Incazelo
Amapharamitha Wokucaciswa Komkhiqizo
| Imodeli Yomkhiqizo |
Igama Product |
Color |
Ngiyazifela
I-Viscosity (cps) |
Isikhathi sokuphumula |
Sebenzisa |
Ukuhlukanisa |
| EA-6513 |
I-epoxy underfill bonding enamathelayo |
I-Opaque Creamy Yellow |
3000 ~ 6000 |
@ 100℃
30min
120℃ 15min
150℃ 10min |
I-CSP esebenzisekayo (FBGA) noma isigcwalisi se-BGA |
I-adhesive ye-epoxy resin enengxenye eyodwa iyi-resin egcwele ukusetshenziswa kabusha i-CSP (FBGA) noma i-BGA. Yelapheka ngokushesha lapho ishisa. Iklanyelwe ukunikeza ukuvikeleka okuhle ukuvimbela ukwehluleka ngenxa yokucindezeleka kwemishini. I-viscosity ephansi ivumela ukugcwalisa izikhala ngaphansi kwe-CSP noma i-BGA. |
| EA-6517 |
Isigcwalisi se-epoxy phansi |
Black |
2000 ~ 4500 |
@ 120℃ 5min 100℃ 10min |
I-CSP (FBGA) noma i-BGA igcwalisiwe |
Ingxenye eyodwa, i-thermosetting epoxy resin iyi-CSP (FBGA) esebenziseka kabusha (FBGA) noma i-BGA filler esetshenziselwa ukuvikela amalunga e-solder ekucindezelekeni kwemishini kuma-electronics aphathwayo. |
| EA-6593 |
I-epoxy underfill bonding enamathelayo |
Black |
3500 ~ 7000 |
@ 150℃ 5min 165℃ 3min |
Ukugeleza Kwe-Capillary Kugcwaliswe Usayizi We-Chip |
Ukwelapha okusheshayo, i-epoxy resin egelezayo egeleza ngokushesha, eyenzelwe ukupakishwa kosayizi we-chip we-capillary flow. Idizayinelwe isivinini senqubo njengenkinga eyinhloko ekukhiqizeni. Idizayini yayo ye-rheological ivumela ukuthi ingene esikhaleni esingama-25μm, inciphise ukucindezeleka okubangelwa, ithuthukise ukusebenza kwamabhayisikili okushisa, futhi ibe nokumelana okuhle kwamakhemikhali. |
| EA-6808 |
I-epoxy underfill adhesive |
Black |
360 |
@130℃ 8min 150℃ 5min |
CSP (FBGA) noma BGA ukugcwalisa ngezansi |
I-adhesive engagcwalisi kahle yakudala ene-viscosity ephansi kakhulu yezinhlelo zokusebenza eziningi ezingagcwalisi kakhulu. |
| EA-6810 |
I-epoxy underfill esebenza kabusha enamathelayo |
Black |
394 |
@130℃ 8min |
I-CSP esebenzisekayo (FBGA) noma i-BGA phansi
isihlungi |
I-epoxy primer esebenziseka kabusha yakhelwe izinhlelo zokusebenza ze-CSP ne-BGA. Ilapha ngokushesha emazingeni okushisa aphakathi ukuze inciphise ingcindezi kwezinye izingxenye. Uma seselaphekile, izinto ezisetshenziswayo zinezakhiwo ezinhle kakhulu zokuvikela amalunga e-solder ngesikhathi sokuhamba ngebhayisikili okushisayo. |
| EA-6820 |
I-epoxy underfill esebenza kabusha enamathelayo |
Black |
340 |
@130℃ 10min 150℃ 5min 160℃ 3min |
I-CSP esebenzisekayo (FBGA) noma i-BGA phansi
isihlungi |
Ukugcwaliswa phansi okusebenzisekayo kabusha kuklanyelwe ngokukhethekile izinhlelo zokusebenza ze-CSP, i-WLCSP ne-BGA. Yenzelwe ukwelapha ngokushesha emazingeni okushisa amaphakathi ukuze kuncishiswe ingcindezi kwezinye izakhi. Izinto ezisetshenziswayo zinezinga lokushisa eliphezulu lokushintsha kwengilazi kanye nokuqina okuphezulu kokuphuka ukuze kuvikelwe kahle amalunga e-solder ngesikhathi sokuhamba ngebhayisikili okushisayo. |
Izici Product
| Kuyenzeka futhi |
Ukwelapha ngokushesha emazingeni okushisa amaphakathi |
| Izinga lokushisa eliphezulu lengilazi nokuqina kokuphuka |
I-viscosity ephansi kakhulu yezinhlelo zokusebenza eziningi ezingagcwalisi kakhulu |
Izinzuzo zomkhiqizo
Kuyi-CSP (FBGA) esebenziseka kabusha (i-FBGA) noma i-BGA filler esetshenziselwa ukuvikela amalunga e-solder ekucindezelekeni komshini kumishini kagesi ephathwayo. Yelapheka ngokushesha lapho ishisa. Iklanyelwe ukunikeza ukuvikeleka okuhle ekuhlulekeni ngenxa yokucindezeleka kwemishini. I-viscosity ephansi ivumela izikhala ukuthi zigcwaliswe ngaphansi kwe-CSP noma i-BGA.
