epoxy Adhesive
I-DeepMaterial's One Part Epoxy Adhesive iwuhlobo lokunamathela oluhlanganisa ingxenye eyodwa. Lokhu okunamathelayo kuklanyelwe ukwelapha nokwenza isibopho esiqinile ekamelweni lokushisa noma ngokufaka ukushisa.
I-DeepMaterial's One Part Epoxy Adhesives isekelwe ku-epoxy resin, eyi-polymer eguquguquka kakhulu futhi ehlala isikhathi eside. I-adhesive yakhiwe nge-ejenti elaphayo noma i-catalyst ehlala ithule ize ichayeke ezimweni ezithile, njengomoya, umswakama, noma ukushisa. Uma isicushiwe, i-ejenti elaphayo iqala ukusabela kwamakhemikhali nge-epoxy resin, okuholela ekuxhumaneni okuphambanayo kwamaketanga e-polymer kanye nokwakheka kwesibopho esiqinile, esiqinile.
Izinzuzo ze-One Part Epoxy Adhesive
Lula: Lezi zinamathiselo zilungele ukusetshenziswa zisuka esitsheni, ziqeda isidingo sokuxutshwa okunembile kwezingxenye ezahlukene. Lokhu kwenza kube lula ukuphatha futhi kunciphisa amathuba okuhlanganisa okungalungile.
Okonga isikhathi: Okunamathelayo kwelashwa ezingeni lokushisa legumbi noma ngokusetshenziswa kokushisa okuncane, okuvumela ukuhlanganisa okusheshayo nezinqubo zokukhiqiza uma kuqhathaniswa nezinamatheliso ezidinga izikhathi zokuphulukisa ezinde noma ukuphulukiswa emazingeni okushisa aphakeme.
Amandla okuxhumana amahle kakhulu: Izinamatheliso zinikeza amandla okubopha okuphezulu ezinhlobonhlobo zama-substrates, okuhlanganisa izinsimbi, amapulasitiki, izitsha zobumba, nezinhlanganisela. Banikeza i-shear enhle kakhulu, ikhasi, kanye nokumelana nomthelela, okuholela kumabhondi ahlala isikhathi eside futhi ahlala isikhathi eside.
Ukumelana kwezinga lokushisa: Lezi zinto ezinamathelayo zibonisa ukumelana okuhle nezinga lokushisa eliphakeme, zigcina amandla azo ebhondi nokuzinza ngisho nasezindaweni ezinezinga eliphezulu lokushisa. Angakwazi ukumelana nokuhamba ngebhayisikili okushisayo futhi anikeze ukusebenza okuthembekile kulo lonke izinga lokushisa elibanzi.
Ukumelana kwamakhemikhali: Izinto ezinamathelayo zimelana namakhemikhali ahlukahlukene, izincibilikisi, kanye nezici zemvelo, okuzenza zifanelekele ukusetshenziswa lapho ukuchayeka kumakhemikhali anonya noma izimo zemvelo kulindeleke.
yizinhlobonhlobo: Ingxenye Eyodwa Enama-Epoxy Adhesives ithola izinhlelo zokusebenza ezimbonini ezihlukahlukene, ezihlanganisa ezezimoto, i-aerospace, electronics, construction, kanye nokukhiqiza okuvamile. Asetshenziselwa izingxenye zokubopha, ukuhlanganisa amalunga, ukufaka i-electronics encapsulating, nokulungisa izinto ezilimele.
Ingxenye eyodwa ye-Epoxy Adhesive Applications
I-One Part Epoxy Adhesives inohlu olubanzi lwezinhlelo zokusebenza kuzo zonke izimboni ezahlukahlukene. zihlanganisa:
Imbonini yezimoto: Lezi zinamathiselo zisetshenziselwa izingxenye zokubopha ekuhlanganisweni kwezimoto, njengokunamathisela izingcezu zokunquma, izingxenye zepulasitiki ezibophayo noma zensimbi, nokuvikela izingxenye zikagesi.
Imboni yezogesi: I-adhesive isetshenziselwa ukuhlanganisa nokuhlanganisa izingxenye ze-elekthronikhi, ukuvala amabhodi wesekethe, izixhumi ze-potting, namasinki okushisa okubopha.
Imboni ye-Aerospace: Lezi zinamathiselo zisetshenziselwa ukuhlanganisa izinto eziyinhlanganisela, izakhiwo zensimbi, nezingxenye zangaphakathi ekwenziweni kwezindiza. Zibuye zisetshenziselwe ukulungisa izingxenye zendiza.
