Inxalenye enye ye-Epoxy Adhesive
I-DeepMaterial enye inxalenye ye-Epoxy Adhesive
I-DeepMaterial's One Part Epoxy Adhesive luhlobo lokuncamathelisa olubandakanya icandelo elinye. Le ngcina yenzelwe ukunyanga kunye nokwenza ibhondi eyomeleleyo kwindawo yokushisa okanye ngokusetyenziswa kobushushu.
I-DeepMaterial's One Part Epoxy Adhesives isekwe kwi-epoxy resin, eyipolymer eguquguquka kakhulu kwaye ehlala ixesha elide. I-adhesive yenziwe nge-agent ephilisayo okanye i-catalyst ehlala ipholile de ibe ibonakaliswe kwiimeko ezithile, ezifana nomoya, ukufuma, okanye ukushisa. Emva kokuba isebenze, i-agent ephilisayo iqala ukusabela kweekhemikhali kunye ne-epoxy resin, ekhokelela ekudibaneni kwe-polymer chain kunye nokwakhiwa kwebhondi eyomeleleyo, ehlala ixesha elide.
Izinto eziluncedo zecandelo elinye le-Epoxy Adhesive
Ukuzonwabisa: Ezi zincamathelisi zilungele ukusetyenziswa ngokuthe ngqo kwisitya, zisusa imfuno yokuxuba okuchanekileyo kwamacandelo ahlukeneyo. Oku kwenza kube lula ukuphatha kwaye kunciphisa amathuba okudityaniswa okungalunganga.
Ukonga ixesha: I-adhesive iphilisa kwiqondo lokushisa okanye ngesicelo esincinci sokushisa, okuvumela ukudibanisa ngokukhawuleza kunye neenkqubo zokuvelisa xa kuthelekiswa ne-adhesives ezifuna ixesha elide lokunyanga okanye ukunyanga kwiqondo lokushisa eliphakamileyo.
Amandla okudibanisa okugqwesileyo: I-adhesives inika amandla okubambisana okuphezulu kuluhlu olubanzi lwee-substrates, ezibandakanya isinyithi, iiplastiki, iiseramics, kunye nee-composites. Banika i-chear egqwesileyo, i-peel, kunye nokuchasana kwempembelelo, okukhokelela kwiibhondi ezihlala ixesha elide kunye nexesha elide.
Ukuchasana nobushushu: Ezi zincamathelisi zibonisa ukuxhathisa okulungileyo kumaqondo obushushu aphakamileyo, ukugcina amandla abo ebhondi kunye nokuzinza nakwiindawo eziphakamileyo zobushushu. Banokumelana nokuhamba ngebhayisikile eshushu kwaye banikeze ukusebenza okuthembekileyo kuluhlu olubanzi lobushushu.
Ukumelana nechemical: I-adhesives iyamelana neekhemikhali ezahlukeneyo, i-solvents, kunye nemiba yokusingqongileyo, ezenza zilungele ukusetyenziswa apho ukuvezwa kweekhemikhali ezinzima okanye iimeko zokusingqongileyo kulindeleke.
Ukungafani: Inxalenye enye ye-Epoxy Adhesives ifumana izicelo kumashishini ahlukeneyo, kubandakanywa iimoto, i-aerospace, i-electronics, ukwakhiwa, kunye nokuveliswa ngokubanzi. Zisetyenziselwa ukudibanisa amacandelo, ukutywinwa kwamalungu, i-electronic encapsulating, kunye nokulungisa izinto ezonakalisiweyo.
Inxalenye enye Epoxy Adhesive Applications
Inxalenye enye ye-Epoxy Adhesives inoluhlu olubanzi lwezicelo kuwo wonke amashishini ahlukeneyo. ziquka:
Umzi mveliso wezithuthi: Ezi zincamathelisi zisetyenziselwa ukudityaniswa kwezixhobo kwindibano yemoto, njengokuncamathisela iziqwenga zetrim, iiplasitiki ezibophelelayo okanye iinxalenye zentsimbi, kunye nokukhusela izinto zombane.
Umzi-mveliso we-elektroniki: I-adhesive isetyenziselwa i-encapsulating kunye ne-bonding amacandelo e-elektroniki, ukutywinwa kweebhodi zeesekethe, izidibanisi ze-potting, kunye ne-bonding heat sinks.
