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5. I-Epoxy Adhesive

I-Epoxy Adhesive

I-DeepMaterial inikezela nge-capillary flow underfills entsha kwi-flip chip, i-CSP kunye nezixhobo ze-BGA. I-DeepMaterial entsha ye-capillary flow flow underfill i-fluidity ephezulu, i-high-purity, i-component-component potting materials eyenza i-uniform, i-void-free underfill layers ephucula ukuthembeka kunye neempawu ze-mechanical zamacandelo ngokuphelisa uxinzelelo olubangelwa yi-solder materials. I-DeepMaterial ibonelela ngemixube yokuzaliswa ngokukhawuleza kweendawo ezintle kakhulu, ukukwazi ukunyanga ngokukhawuleza, ukusebenza ixesha elide kunye nobomi, kunye nokusebenza kwakhona. Ukuphinda kusetyenzwe kwakhona konga iindleko ngokuvumela ukususwa kokugcwalisa ukuze kuphinde kusetyenziswe ibhodi.

Indibano ye-Flip chip ifuna ukukhululeka koxinzelelo lwe-welding seam kwakhona ukuguga okwandisiweyo kunye nobomi bomjikelezo. I-CSP okanye indibano ye-BGA ifuna ukusetyenziswa kokungagcwaliswa kakuhle ukuze kuphuculwe ingqibelelo yomatshini wendibano ngexesha le-flex, i-vibration okanye uvavanyo lokulahla.

I-DeepMaterial's flip-chip underfills inomxholo ophezulu wokuzalisa ngelixa igcina ukuhamba okukhawulezayo kwiipatshi ezincinci, kunye nokukwazi ukuba nobushushu obuphezulu beglasi kunye nemodyuli ephezulu. Ukuzaliswa ngaphantsi kwe-CSP yethu kufumaneka kumanqanaba ahlukeneyo okuzalisa, akhethelwe ubushushu beglasi yokutshintsha kunye nemodyuli yesicelo esicetywayo.

I-COB encapsulant ingasetyenziselwa ukudibanisa ucingo ukubonelela ukhuseleko lokusingqongileyo kunye nokwandisa amandla omatshini. Ukutywinwa okukhuselekileyo kwee-chips eziboshwe ngocingo kubandakanya i-encapsulation ephezulu, i-cofferdam, kunye nokuzaliswa kwesithuba. Izincamathelisi ezinomsebenzi wokuqukuqela ocoliweyo ziyafuneka, kuba amandla azo okuhamba kufuneka aqinisekise ukuba iingcingo zifakwe ecapsulat, kwaye i-adhesive ayisayi kuphuma kwi-chip, kwaye iqinisekise ukuba ingasetyenziselwa ukukhokelela kwipitch entle kakhulu.

I-DeepMaterial's COB encapsulating adhesives can be thermally or UV inyangelwe i-DeepMaterial's COB encapsulation adhesive inokunyangwa ubushushu okanye i-UV-inyangelwe ngokuthembeka okuphezulu kunye ne-thermal coefficient yokudumba, kunye nobushushu obuphezulu beglasi kunye nomxholo we-ion ophantsi. I-DeepMaterial's COB encapsulating adhesives ikhusela ii lead kunye neplumbum, i-chrome kunye ne-silicon wafers ukusuka kwindawo yangaphandle, umonakalo womatshini kunye nokubola.

I-DeepMaterial COB encapsulating adhesives yenziwe nge-epoxy yokunyanga ukushisa, i-acrylic yokunyanga i-UV, okanye iikhemistri ze-silicone ukwenzela ukugquma kombane okulungileyo. I-DeepMaterial COB encapsulating adhesives inika uzinzo oluphezulu lobushushu kunye nokumelana nokothuka kwe-thermal, iipropathi zokuthintela umbane kuluhlu olubanzi lobushushu, kunye nokuncipha okuncinci, uxinzelelo oluphantsi, kunye nokuxhathisa imichiza xa uphilisiwe.

I-deepmaterial yeyona igqwesileyo yeglu encamathelayo engangenwa manzi yeplastiki ukuya kwintsimbi kunye nomenzi weglasi, ubonelele ngeglu encamathelayo epoxy encamathelayo encamathelayo yokuncamathelisa izinto zombane zepcb, izinto zokuncamathelisa zesemiconductor zokudityaniswa kwe-elektroniki, ubushushu obuphantsi bonyango lwe-bga flip chip underfill pcb epoxy process glue material and so. kwi

I-DeepMaterial ye-Epoxy Resin Isiseko seChip eZantsi zokuzalisa kunye neTheyibhile yoKhetho lweMathiriyeli yokuPakisha
UKhetho lweMveliso yokungazaliseki kweEpoxy

UKhetho lweMveliso ye-OLED Edge Banding

UKhetho lweMveliso encamathelayo yokuPakisha ecinezelekileyo

UKhetho lweMveliso yeAdhesive yokuPakisha ecinezelweyo ngokushushu

NR Magnetic UKhetho lweMveliso encamathelayo

UKhetho lweMveliso yoKhetho lweMveliso yoMgqumo oKhuselekileyo wokugquma