Imboni yezokwakha: Isicelo sokuthola okunamathelayo emkhakheni wezokwakha sokuhlanganisa ukhonkolo, amatshe, amathayela e-ceramic, nezinye izinto zokwakha. Zisetshenziselwa ukuhlanganisa izakhiwo, ukubambelela, nokulungisa izakhiwo zikakhonkolo.
Ukukhiqiza okujwayelekile: Lezi zinamathiselo zisetshenziswa ezinqubweni ezihlukahlukene zokukhiqiza, okuhlanganisa ukuhlanganisa izingxenye zensimbi, ukuvikela izinto ezifakiwe noma izibophelelo, izingxenye zepulasitiki ezibophayo, kanye nezicelo zomhlangano ojwayelekile.
Imboni yasolwandle: Ingxenye Eyodwa Yezinamathiselo ze-Epoxy zilungele ukubopha nokulungisa izikebhe zemikhumbi, amadekhi, nezinye izinto zasolwandle. Banikeza ukumelana okuhle kwamanzi, usawoti, kanye nezindawo zasolwandle.
Imboni kagesi: Lezi zinamathiselo zisetshenziselwa ukuhlanganisa nokufaka izingxenye zikagesi, ama-potting transformers, izintambo zokuvikeleka nezintambo, kanye nokuhlanganisa ama-electronic assemblies.
Imboni yezokwelapha: I-adhesive ithola izinhlelo zokusebenza ekukhiqizweni kwemishini yezokwelapha, njengokubopha okokusebenza kwezokwelapha, ukuhlanganisa amathuluzi okuhlinza, kanye nokuvikela izingxenye zemishini yezokwelapha.
Izicelo ze-DIY nezasendlini: Lezi zinamathiselo zivame ukusetshenziselwa amaphrojekthi ahlukahlukene we-DIY nokulungiswa kwasendlini, njengensimbi yokubopha, ipulasitiki, izinkuni, izitsha zobumba, nengilazi.
I-DeepMaterial ibambelela emcabangweni wocwaningo nentuthuko “wemakethe kuqala, eduze nendawo yesigameko”, futhi ihlinzeka amakhasimende ngemikhiqizo ephelele, ukusekelwa kwezicelo, ukuhlaziya inqubo kanye namafomula enziwe ngokwezifiso ukuze kuhlangatshezwane nezidingo zamakhasimende ezisebenza kahle kakhulu, ezingabizi kakhulu kanye nokuvikelwa kwemvelo.
Ingxenye eyodwa ye-Epoxy Adhesive Product Selection
| Uchungechunge Lomkhiqizo | Igama Product | Uhlelo lokusebenza olujwayelekile lomkhiqizo |
| Ukugcwaliswa Kwe-Chip Bottom |
EA-6180 | Imikhiqizo yochungechunge olunamathelisa e-epoxy elapha izinga lokushisa eliphansi idizayinelwe ukuhlanganisa nokulungisa amadivayisi azwelayo kukushisa. Zingelapheka zifike ngaphansi kuka-80 ℃ futhi zibe nokunamathela okuhle ezintweni ezihlukahlukene ngesikhathi esifushane uma kuqhathaniswa.Izinhlelo zokusebenza ezivamile: ukubopha isihlungi se-IR nesisekelo, kanye nokubopha isisekelo ne-substrate. |
| EA-6307 | I-epoxy primer, ekwazi ukuphulukiswa ngokushesha emazingeni okushisa aphansi futhi inciphise ukucindezeleka kwezinye izingxenye. Ngemuva kokuphulukisa, inganikeza izakhiwo ezinhle kakhulu zemishini futhi ivikele amalunga e-solder ngaphansi kwezimo zamabhayisikili ezishisayo. Ifanele i-BGA/CSP ukuvikelwa kokugcwalisa ngezansi kwe-chip. | |
| EA-6320 | I-filler engezansi yakhelwe ngokukhethekile inqubo yokupakisha ye-BGA/CSP. Ingakwazi ukuqina ngokushesha ekushiseni okufanelekile ukuze kuncishiswe ukucindezeleka okushisayo kwe-chip futhi kuthuthukise ukwethembeka kwejoyinti le-solder ngaphansi kwezimo ezibandayo nezishisayo zamabhayisikili. | |
| EA-6308 | I-epoxy primer enengxenye eyodwa yokwenziwa kwesikrini sokuhlanganisa i-LED kunqubo yokupakisha ye-COB. Umkhiqizo une-viscosity ephansi, ukunamathela okuhle namandla okugoba aphezulu, okungavala ngokushesha nangempumelelo igebe elincane phakathi kwama-chips futhi kuthuthukise ngempumelelo ukwethembeka kokukhwezwa kwe-chip. | |
