inkcazelo
Imigaqo yokucaciswa kweMveliso
| imveliso
imodeli |
imveliso
igama |
umbala |
UMbane oQhelekileyo
Viscosity (cps) |
Ukuphilisa ixesha |
ukusebenzisa |
Umahluko |
| I-DM-6016E |
I-epoxy potting adhesive |
Mnyama |
58000 ~ 62000 |
@ 150℃ 20min |
PCB ibhodi ufaka ezibuthathaka, transistors, smart card IC
ukupakishwa kwekhadi |
Ngezicelo apho iimpawu zokuphatha ezibalaseleyo zifuneka. Izinto ezinyangwayo zikhona ngenxa yokothuka kakhulu kwe-thermal kwaye zibonelela ngokuxhathisa ubushushu obuqhubekayo ukuya kuma-177°C. Ngokukodwa ilungele ukupakishwa kwe-transistors kunye ne-semiconductors efanayo, ingasetyenziselwa ukupakishwa kweesekethe ezidibeneyo zewotshi, i-adhesive encapsulation adhesive, kwibhodi ye-PCB efakelweyo, i-transistors, i-smart card ye-IC yokupakisha ikhadi. |
| I-DM-6058E |
I-epoxy potting adhesive |
Mnyama |
50,000 |
@ 120℃ 12min |
Ukupakishwa kwe
sensors kunye
ngokuchanekileyo
amacandelo |
Le mveliso ibonelela ngokugqwesileyo kokusingqongileyo kunye nokukhuselwa kwe-thermal kumacandelo okupakisha, kwaye ifaneleke ngokukodwa ukukhuselwa kweenzwa kunye namacandelo achanekileyo asetyenziswa kwiindawo ezinzima ezifana neemoto. |
| I-DM-6061E |
I-epoxy potting adhesive |
Mnyama |
32500 ~ 50000 |
@ 140°C 3H |
PCB ibhodi ufaka ezibuthathaka, transistors, smart card IC
ukupakishwa kwekhadi |
Component encapsulation glue, esetyenziselwa ukupakishwa ebuthathaka iiplagi PCB iibhodi, viscosity ebalaseleyo uzinzo, lula ukulawula ubukhulu iglu. Emva kokudlula i-1000H yokuvavanya ubushushu / ukufuma / ukutenxa kunye nomjikelo we-thermal ukuya kwi-125 ℃. I-viscosity ekhethekileyo ezinzile kwi-25 ° C inika ubungakanani obulawulwa ngokulula usebenzisa izixhobo eziqhelekileyo zexesha / uxinzelelo. |
| I-DM-6086E |
I-epoxy potting adhesive |
Mnyama |
62500 |
@ 120℃ 30min 150℃ 15min |
I-IC kunye ne-Semiconductor Packaging |
Isetyenziswa kwizicelo ezifuna iimpawu zokuphatha ezigqwesileyo. Kwipakethe ye-IC kunye ne-semiconductor enesakhono esilungileyo somjikelo wobushushu, imathiriyeli inokumelana nokothuka kwe-thermal ngokuqhubekayo ukuya kuthi ga kwi-177 ° C. |
Iziphumo zomkhiqizo
· Ibonelela ngokhuseleko oluphezulu lokusingqongileyo kunye nobushushu
· Uzinzo olugqwesileyo lwe-viscosity, kulula ukulawula ubungakanani bokuhambisa
· Ukukwazi ukukhwela ibhayisekile eshushu, imathiriyeli inokumelana nokothuka kwe-thermal ukuya kuthi ga kwi-177°C ngokuqhubekayo
· Ngezicelo ezifuna ukusebenza okuphezulu
Mveliso Inzuzo
Imveliso yi-epoxy resin encapsulant, efanelekileyo kwizicelo ezifuna iimpawu zokuphatha kakuhle. Component encapsulation glue, esetyenziselwa PCB board ebuthathaka ukupakishwa iplagi-in, ebalaseleyo uzinzo viscosity, lula ukulawula ubukhulu iglu. I-epoxy resin encapsulants yenzelwe izicelo ezifuna iimpawu zokuphatha ezigqwesileyo. Isetyenziselwa ukupakishwa kwe-IC kunye ne-semiconductor, inamandla omjikelezo wokushisa, kwaye izinto eziphathekayo ziyakwazi ukumelana nokutshatyalaliswa kwe-thermal ngokuqhubekayo ukuya kwi-177 ° C.
