I-DeepMaterial Electronic Adhesive Pruducts
I-DeepMaterial, njengomkhiqizi wokunamathisela we-epoxy wezimboni, silahlekelwe ucwaningo mayelana ne-underfill epoxy, ingcina ye-non conductive ye-electronics, i-non conductive epoxy, izinamathiselo zokuhlanganiswa kwe-electronic, okunamathelayo okungagcwali, i-epoxy ephezulu ye-refractive index. Ngokusekelwe kulokho, sinobuchwepheshe bakamuva bokunamathela kwe-epoxy yezimboni.
I-DeepMaterial ithuthukise izinto ezinamathelayo zezimboni zokupakisha nokuhlola ama-chip, izinto zokunamathisela ezingeni lebhodi lesifunda, nezinamatheliso zemikhiqizo kagesi. Ngokusekelwe ezintweni ezinamathelayo, ithuthukise amafilimu okuvikela, izigcwalisi ze-semiconductor, nezinto zokupakisha zokucubungula i-wafer ye-semiconductor kanye nokupakishwa nokuhlolwa kwe-chip.
Ukuhlinzeka ngezinto zokunamathisela zikagesi kanye nefilimu encane ye-elekthronikhi imikhiqizo kanye nezixazululo zezinkampani zokugcina ukuxhumana, izinkampani zikagesi zabathengi, izinkampani ezipakishwayo ze-semiconductor kanye nokuhlola, nabakhiqizi bemishini yezokuxhumana, ukuxazulula amakhasimende ashiwo ngenhla ekuvikelweni kwenqubo, ukubopha komkhiqizo ngokunemba okuphezulu. , nokusebenza kukagesi.
I-DeepMaterial inikezela ngezinhlobo ezahlukahlukene zemikhiqizo emayelana nokunamathela kwezimboni zikagesi, uchungechunge lwe-UV oluphilisayo lwe-UV, uhlobo olusebenzayo lwe-adhesive enamathelayo encibilikayo eshisayo kanye ne-adhesiveseries ezwelayo encibilikayo encibilikayo, i-epoxy-based chip underfill kanye nochungechunge lwempahla ye-COB encapsulation, ibhodwe lokuvikela ibhodi lesifunda kanye ne-conformal coating adhesive. uchungechunge, i-epoxy based conductive silver adhesive series, i-structural bonding adhesive series, uchungechunge lwefilimu oluvikelayo olusebenzayo, uchungechunge lwefilimu yokuvikela i-semiconductor.
I-Adhesive Customzied On Demand
I-Deepmaterial idonsa kubuchwepheshe obuhlukahlukene bokunamathisela ukuze inikeze izixazululo zokunamathela zokuhlanganisa, ukufaka uphawu, nokufaka izicelo zokubumba. Sihlinzeka ngezinsizakalo zokunamathela ezenziwe ngokwezifiso ngokwesidingo sakho, okokunamathiswa kwe-elekthronikhi ngokwezifiso, okunamathelayo kwesakhiwo se-PUR, ingcina ye-UV yokwelapha umswakama, i-epoxy adhesive, iglue esiliva eqhubayo, i-epoxy underfill adhesive, i-epoxy encapsulant, ifilimu yokuvikela esebenzayo, ifilimu yokuvikela ye-semiconductor.
I-epoxy underfill chip level adhesive
Lo mkhiqizo uyingxenye eyodwa yokushisa elapha i-epoxy ngokunamathela okuhle ezinhlobonhlobo zezinto. Okunamathelayo okungagcwali phansi kwakudala okune-viscosity ephansi kakhulu efanele izinhlelo zokusebenza eziningi ezingagcwalisi kakhulu. I-epoxy primer esetshenziswa kabusha yakhelwe izinhlelo zokusebenza ze-CSP ne-BGA.
I-glue esiliva eyi-conductive yokupakisha i-chip kanye ne-bonding
Isigaba somkhiqizo: I-Conductive Silver Adhesive
Imikhiqizo yeglue yesiliva ye-conductive yelashwe nge-conductivity ephezulu, i-thermal conductivity, ukumelana nokushisa okuphezulu nokunye ukusebenza okuthembekile okuphezulu. Umkhiqizo ufanelekile ukusabalalisa ngesivinini esikhulu, ukusabalalisa ukuhambisana okuhle, iphuzu leglue aliguquki, lingawi, lingasakazeki; umswakama wempahla welaphekile, ukushisa, ukumelana nokushisa okuphezulu nokuphansi. 80 ℃ izinga lokushisa eliphansi lokuphulukisa ngokushesha, ukuqhutshwa kahle kukagesi kanye ne-thermal conductivity.