Umzi mveliso weAerospace: Ezi zincamathelisi zisetyenziselwa ukudibanisa izinto ezidityanisiweyo, izakhiwo zentsimbi, kunye namalungu angaphakathi kwimveliso yeenqwelomoya. Zikwasetyenziselwa ukulungisa iindawo zenqwelomoya.
Umzi mveliso wokwakha: I-adhesive fumana isicelo kwicandelo lolwakhiwo lokudibanisa ikhonkrithi, ilitye, iithayile ze-ceramic, kunye nezinye izinto zokwakha. Zisetyenziselwa ukudibanisa izakhiwo, i-anchoring, kunye nokulungisa izakhiwo zekhonkrithi.
Imveliso ngokubanzi: Ezi zincamathelisi zisetyenziswa kwiinkqubo ezahlukeneyo zokwenziwa, kubandakanywa ukudityaniswa kwamalungu esinyithi, ukufakwa okukhuselekileyo okanye iziqhoboshi, izixhobo zeplastiki ezibophelelayo, kunye nezicelo zendibano jikelele.
Ushishino lwaselwandle: Inxalenye enye ye-Epoxy Adhesives ifanelekile ukudibanisa kunye nokulungiswa kweenqanawa zeenqanawa, iidekhi, kunye nezinye izinto zaselwandle. Zinika ukuxhathisa okubalaseleyo emanzini, ityuwa, kunye nemekobume yaselwandle.
Icandelo lezombane: Ezi zincamathelisi zisetyenziselwa ukudibanisa kunye nokugquma izinto zombane, iziguquli zembiza, iingcingo zokukhusela kunye neentambo, kunye nokufaka i-electronic assemblies.
Icandelo lezonyango: I-adhesive ifumana izicelo kwimveliso yezixhobo zonyango, ezifana nezixhobo zonyango ezibophelelayo, ukudibanisa izixhobo zotyando, kunye nokukhusela amacandelo kwizixhobo zonyango.
Izicelo ze-DIY kunye nekhaya: Ezi zincamathelisi zidla ngokusetyenziswa kwiiprojekthi ezahlukeneyo ze-DIY kunye nokulungiswa kwendlu, njengentsimbi edibeneyo, iplastiki, iplanga, i-ceramics, kunye neglasi.
I-DeepMaterial ibambelela kuphando kunye nophuhliso lwengcamango "yentengiso kuqala, kufuphi nendawo", kwaye inikezela abathengi ngeemveliso ezibanzi, inkxaso yesicelo, uhlalutyo lwenkqubo kunye neefomyula ezenziwe ngokwezifiso ukuhlangabezana neemfuno eziphezulu zabathengi, ixabiso eliphantsi kunye nokhuseleko lokusingqongileyo.
Inxalenye enye yeEpoxy Adhesive Product Selection
| Iintlobo zeemveliso | Igama lemveliso | Isicelo esiqhelekileyo semveliso |
| Ukuzaliswa kweChip emazantsi |
I-DM-6180 | Ubushushu obuphantsi bokunyanga iimveliso ze-epoxy adhesive series ziyilelwe ukudibanisa kunye nokulungiswa kwezixhobo ezibuthathaka kubushushu. Ziyakwazi ukunyangwa ngaphantsi kwe-80 ℃ kwaye zibe nokubambelela kakuhle kwizinto ezahlukeneyo ngexesha elifutshane. |
| I-DM-6307 | I-epoxy primer, ekwaziyo ukunyanga ngokukhawuleza kwiqondo lokushisa eliphantsi kunye nokunciphisa uxinzelelo kwamanye amalungu. Emva kokunyanga, inokubonelela ngeempawu ezibalaseleyo zoomatshini kwaye ikhusele amajoyina e-solder phantsi kweemeko zokujikeleza nge-thermal. Ifanelekile kwi-BGA/CSP yokupakisha i-chip ezantsi yokuzalisa ukhuseleko. | |
| I-DM-6320 | Isihluzi esisezantsi senzelwe ngokukodwa inkqubo yokupakisha ye-BGA/CSP. Iyakwazi ukuqinisa ngokukhawuleza kwiqondo lokushisa elifanelekileyo ukunciphisa uxinzelelo lwe-thermal ye-chip kunye nokuphucula ukuthembeka kwe-solder joint phantsi kweemeko ezibandayo kunye nezishushu zebhayisikili. | |
