inkcazelo
Imigaqo yokucaciswa kweMveliso
| Model Model |
Igama lemveliso |
umbala |
UMbane oQhelekileyo
Viscosity (cps) |
Ixesha lokuphumla |
ukusebenzisa |
Umahluko |
| I-DM-6513 |
Epoxy underfill bonding ancamathele |
Opaque Creamy Yellow |
3000 ~ 6000 |
@ 100℃
30min
120℃ 15min
150℃ 10min |
I-CSP enokusetyenziswa kwakhona (i-FBGA) okanye i-BGA yokugcwalisa |
I-adhesive ye-epoxy resin yecandelo elinye yi-resin enokuphinda isetyenziswe i-CSP (FBGA) okanye i-BGA. Iphilisa ngokukhawuleza yakuba ishushu. Yenzelwe ukubonelela ngokukhuselekileyo ukukhusela ukusilela ngenxa yoxinzelelo lomatshini. I-viscosity ephantsi ivumela izithuba zokuzalisa phantsi kwe-CSP okanye i-BGA. |
| I-DM-6517 |
Epoxy ezantsi filler |
Mnyama |
2000 ~ 4500 |
@ 120℃ 5min 100℃ 10min |
CSP (FBGA) okanye BGA ezaliswe |
Inxalenye enye, i-thermosetting epoxy resin yiCSP ephinda isetyenziswe (FBGA) okanye i-BGA filler esetyenziselwa ukukhusela amalungu e-solder kuxinzelelo lomatshini kwi-elektroniki ephathwayo. |
| I-DM-6593 |
Epoxy underfill bonding ancamathele |
Mnyama |
3500 ~ 7000 |
@ 150℃ 5min 165℃ 3min |
Ukupakishwa kweCapillary egcwele ubungakanani beChip |
Unyango olukhawulezayo, ulwelo olukhawulezayo lwe-epoxy resin, eyenzelwe ukugcwala kwe-capillary yokugcwalisa ubungakanani be-chip. Yenzelwe isantya senkqubo njengomba ophambili kwimveliso. Uyilo lwayo lwe-rheological luyivumela ukuba ingene kwi-gap ye-25μm, inciphise uxinzelelo olubangelwayo, iphucule ukusebenza kwebhayisikile yobushushu, kwaye ibe nokuchasana kweekhemikhali. |
| I-DM-6808 |
I-epoxy underfill adhesive |
Mnyama |
360 |
@130℃ 8min 150℃ 5min |
CSP (FBGA) okanye BGA ezantsi gcwalisa |
Isincamathelisi sokuzaliswa ngaphantsi kweklasikhi kunye ne-viscosity ephantsi kakhulu kuninzi lwezicelo ezingagcwaliswanga. |
| I-DM-6810 |
Reworkable epoxy underfill ancamathelisi |
Mnyama |
394 |
@130℃ 8min |
Reusable CSP (FBGA) okanye BGA ezantsi
isihluzi |
I-epoxy primer enokusetyenziswa kwakhona yenzelwe i-CSP kunye nezicelo ze-BGA. Iphilisa ngokukhawuleza kumaqondo obushushu aphakathi ukunciphisa uxinzelelo kwamanye amacandelo. Nje ukuba uphilisiwe, izinto zineempawu ezibalaseleyo zoomatshini ukukhusela amalungu e-solder ngexesha lokuhamba ngebhayisikile eshushu. |
| I-DM-6820 |
Reworkable epoxy underfill ancamathelisi |
Mnyama |
340 |
@130℃ 10min 150℃ 5min 160℃ 3min |
Reusable CSP (FBGA) okanye BGA ezantsi
isihluzi |
Ukuzaliswa kwakhona okungasetyenziswanga kwakhona kuyilelwe ngokukodwa usetyenziso lwe-CSP, i-WLCSP kunye ne-BGA. Yenzelwe ukunyanga ngokukhawuleza kumaqondo obushushu aphakathi ukunciphisa uxinzelelo kwamanye amacandelo. Izinto eziphathekayo zinobushushu obuphezulu beglasi yokutshintsha kunye nokuqina okuphezulu kwe-fracture ukwenzela ukukhuselwa kakuhle kwamalungu e-solder ngexesha lokuhamba ngebhayisikili eshushu. |
Iziphumo zomkhiqizo
| Ukuhlaziywa |
Ukunyanga ngokukhawuleza kumaqondo obushushu aphakathi |
| Ubushushu bokutshintsha kweglasi ephezulu kunye nobunzima bokwaphuka okuphezulu |
I-viscosity ephantsi kakhulu kwizicelo ezininzi ezingagcwaliswanga |
Mveliso Inzuzo
Yi-CSP ephinda isetyenziswe (FBGA) okanye i-BGA filler esetyenziselwa ukukhusela amalungu e-solder kuxinzelelo lomatshini kwizixhobo zombane eziphathwayo. Iphilisa ngokukhawuleza yakuba ishushu. Yenzelwe ukubonelela ngokhuseleko olufanelekileyo malunga nokungaphumeleli ngenxa yoxinzelelo lomatshini. I-viscosity ephantsi ivumela izithuba ukuba zizaliswe phantsi kwe-CSP okanye i-BGA.
