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Gcwalisa i-Epoxy

I-underfill epoxy iwuhlobo lokunamathelayo olusetshenziselwa ukuthuthukisa ukwethembeka kwezingxenye ze-elekthronikhi, ikakhulukazi ezinhlelweni zokupakisha ze-semiconductor. Igcwalisa igebe phakathi kwephakheji kanye nebhodi lesifunda eliphrintiwe (PCB), linikeza ukusekela komshini kanye nokukhululeka kwengcindezi ukuvimbela ukwanda kokushisa nokulimala kokufinyela. I-underfill epoxy iphinde ithuthukise ukusebenza kukagesi kwephakheji ngokunciphisa inductance ye-parasitic kanye nekhono. Kulesi sihloko, sihlola ukusetshenziswa okuhlukahlukene kwe-underfill epoxy, izinhlobo ezahlukene ezitholakalayo, kanye nezinzuzo zazo.

Ukubaluleka kwe-Underfill Epoxy ku-Semiconductor Packaging

I-underfill epoxy ibalulekile ekufakweni kwe-semiconductor, ihlinzeka ngokuqiniswa kwemishini nokuvikela ezingxenyeni ze-microelectronic ezintekenteke. Kuyinto enamathelayo ekhethekile esetshenziselwa ukugcwalisa igebe phakathi kwe-chip ye-semiconductor ne-substrate yephakheji, okuthuthukisa ukuthembeka nokusebenza kwemishini kagesi. Lapha, sizohlola ukubaluleka kokugcwaliswa kwe-epoxy ekufakweni kwe-semiconductor.

Omunye wemisebenzi eyinhloko ye-epoxy engagcwaliswanga ngokwanele ukuthuthukisa amandla emishini nokuthembeka kwephakheji. Ngesikhathi sokusebenza, ama-semiconductor chips angaphansi kokucindezeleka kwemishini okuhlukahlukene, njengokunwetshwa kokushisa nokufinyela, ukudlidliza, nokushaqeka komshini. Lezi zingcindezi zingaholela ekwakhekeni kokuqhekeka okuhlangene kwe-solder, okungabangela ukwehluleka kukagesi futhi kunciphise impilo yonke yedivayisi. I-underfill epoxy isebenza njenge-ejenti enciphisa ingcindezi ngokusabalalisa ukucindezelwa komshini ngokulinganayo kuyo yonke i-chip, i-substrate, namajoyinti e-solder. Inciphisa ngokuphumelelayo ukwakheka kwemifantu futhi ivimbele ukusakazwa kwemifantu ekhona, iqinisekisa ukwethembeka kwesikhathi eside kwephakheji.

Esinye isici esibalulekile se-underfill epoxy yikhono layo lokuthuthukisa ukusebenza okushisayo kwamadivayisi we-semiconductor. Ukukhishwa kokushisa kuba yinto ekhathazayo kakhulu njengoba izinto zikagesi zincipha ngosayizi futhi zikhuphule ukuminyana kwamandla, futhi ukushisa okudlulele kungase kuthuntubeze ukusebenza nokuthembeka kwe-chip ye-semiconductor. I-underfill epoxy inezinto ezinhle kakhulu zokusebenzisa ukushisa okushisayo, eziyivumela ukuthi idlulise kahle ukushisa kusuka ku-chip futhi isabalalise kulo lonke iphakheji. Lokhu kusiza ukugcina izinga lokushisa elilungile lokusebenza futhi kuvimbele izindawo ezishisayo, ngaleyo ndlela kuthuthukise ukuphathwa okushisayo kwedivayisi.

I-underfill epoxy iphinde ivikele umswakama kanye nokungcola. Ukungena komswakama kungaholela ekugqwaleni, ukuvuza kukagesi, kanye nokukhula kwezinto ezihambisayo, okuholela ekungasebenzini kahle kwedivayisi. I-underfill epoxy isebenza njengesithiyo, ivala izindawo ezisengozini futhi ivimbele umswakama ukuthi ungangeni ephaketheni. Iphinde inikeze isivikelo othulini, ukungcola, nokunye ukungcola okungase kube nomthelela omubi ekusebenzeni kukagesi kwe-chip ye-semiconductor. Ngokuvikela i-chip nokuxhumana kwayo, i-underfill epoxy iqinisekisa ukwethembeka nokusebenza kwesikhathi eside kwedivayisi.

