Izinamatheliso Zazo Zonke Izimboni
Ngamahhovisi atholakala emhlabeni wonke, i-Deepmaterial inikeza usizo lochwepheshe lochwepheshe, izincomo zomkhiqizo, amasampuli, ukuhlolwa kwaselabhorethri, noma ngisho nokuthuthukiswa kokwakheka ngokwezifiso kwazo zonke izimboni. Sinikeza izikhathi ezimfushane zokuhola kanye nenani eliphansi le-oda elincane, ngisho nokwakheka ngokwezifiso.
Imikhiqizo Esezingeni Eliphezulu
I-Deepmaterial inikezela ngemikhiqizo enamathelayo yezimboni yekhwalithi ephezulu ukuze kuqinisekiswe ukuthi imigqa yokukhiqiza yekhasimende isebenza ngokushesha nangokushelela, Xhumana nathi ukuze uthole ukuhlolwa komugqa wokukhiqiza wamahhala noma usizo ngokwethula izinto ezinamathelayo zezimboni emigqeni yokukhiqiza ezenzakalelayo ngokuphelele noma eyenziwa mathupha.
Ukusiza Ukuhlinzeka Izisombululo
Ochwepheshe bethu bokuthengisa kanye nobuchwepheshe basekelwa inethiwekhi yomhlaba wonke yabasabalalisi ukukusiza ngazo zonke izidingo zakho zokubopha nokuvala. Ukuze uthole ulwazi ngosayizi bephakethe lomkhiqizo, ukutholakala kokunamathelayo, nemininingwane yokuxhumana yabasabalalisi bendawo, sicela uthinte i-Deepmaterial endaweni yangakini.
I-Shenzhen Deepmaterial Technologies Co., Ltd
I-Shenzhen Deepmaterial Technologies Co., Ltd, iyinkampani ekhiqiza izinto ezinamathelayo, futhi iyinkampani esungula izinto ezintsha egxile ekunamathiseleni ama-semiconductor kanye nezicelo ze-elekthronikhi kanye nezinto zokuvikela indawo yokupakisha nokuhlola ama-chip. Sihlinzeka ngezixazululo zobuchwepheshe ezinamathelayo konjiniyela emhlabeni wonke.
Ngokusekelwe kubuchwepheshe obuyisisekelo bokunamathisela, i-DeepMaterial ithuthukise izinto zokunamathisela zokupakishwa nokuhlolwa kwe-chip, izinto zokunamathisela ezingeni lebhodi lesifunda, nezinamatheliso zemikhiqizo ye-elekthronikhi. Ngokusekelwe ezintweni ezinamathelayo, ithuthukise amafilimu okuvikela, izigcwalisi ze-semiconductor, nezinto zokupakisha zokucubungula i-wafer ye-semiconductor kanye nokupakishwa nokuhlolwa kwe-chip.
Izinamathiselo zikagesi ziyizinto ezikhethekile ezihlanganisa izingxenye ze-elekthronikhi, njengamasekhethi ahlanganisiwe, ama-resistors, ama-capacitor, nama-transistors, kumabhodi wesekethe, ama-substrates, namanye amadivaysi kagesi. Lezi zinamathiselo ziqinisekisa ukwethembeka, ukusebenza, nokuphila isikhathi eside kwemikhiqizo ye-elekthronikhi.
I-Adhesive ye-Automotive Electronics
I-Adhesive ye-Consumer Electronics
I-Adhesive Yezimboni Nengqalasizinda
I-Adhesive for Semiconductor Packaging
Uma unikezwe umsebenzi wokuthuthukisa umkhiqizo noma inqubo yakho, ungabheki okunamathiselwe kwe-Deepmaterial. Izinamatheliso zezimboni zisetshenziselwa ukuhlanganisa ama-substrates ahlukahlukene ngokunamathela (i-surface bonding) kanye nokuhlangana (amandla angaphakathi).
I-Adhesive yezimoto zikagesi
I-Adhesive for Heat Exchangers
I-Adhesive for Metal Fabrication
I-Adhesive for Personal Electronic Devices
I-Adhesive for Sports and Leisure Equipment
I-DeepMaterial Electronic Adhesive Pruducts
I-DeepMaterial, njengomkhiqizi wokunamathisela we-epoxy wezimboni, silahlekelwe ucwaningo mayelana ne-underfill epoxy, ingcina ye-non conductive ye-electronics, i-non conductive epoxy, izinamathiselo zokuhlanganiswa kwe-electronic, okunamathelayo okungagcwali, i-epoxy ephezulu ye-refractive index. Ngokusekelwe kulokho, sinobuchwepheshe bakamuva bokunamathela kwe-epoxy yezimboni.
Ingxenye eyodwa ye-Epoxy Adhesive
Izingxenye ezimbili ze-Epoxy Adhesive
I-Silicone Adhesive
Unamathele we-Acrylic
I-Epoxy Adhesive
I-Adhesive Ezwela Ukucindezela
I-Adhesive Conductive Electric
I-PUR Structural Adhesive
I-Epoxy Adhesive enezingxenye ezimbili
I-Epoxy Adhesive
I-epoxy underfill chip level adhesive
I-glue esiliva eyi-conductive yokupakisha i-chip kanye ne-bonding
Ingcina ye-UV Umswakama kabili yokupholisa
Izinga lokushisa eliphansi lokunamathisela i-epoxy kumadivayisi azwelayo nokuvikelwa kwesekethe
Ifilimu Yokunciphisa Ukunamathela Kwengilazi ye-UV
I-Adhesive Customzied On Demand
I-Deepmaterial idonsa kubuchwepheshe obuhlukahlukene bokunamathisela ukuze inikeze izixazululo zokunamathela zokuhlanganisa, ukufaka uphawu, nokufaka izicelo zokubumba. Sihlinzeka ngezinsizakalo zokunamathela ezenziwe ngokwezifiso ngokwesidingo sakho, okokunamathiswa kwe-elekthronikhi ngokwezifiso, okunamathelayo kwesakhiwo se-PUR, ingcina ye-UV yokwelapha umswakama, i-epoxy adhesive, iglue esiliva eqhubayo, i-epoxy underfill adhesive, i-epoxy encapsulant, ifilimu yokuvikela esebenzayo, ifilimu yokuvikela ye-semiconductor.
Ingcina ye-Magnet bonding, eyaziwa nangokuthi iglue kazibuthe noma ingcina kazibuthe, iwuhlobo lokunamathela olusetshenziselwa ukuhlanganisa odonsa ezindaweni ezihlukahlukene. Sekuthandwa kakhulu ngenxa yezakhiwo zayo eziyingqayizivele ezivumela ukufakwa kalula nokubamba okuqinile. Kulesi sihloko, sizongena emhlabeni wokunamathela kuzibuthe futhi sihlole izici zawo, izinzuzo, izinhlelo zokusebenza, nokuningi.
I-Deepmaterial ingumphakeli wezinto zokwakha ophambili wezimboni zokupakisha ze-electronics kanye ne-semiconductor. Ukwakheka kwethu okuthuthukisiwe kufaka phakathi imikhiqizo ehlukahlukene eyenza ukuxhumana kukagesi kube lula, ukunikeza ubuqotho besakhiwo, ukunikeza ukuvikeleka okubalulekile, nokudlulisa ukushisa ukuze kusebenze okuthembekile. Siyaziqhenya ngokudala imikhiqizo ethuthukisa ubuchwepheshe banamuhla be-elekthronikhi futhi inike amandla intuthuko yakusasa.
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