I-UV Umswakama Okubili Okunamathelayo Yokwelapha
Iglue ye-Acrylic engagelezi, i-UV emanzi kabili yokwelapha i-encapsulation efanele ukuvikelwa kwebhodi lesifunda. Lo mkhiqizo uyi-fluorescent ngaphansi kwe-UV(Mnyama). Isetshenziselwa ikakhulukazi ukuvikela kwendawo ye-WLCSP ne-BGA kumabhodi esekethe. I-silicone ye-organic isetshenziselwa ukuvikela amabhodi esekethe aphrintiwe nezinye izakhi ze-elekthronikhi ezibucayi. Iklanyelwe ukuhlinzeka ngokuvikelwa kwemvelo. Umkhiqizo uvamise ukusetshenziswa ukusuka ku -53°C kuya ku-204°C.
Izinga lokushisa eliphansi lokunamathisela i-epoxy kumadivayisi azwelayo nokuvikelwa kwesekethe
Lolu chungechunge luyingxenye eyodwa yokwelapha ukushisa kwe-epoxy resin yokwelapha okuphansi kwezinga lokushisa ngokunamathela okuhle ezinhlobonhlobo zezinto ngesikhathi esifushane kakhulu. Izinhlelo zokusebenza ezijwayelekile zihlanganisa amamemori khadi, amasethi ezinhlelo zeCCD/CMOS. Ifanele ikakhulukazi izingxenye ze-thermosensitive lapho izinga lokushisa eliphansi lokuphulukisa lidingeka.
I-Epoxy Adhesive enezingxenye ezimbili
Umkhiqizo uphulukisa ezingeni lokushisa lasekamelweni uye kungqimba olunamathelayo olusobala, olunciphayo olunokumelana nomthelela omuhle kakhulu. Uma selaphekile ngokuphelele, i-epoxy resin imelana kumakhemikhali amaningi nezincibilikisi futhi inokuqina okuhle kobukhulu phezu kwebanga lokushisa elibanzi.
I-PUR yokunamathela kwesakhiwo
Umkhiqizo uyingxenye eyodwa yokunamathisela okumanzi-cured esebenzayo ye-polyurethane hot-melt. Isetshenziswa ngemva kokushisisa imizuzu embalwa ize inyibilike, ibe namandla ebhondi yasekuqaleni ngemva kokupholisa imizuzu embalwa ekamelweni lokushisa. Futhi isikhathi esivulekile esimaphakathi, nobude obuhle kakhulu, ukuhlanganisa okusheshayo, nezinye izinzuzo. Ukwelashwa kwamakhemikhali omswakama womkhiqizo ngemva kwamahora angu-24 kuwu-100% wokuqukethwe okuqinile, futhi akunakuhlehliswa.
I-Epoxy Encapsulant
Umkhiqizo unokumelana nesimo sezulu esihle kakhulu futhi unokuvumelana nezimo zemvelo. Ukusebenza okuhle kakhulu kokufakwa kukagesi, kungagwema ukusabela phakathi kwezingxenye nemigqa, ukuxosha amanzi okukhethekile, kungavimbela izingxenye ukuthi zingathinteki umswakama nomswakama, ikhono elihle lokukhipha ukushisa, kunganciphisa izinga lokushisa kwezingxenye ze-elekthronikhi ezisebenzayo, nokwandisa impilo yesevisi.
Ifilimu Yokunciphisa Ukunamathela Kwengilazi ye-UV
Ifilimu yokunciphisa ukunamathela kwe-UV yengilazi ye-DeepMaterial inikezela nge-birefringence ephansi, ukucaca okuphezulu, ukumelana nokushisa okuhle kakhulu nomswakama, kanye nohlu olubanzi lwemibala nogqinsi. Siphinde sinikeze izindawo eziphikisana nokucwebezela kanye nezingubo zokugqoka zezihlungi ze-acrylic laminated.
Ifilimu Elivikela Ingilazi Elingaguquki
Umkhiqizo uyifilimu evikela i-anti-static yokuhlanzeka okuphezulu, izakhiwo zemishini yomkhiqizo nokuzinza kosayizi, kulula ukudabula nokuklebhula ngaphandle kokushiya ingcina eyinsalela. Inokumelana okuhle nokushisa okuphezulu nokukhipha umoya. Ifanele ukudluliswa kwezinto, ukuvikelwa kwephaneli nezinye izimo zokusetshenziswa.
Umvikeli wesikrini
Isigaba somkhiqizo: Isivikeli Sesikrini
Isibonisi sikagesi wabathengi/isivikeli sesikrini
· Ukumelana nemihuzuko
· Ukumelana namakhemikhali
· Ingazweli
· Ukumelana ne-UV
I-LED Scribing/Turning Crystal/Reprinting Semiconductor PVC Protective Film
I-LED Scribing/Turning Crystal/Reprinting Semiconductor PVC Protective Film
I-Semiconductor Packaging & Testing UV Viscosity Reduction Special Film
Umkhiqizo usebenzisa i-PO njengento yokuvikela indawo engaphezulu, esetshenziselwa ukusika i-QFN, i-SMD microphone substrate cutting, i-FR4 substrate cutting (LED).
