I-DeepMaterial Electronic Adhesive Pruducts
I-DeepMaterial, njengomvelisi wokuncamathelisa we-epoxy kwimizi-mveliso, siphulukana nophando malunga nokuzaliswa ngaphantsi kwe-epoxy, iglu engaqhubekiyo kwizinto zombane, i-epoxy engaqhubekiyo, izinto zokuncamathelisa kwindibano ye-elektroniki, i-adhesive engagcwalisiyo, i-refractive index epoxy. Ngokusekwe kuloo nto, sinetekhnoloji yamva nje yokuncamathelisa kwi-industrial epoxy.
I-DeepMaterial iphuhlise izinto zokuncamathelisa kwimizi-mveliso yokupakishwa kwetshiphu kunye novavanyo, izinto zokuncamathelisa kwinqanaba lebhodi yesekethe, kunye nokuncamatheliswa kweemveliso zombane. Ngokusekwe kwizinto ezincamathelayo, iye yaphuhlisa iifilimu ezikhuselayo, izihluzi zesemiconductor, kunye nezixhobo zokupakisha zokusetyenzwa kwe-wafer semiconductor kunye nokupakishwa kwechip kunye novavanyo.
Ukubonelela ngezinto zokuncamathelisa zombane kunye nefilimu ecekethekileyo yeemveliso zezixhobo zombane kunye nezisombululo kwiinkampani zonxibelelwano, iinkampani ze-elektroniki zabathengi, iinkampani zokupakisha ze-semiconductor kunye nokuvavanya, kunye nabavelisi bezixhobo zonxibelelwano, ukusombulula aba bathengi bakhankanywe ngasentla ekukhuseleni inkqubo, imveliso echanekileyo ephezulu. , kunye nokusebenza kombane.
I-DeepMaterial ibonelela ngeentlobo ezahlukeneyo zeemveliso malunga nokuncamatheliswa kweshishini lombane, i-UV ephilisa i-UV encamathelayo, uhlobo olusebenzayo lokuncamathelisa okutshisayo okunyibilikayo kunye noxinzelelo olubuthathaka lokuncamathela okunyibilikayo, i-epoxy-based chip underfill kunye ne-COB encapsulation series, ibhodi yokukhusela ibhodi yesekethe kunye ne-conformal coating ancamatheliswayo. series, epoxy based conductive silver adhesive series, structural bonding adhesive series, functional ekhuselayo film series, semiconductor ekhuselayo series film.
Isincamathelisi esiSetyenzisiweyo kwiMfuno
I-Deepmaterial itsalwa kwiitekhnoloji ezahlukeneyo zokuncamathelisa ukubonelela ngezisombululo zokuncamathela, ukutywina kunye nokufaka izicelo. Sibonelela ngeenkonzo zokuncamathelisa ezilungiselelweyo ngokwemfuno yakho, izinto zokuncamathelisa zombane zesiko, iPUR yokuncamathela yesakhiwo, i-UV encamathelayo ukufuma, incatho ye-epoxy, iglue yesilivere eqhubayo, i-epoxy encapsulant encamathelayo, ifilimu ekhuselayo esebenzayo, ifilimu ekhuselayo yesemiconductor.
Epoxy underfill chip kwinqanaba lokuncamathelisa
Le mveliso iyinxalenye yobushushu obunyanga i-epoxy ngokubambelela kakuhle kuluhlu olubanzi lwezinto. I-classic underfill adhesive ene-ultra-low viscosity efanelekileyo kwizicelo ezininzi zokungagcwaliswa. I-epoxy primer enokusetyenziswa kwakhona yenzelwe i-CSP kunye nezicelo ze-BGA.
Iglu yesilivere yeconductive yokupakishwa kwetshiphu kunye nokudibanisa
Udidi lweMveliso: I-Conductive Silver Adhesive
Iimveliso zeglue zesilivere eziguquguqukayo zinyangelwe nge-conductivity ephezulu, i-thermal conductivity, ukumelana nobushushu obuphezulu kunye nokunye ukuthembeka okuphezulu. Imveliso ifanelekile kwi-high-speed dispensation, ihambisa ukuhambelana kakuhle, i-glue point ayiguquki, ayidibanisi, ayisasazeki; unyange ukufuma kwezinto, ubushushu, ukuxhathisa ubushushu obuphezulu kunye obuphantsi. 80 ℃ ubushushu obuphantsi bokunyanga ngokukhawuleza, ukuhanjiswa kombane okulungileyo kunye nokuhanjiswa kwe-thermal.
