1. Ikhaya
  2.  >
  3. imveliso
  4.  >
  5. I-Adhesive Conductive yoMbane

I-Adhesive Conductive yoMbane

I-DeepMaterial Conductive silver adhesive yi-adhesive modified epoxy / silicone adhesive eyenzelwe ukupakishwa kwesekethe edibeneyo kunye nemithombo yokukhanya emitsha ye-LED, ibhodi yesekethe eguquguqukayo (FPC) amashishini. Emva kokunyanga, imveliso ine-conductivity ephezulu yombane, ukuqhuba ubushushu, ukumelana nobushushu obuphezulu kunye nokunye okuthembekileyo kokusebenza. Imveliso ifanelekile kwi-high-speed dispensation, inikezela ukukhuselwa kohlobo oluhle, akukho deformation, akukho ukuwa, akukho ukusabalalisa; Izinto eziphilisiweyo zixhathisa ukufuma, ukushisa kunye nokushisa okuphezulu. Ingasetyenziselwa ukupakishwa kwekristale, ukupakishwa kwetshiphu, ukuhlangana kwekristale eyomeleleyo ye-LED, i-welding yobushushu obuphantsi, ukhuselo lwe-FPC kunye nezinye iinjongo.

I-Conductive yeSiliva enamathelayo yokuKhethwa kweMveliso

Umgca womkhiqizo Igama lemveliso Product Eqhelekileyo Isicelo
I-Adhesive yeSiliva eqhubayo I-DM-7110 Isetyenziswa kakhulu kwi-IC chip bonding. Ixesha lokuncamathela lifutshane kakhulu, kwaye akusayi kubakho zingxaki zokuzoba ngomsila okanye ngocingo. Umsebenzi wokudibanisa unokugqitywa ngeyona nto encinci yokubambelela, egcina kakhulu iindleko zokuvelisa kunye nenkunkuma. Ifanelekile kwi-adhesive dispensation ngokuzenzekelayo, inesantya esilungileyo sokukhupha i-adhesive, kwaye iphucula umjikelo wemveliso.
I-DM-7130 Isetyenziswa kakhulu kwi-LED chip bonding. Ukusebenzisa idosi encinci yokuncamathelisa kunye nexesha elincinci lokuhlala lokuncamathela iikristale aziyi kubangela iingxaki zokutsala umsila okanye ucingo, ukonga kakhulu iindleko zokuvelisa kunye nenkcitho. Ifanelekile kwi-adhesive encamathelayo ngokuzenzekelayo, enesantya esiphezulu sokuphuma kwe-adhesive, kunye nokuphucula ixesha lomjikelo wemveliso. Xa isetyenziswe kwishishini lokupakisha le-LED, izinga lokukhanya okufileyo liphantsi, izinga lesivuno liphezulu, ukubola kokukhanya kulungile, kunye nesantya se-degumming siphantsi kakhulu.
I-DM-7180 Isetyenziswa kakhulu kwi-IC chip bonding. Yenzelwe izicelo ezinobushushu obufuna ukunyangwa kobushushu obuphantsi. Ixesha lokuncamathela lifutshane kakhulu, kwaye akusayi kubakho zingxaki zokuzoba ngomsila okanye ngocingo. Umsebenzi wokudibanisa unokugqitywa ngeyona nto encinci yokubambelela, egcina kakhulu iindleko zokuvelisa kunye nenkunkuma. Ifanelekile kwi-adhesive dispensation ngokuzenzekelayo, inesantya esilungileyo sokukhupha i-adhesive, kwaye iphucula umjikelo wemveliso.