Ngaphezu kwalokho, i-epoxy engagcwalisiwe inika amandla i-miniaturization ekufakweni kwe-semiconductor. Ngesidingo esiqhubekayo samadivayisi amancane nahlangene kakhulu, i-epoxy engagcwaliswanga ngokwanele ivumela ukusebenzisa i-flip-chip nezindlela zokupakisha zesikali se-chip. Lezi zindlela zokwenza zibandakanya ukukhweza i-chip ngokuqondile ku-substrate yephakheji, ukususa isidingo sokubopha izintambo nokunciphisa usayizi wephakheji. I-underfill epoxy inikeza ukusekelwa kwesakhiwo futhi igcina ubuqotho bokusetshenziswa kubonwa kwe-chip-substrate, okuvumela ukuqaliswa okuyimpumelelo kwalobu buchwepheshe bokupakisha obuthuthukile.

I-Underfill Epoxy Ibhekana Kanjani Nezinselele

Ukupakishwa kwe-semiconductor kudlala indima ebalulekile ekusebenzeni kwedivayisi kagesi, ukwethembeka, nokuphila isikhathi eside. Kubandakanya i-encapsulating integrated circuits (ICs) kuma-casings avikelayo, ukuhlinzeka ngoxhumano lukagesi, nokukhipha ukushisa okukhiqizwa ngesikhathi sokusebenza. Kodwa-ke, ukupakishwa kwe-semiconductor kubhekene nezinselelo ezimbalwa, okuhlanganisa ukucindezelwa okushisayo ne-warpage, okungaba nomthelela omkhulu ekusebenzeni nokuthembeka kwamadivayisi apakishiwe.

Enye yezinselele eziyinhloko ukucindezeleka okushisayo. Amasekhethi ahlanganisiwe akhiqiza ukushisa ngesikhathi sokusebenza, futhi ukuchithwa okunganele kungakhuphula izinga lokushisa ngaphakathi kwephakheji. Lokhu kuhlukahluka kwezinga lokushisa kubangela ukucindezeleka okushisayo njengoba izinto ezihlukene ngaphakathi kwephakheji zikhula futhi zinkontileka ngamanani ahlukene. Ukunwetshwa okungeyona into efanayo kanye nokufinyela kungabangela ubunzima bemishini, okuholela ekuhlulekeni kwamalunga e-solder, i-delamination, kanye nokuqhekeka. Ukucindezeleka okushisayo kungafaka engozini ubuqotho bukagesi kanye nemishini yephakheji, ekugcineni kuthinte ukusebenza nokuthembeka kwedivayisi.

I-Warpage enye inselele ebalulekile ekufakweni kwe-semiconductor. I-Warpage isho ukugoba noma ukuguqulwa kwe-substrate yephakheji noma iphakheji lonke. Kungenzeka ngesikhathi senqubo yokupakisha noma ngenxa yokucindezeleka okushisayo. I-Warpage ngokuyinhloko ibangelwa ukungafani kwe-coefficient of thermal expansion (CTE) phakathi kwezinto ezihlukile kuphakheji. Isibonelo, i-CTE ye-silicon die, substrate, ne-mold compound ingase ihluke kakhulu. Uma zingaphansi kokushintsha kwezinga lokushisa, lezi zinto ezisetshenziswayo ziyakhula noma zifinyeleliswe ngamanani ahlukene, okuholela e-warpage.

I-Warpage ibeka izinkinga ezimbalwa zamaphakheji we-semiconductor:

1. Kungabangela amaphuzu okugxilisa ingcindezi, okwandisa amathuba okuhluleka kwemishini futhi kunciphise ukwethembeka kwebhokisi.
2. I-Warpage ingaholela ebunzimeni enqubweni yomhlangano, njengoba ithinta ukuqondanisa kwephakheji nezinye izingxenye, njengebhodi lesifunda eliphrintiwe (PCB). Lokhu kungaboni ngasolinye kungonakalisa ukuxhumana kukagesi futhi kubangele izinkinga zokusebenza.
3. I-Warpage ingaba nomthelela kuyo yonke into yefomu yephakheji, ikwenze kube inselele ukuhlanganisa idivayisi kuzinhlelo zokusebenza zesici esincane noma ama-PCB anabantu abaningi.