Ukufuma kwe-UV okuPhila okuPhila kweAdhesive
Iglu ye-Acrylic engaphumi, i-UV emanzi kabini-yonyango i-encapsulation efanelekileyo yokukhusela ibhodi yesekethe yendawo. Le mveliso fluorescent phantsi UV (Black). Ikakhulu isetyenziselwa ukhuseleko lwendawo lweWLCSP kunye neBGA kwiibhodi zesekethe. I-silicone ye-Organic isetyenziselwa ukukhusela iibhodi zesekethe eziprintiweyo kunye namanye amacandelo e-elektroniki abuthathaka. Yenzelwe ukubonelela ngokhuseleko lokusingqongileyo. Imveliso idla ngokusetyenziswa ukusuka ku -53°C ukuya kuma-204°C.
Ubushushu obuphantsi bokunyanga i-epoxy adhesive kwizixhobo ezibuthathaka kunye nokhuseleko lwesekethe
Olu luhlu luyi-resin ye-epoxy ephilisa ukushisa okuphantsi kweqondo lokushisa eliphantsi kunye nokunamathela okulungileyo kuluhlu olubanzi lwezixhobo ngexesha elifutshane kakhulu. Usetyenziso oluqhelekileyo luquka iimemori khadi, iiseti zenkqubo yeCCD/CMOS. Ngokukodwa afaneleke kumacandelo e-thermosensitive apho kufuneka amaqondo obushushu aphantsi onyango.
Amacandelo amabini e-Epoxy Adhesive
Imveliso iphilisa kwiqondo lobushushu begumbi ukuya elubala, umaleko wokuncamathela ophantsi ocuthekileyo onempembelelo entle yokuchasa. Xa iphiliswe ngokupheleleyo, i-epoxy resin iyaxhathisa kuninzi lweekhemikhali kunye nezinyibilikisi kwaye inozinzo olulungileyo lwedimensional kuluhlu olubanzi lobushushu.
I-PUR yokuncamathela yesakhiwo
Imveliso licandelo elinye elimanzi-curred reactive polyurethane hot-melt adhesive. Isetyenziswe emva kokufudumeza imizuzu embalwa de inyibilike, kunye namandla alungileyo ebhondi emva kokupholisa imizuzu embalwa kwiqondo lobushushu begumbi. Kwaye ixesha elivulekileyo eliphakathi, kunye nobude obubalaseleyo, ukudibanisa ngokukhawuleza, kunye nezinye izibonelelo. Product ukufuma chemical reaction ukunyanga emva kweeyure ezingama-24 yi-100% umxholo eqinileyo, kwaye ayinakuguqulwa.
I-Epoxy Encapsulant
Imveliso inokumelana nemozulu ebalaseleyo kwaye ikwazi ukuziqhelanisa nendalo. Ukusebenza okugqwesileyo kokufakelwa kombane, kunokuphepha ukusabela phakathi kwamacandelo kunye nemigca, i-repellent ekhethekileyo yamanzi, inokuthintela amacandelo ukuba achaphazeleke ngumswakama kunye nomswakama, ubuchule obuhle bokutshatyalaliswa kobushushu, kunokunciphisa ubushushu bezinto zombane ezisebenzayo, kunye nokwandisa ubomi benkonzo.
Ifilimu yokuNcitshiswa kweGlasi ye-UV ye-Optical
Ifilimu ye-DeepMaterial yeglasi ye-UV yokunciphisa i-UV ibonelela nge-birefringence ephantsi, ukucaca okuphezulu, ubushushu obuhle kakhulu kunye nokumelana nokufuma, kunye noluhlu olubanzi lwemibala kunye nobukhulu. Sikwabonelela ngemiphezulu echasene ne-glare kunye neengubo eziqhubayo zeefilitha ze-acrylic laminated.
Ifilimu yoKhuseleko lweglasi ye-Anti-static
Imveliso ifilimu yokukhusela i-anti-static ecocekileyo, imveliso yomatshini kunye nokuzinza kobukhulu, kulula ukukrazula kunye nokukrazula ngaphandle kokushiya i-adhesive eseleyo. Inokumelana kakuhle nokushisa okuphezulu kunye nokukhupha. Ifanelekile ukuhanjiswa kwezinto, ukukhuselwa kwepaneli kunye nezinye iimeko zokusetyenziswa.
Umkhuseli wesikrini
Udidi lweMveliso: uMkhuseli weSkrini
Umboniso womthengi wombane/umkhuseli wekhusi
·Ukumelana nokurhawuka
· Ukumelana neekhemikhali
· Ukumelana nemikrwelo
· Ukumelana ne-UV
I-LED Scribing / Turning Crystal / Reprinting Semiconductor PVC Protective Film
I-LED Scribing / Turning Crystal / Reprinting Semiconductor PVC Protective Film
Ukupakishwa kweSemiconductor kunye noVavanyo lwe-UV yokuNcitshiswa kweViscosity yeFilimu eKhethekileyo
Imveliso isebenzisa i-PO njengento yokukhusela indawo, esetyenziselwa ukusika i-QFN, i-SMD microphone substrate cutting, i-FR4 substrate cutting (LED).