| I-DM-6308 | I-primer ye-epoxy yecandelo elinye lokwenziwa kwesikrini se-LED se-splicing kwinkqubo yokupakisha ye-COB. Imveliso ine-viscosity ephantsi, i-adhesion efanelekileyo kunye namandla aphezulu okugoba, anokuthi azalise ngokukhawuleza kwaye ngokufanelekileyo isithuba esincinci phakathi kweetshiphusi kunye nokuphucula ngokufanelekileyo ukuthembeka kokunyuka kwe-chip. | |
| I-DM-6303 | I-primer ye-epoxy yecandelo elinye lokwenziwa kwesikrini se-LED se-splicing kwinkqubo yokupakisha ye-COB. Imveliso iphantsi i-viscosity, i-adhesion efanelekileyo kunye namandla aphezulu okugoba, anokuthi azalise ngokukhawuleza kwaye ngokufanelekileyo umsantsa omncinci phakathi kweetshiphusi kunye kuphucula ngokufanelekileyo ukuthembeka kokunyuswa kwetshiphu. | |
Izixhobo ezinovakalelo |
I-DM-6109 | Ubushushu obuphantsi bokunyanga iimveliso ze-epoxy adhesive series ziyilelwe ukudibanisa kunye nokulungiswa kwezixhobo ezibuthathaka kubushushu. Ziyakwazi ukunyangwa ngaphantsi kwe-80 ℃ kwaye zibe nokubambelela kakuhle kwizinto ezahlukeneyo ngexesha elifutshane. |
| I-DM-6120 | Ubushushu obuphantsi bokunyanga iimveliso ze-epoxy adhesive series ziyilelwe ukudibanisa kunye nokulungiswa kwezixhobo ezibuthathaka kubushushu. Ziyakwazi ukunyangwa ngaphantsi kwe-80 ℃ kwaye zibe nokubambelela kakuhle kwizinto ezahlukeneyo ngexesha elifutshane. | |
| Chip Edge Gcwalisa | I-DM-6310 | I-epoxy primer, ekwaziyo ukunyanga ngokukhawuleza kwiqondo lokushisa eliphantsi kunye nokunciphisa uxinzelelo kwamanye amalungu. Emva kokunyanga, inokubonelela ngeempawu ezibalaseleyo zoomatshini kwaye ikhusele amajoyina e-solder phantsi kweemeko zokujikeleza nge-thermal. Ifanelekile kwi-BGA/CSP yokupakisha i-chip ezantsi yokuzalisa ukhuseleko. |
| LED Chip Fixed | I-DM-6946 | I-Composite epoxy resin yimveliso ephuhliswe ukuhlangabezana neteknoloji yokupakisha ephezulu ye-LED kwimarike. Ilungele ukupakishwa kwe-LED eyahlukeneyo kunye nokuqina. Emva kokunyanga, inoxinzelelo oluphantsi lwangaphakathi, ukunamathela okuqinileyo, ukumelana nobushushu obuphezulu, ukutyheli okuphantsi, kunye nokumelana nemozulu entle. |
| I-NR Inductance | I-DM-6971 | I-adhesive ye-epoxy yecandelo elinye eyenzelwe ngokukodwa i-NR inductance coil encapsulation. Imveliso inokuhambisa okugudileyo, isantya sokunyanga ngokukhawuleza, isiphumo esihle sokubumba, kwaye iyahambelana nazo zonke iintlobo zamasuntswana kazibuthe. |
| Ukupakishwa kweChip | I-DM-6221 | I-adhesive ye-epoxy resin enento enye ene-shrinkage yokunyanga ephantsi, amandla aphezulu okunamathela kunye nokunamathela okulungileyo kwizinto ezininzi. Kufanelekile ukugcwalisa kunye nokutywinwa kwezinto ezahlukeneyo ze-elektroniki ezichanekileyo, ezisetyenziselwa ukugcwalisa kunye nokutywinwa kweenzwa zemoto kunye neebhodi zoqhagamshelwano ze-elektroniki. |
| Imveliso yombane Packaging |
I-DM-6950 | I-adhesive ye-epoxy yecandelo elinye eyenzelwe ngokukodwa ukufaka i-bonding structure yeemveliso ze-photoelectric. Le mveliso ifanelekile ukunyanga okuphantsi kobushushu kwaye inokubambelela kakuhle kwizinto ezahlukeneyo ngexesha elifutshane, ngakumbi iimveliso zeplastiki. |
Iphepha leDatha yeMveliso yeCandelo elinye le-Epoxy Adhesive