Kusetshenziswa amasu namasu ahlukahlukene ekufakweni kwe-semiconductor ukubhekana nalezi zinselele. Lokhu kufaka phakathi ukusebenzisa izinto ezithuthukisiwe ezinama-CTE afanayo ukuze kuncishiswe ingcindezi yokushisa kanye ne-warpage. Ukulingiswa kwe-Thermo-mechanical nokumodela kwenziwa ukuze kubikezelwe ukuziphatha kwephakheji ngaphansi kwezimo ezihlukene zokushisa. Ukulungiswa kwedizayini, okufana nokwethula izakhiwo zokukhulula ingcindezi nezakhiwo ezithuthukisiwe, zisetshenziswa ukuze kuncishiswe ukucindezelwa okushisayo kanye ne-warpage. Ukwengeza, ukuthuthukiswa kwezinqubo zokukhiqiza ezithuthukisiwe kanye nemishini kusiza ukunciphisa ukwenzeka kwe-warpage ngesikhathi sokuhlanganiswa.

Izinzuzo ze-Underfill Epoxy

I-underfill epoxy iyingxenye ebalulekile ekufakweni kwe-semiconductor enikeza izinzuzo ezimbalwa. Le nto ekhethekile ye-epoxy isetshenziswa phakathi kwe-chip ye-semiconductor kanye ne-substrate yephakheji, ihlinzeka ngokuqiniswa komshini kanye nokubhekana nezinselele ezihlukahlukene. Nazi ezinye zezinzuzo ezibalulekile ze-epoxy engagcwalisiwe:

1. Ukuthembeka Komshini Okuthuthukisiwe: Enye yezinzuzo eziyinhloko ze-epoxy engagcwalisi kakhulu amandla ayo okuthuthukisa ukwethembeka komshini wamaphakheji we-semiconductor. I-underfill epoxy idala isibopho esihlangene esithuthukisa ubuqotho besakhiwo ngokugcwalisa izikhala kanye nezikhala phakathi kwe-chip ne-substrate. Lokhu kusiza ukuvimbela i-warpage yephakheji, kunciphisa ubungozi bokuhluleka kwemishini, futhi kuthuthukise ukumelana nezingcindezi zangaphandle ezifana nokudlidliza, ukushaqeka, nokuhamba ngebhayisikili okushisayo. Ukwethenjwa komshini okuthuthukisiwe kuholela ekwenyukeni kokuqina komkhiqizo kanye nempilo ende yedivayisi.
2. I-Thermal Stress Dissipation: Ukugcwalisa i-epoxy kusiza ukuqeda ukucindezeleka okushisayo ngaphakathi kwephakheji. Amasekhethi ahlanganisiwe akhiqiza ukushisa ngesikhathi sokusebenza, futhi ukuchithwa okunganele kungabangela ukuhlukahluka kwezinga lokushisa ngaphakathi kwesiqukathi. I-underfill epoxy material, ene-coefficient yakhona ephansi yokunwetshwa kwe-thermal (CTE) uma iqhathaniswa ne-chip ne-substrate materials, isebenza njengesendlalelo sebhafa. Idonsa ubunzima bemishini obubangelwa ukucindezeleka okushisayo, inciphisa ingozi yokuhluleka kwamalunga e-solder, i-delamination, kanye nokuqhekeka. Ngokuqeda ingcindezi yokushisa, i-epoxy engagcwaliswanga ngokwanele isiza ukugcina ubuqotho bephakheji kagesi nemishini.
3. Ukusebenza Kagesi Okuthuthukisiwe: Ukungagcwalisi kahle kwe-epoxy kunomthelela omuhle ekusebenzeni kukagesi kwamadivayisi we-semiconductor. I-epoxy material igcwalisa izikhala phakathi kwe-chip ne-substrate, inciphisa amandla e-parasitic kanye ne-inductance. Lokhu kubangela ubuqotho besignali obuthuthukisiwe, ukunciphisa ukulahlekelwa kwesignali, nokuxhumana okuthuthukisiwe kukagesi phakathi kwe-chip nayo yonke iphakheji. Imithelela encishisiwe yezimuncagazi inikela ekusebenzeni kangcono kukagesi, amanani aphezulu wokudluliswa kwedatha, nokwethenjelwa okukhuphukile kwedivayisi. Ukwengeza, i-epoxy engagcwaliswanga ngokwanele ihlinzeka ngokufaka nokuvikeleka kumswakama, ukungcola, nezinye izici zemvelo ezingehlisa ukusebenza kukagesi.
4. I-Stress Relief kanye Nomhlangano Othuthukisiwe: I-Underfill epoxy isebenza njengendlela yokusiza ukucindezeleka ngesikhathi somhlangano. Okubalulekile kwe-epoxy kunxephezela ukungafani kwe-CTE phakathi kwe-chip ne-substrate, kunciphisa ukucindezeleka komshini ngesikhathi sokushintsha kwezinga lokushisa. Lokhu kwenza inqubo yokuhlanganisa ithembeke kakhulu futhi isebenze kahle, inciphise ubungozi bokulimala kwephakheji noma ukungahambi kahle. Ukusatshalaliswa kokucindezeleka okulawulwayo okunikezwa i-underfill epoxy nakho kusiza ukuqinisekisa ukuqondana okufanele nezinye izingxenye ebhodini lesifunda eliphrintiwe (PCB) futhi kuthuthukise isivuno somhlangano sisonke.
5. I-Miniaturization kanye Ne-Form Factor Optimization: I-epoxy engagcwalisi kakhulu inika amandla ukwenziwa kancane kwamaphakheji we-semiconductor kanye nokwenza kahle kwesici sefomu. Ngokunikeza ukuqiniswa kwesakhiwo kanye nokukhululeka kwengcindezi, i-epoxy engagcwali phansi ivumela ukuklama nokukhiqiza amaphakheji amancane, amancanyana, nahlangene kakhulu. Lokhu kubaluleke kakhulu ezinhlelweni zokusebenza ezifana namadivayisi eselula nezinto zikagesi ezigqokekayo, lapho isikhala siphezulu kakhulu. Ikhono lokuthuthukisa izici zefomu nokuzuza ukuminyana kwezingxenye eziphezulu linikela kumishini kagesi ethuthuke kakhulu futhi emisha.