| EA-6303 | I-epoxy primer enengxenye eyodwa yokwenziwa kwesikrini sokuhlanganisa i-LED kunqubo yokupakisha ye-COB. Umkhiqizo unokuphansi i-viscosity, ukunamathela okuhle namandla aphezulu okugoba, okungagcwalisa ngokushesha nangempumelelo igebe elincane phakathi kwama-chips kanye kuthuthukisa ngempumelelo ukuthembeka kokukhwezwa kwe-chip. | |
Amadivayisi Azwelayo |
EA-6109 | Imikhiqizo yochungechunge olunamathelisa e-epoxy elapha izinga lokushisa eliphansi idizayinelwe ukuhlanganisa nokulungisa amadivayisi azwelayo kukushisa. Zingelapheka zifike ngaphansi kuka-80 ℃ futhi zibe nokunamathela okuhle ezintweni ezihlukahlukene ngesikhathi esifushane uma kuqhathaniswa.Izinhlelo zokusebenza ezivamile: ukubopha isihlungi se-IR nesisekelo, kanye nokubopha isisekelo ne-substrate. |
| EA-6120 | Imikhiqizo yochungechunge olunamathelisa e-epoxy elapha izinga lokushisa eliphansi idizayinelwe ukuhlanganisa nokulungisa amadivayisi azwelayo kukushisa. Zingelapheka zifike ngaphansi kuka-80 ℃ futhi zibe nokunamathela okuhle ezintweni ezihlukahlukene ngesikhathi esifushane uma kuqhathaniswa.Izinhlelo zokusebenza ezivamile: ukubopha isihlungi se-IR nesisekelo, kanye nokubopha isisekelo ne-substrate. | |
| I-Chip Edge Gcwalisa | EA-6310 | I-epoxy primer, ekwazi ukuphulukiswa ngokushesha emazingeni okushisa aphansi futhi inciphise ukucindezeleka kwezinye izingxenye. Ngemuva kokuphulukisa, inganikeza izakhiwo ezinhle kakhulu zemishini futhi ivikele amalunga e-solder ngaphansi kwezimo zamabhayisikili ezishisayo. Ifanele i-BGA/CSP ukuvikelwa kokugcwalisa ngezansi kwe-chip. |
| I-LED Chip Fixed | EA-6946 | I-Composite epoxy resin iwumkhiqizo othuthukiswe ukuhlangabezana nobuchwepheshe bokupakisha obusezingeni eliphezulu be-LED emakethe. Ilungele ukupakishwa okuhlukahlukene kwe-LED nokuqinisa. Ngemva kokwelapha, inokucindezeleka kwangaphakathi okuphansi, ukunamathela okuqinile, ukumelana nokushisa okuphezulu, ukuphuzi okuphansi, nokumelana nesimo sezulu esihle. |
| I-NR Inductance | EA-6971 | I-adhesive ye-epoxy enengxenye eyodwa edizayinelwe ngokukhethekile i-NR inductance coil encapsulation. Umkhiqizo unokukhipha okubushelelezi, isivinini sokuphulukisa ngokushesha, umphumela omuhle wokubumba, futhi uyahambisana nazo zonke izinhlobo zezinhlayiya kazibuthe. |
| I-Chip Packaging | EA-6221 | I-adhesive ye-epoxy resin enengxenye eyodwa enokuncipha okupholisayo okuphansi, amandla aphezulu okunamathela kanye nokunamathela okuhle kwezinto eziningi. Ifanele ukugcwalisa nokubeka uphawu lwezingxenye ze-elekthronikhi ezinembile, ikakhulukazi ezisetshenziselwa ukugcwalisa kanye nokufaka uphawu kwezinzwa zezimoto kanye nabathintana nabo be-electronic ebhodini. |
| Umkhiqizo kagesi Okufakiwe |
EA-6950 | I-adhesive ye-epoxy enengxenye eyodwa eklanyelwe ngokukhethekile ukuhlanganisa isakhiwo sokubopha imikhiqizo ye-photoelectric. Lo mkhiqizo ufanelekile ukuphulukiswa kwezinga lokushisa eliphansi futhi unokunamathela okuhle ezintweni ezihlukahlukene ngesikhathi esifushane, ikakhulukazi imikhiqizo yepulasitiki. |
Ishidi Ledatha Yomkhiqizo Lengxenye Eyodwa Ye-Epoxy Adhesive