Izinhlobo ze-Underfill Epoxy

Izinhlobo ezimbalwa zokwakheka kwe-epoxy okungagcwali phansi kuyatholakala emaphaketheni e-semiconductor, ngayinye yakhelwe ukuhlangabezana nezidingo ezithile futhi ibhekane nezinselele ezahlukene. Nazi ezinye izinhlobo ezivame ukusetshenziswa ze-underfill epoxy:

1. I-Capillary Underfill Epoxy: I-Capillary underfill epoxy iwuhlobo lwendabuko nolusetshenziswa kabanzi. I-epoxy ene-viscosity ephansi igeleza ingene phakathi kwe-chip ne-substrate ngokusebenzisa isenzo se-capillary. I-Capillary underfill ivamise ukukhishelwa onqenqemeni lwe-chip, futhi njengoba iphakheji ishiswa, i-epoxy igeleza ngaphansi kwe-chip, igcwalise izikhala. Lolu hlobo lwe-underfill lufanele amaphakheji anezikhala ezincane futhi lunikeza ukuqiniswa okuhle kwemishini.
2. I-No-Flow Underfill Epoxy: I-epoxy ye-No-flow underfill iwukwakhiwa kwe-viscosity ephezulu engagelezi ngesikhathi sokwelapha. Isetshenziswa njenge-epoxy esetshenziswe ngaphambilini noma njengefilimu phakathi kwe-chip ne-substrate. I-No-flow underfill epoxy iwusizo ikakhulukazi kumaphakheji e-flip-chip, lapho ama-solder bumps ahlangana ngokuqondile ne-substrate. Iqeda isidingo sokugeleza kwe-capillary futhi inciphisa ingozi yokulimala okuhlangene kwe-solder ngesikhathi somhlangano.
3. I-Wafer-Level Underfill (WLU): I-wafer-level underfill iyi-epoxy engagcwalisi esetshenziswa kuleveli ye-wafer ngaphambi kokuthi ama-chips ngamanye ahlukaniswe. Kubandakanya ukusabalalisa impahla engagcwali phansi phezu kwayo yonke indawo eyisicwecwana kanye nokuyelapha. I-Wafer-level underfill ihlinzeka ngezinzuzo ezimbalwa, okuhlanganisa ukumbozwa kokungagcwalisi okufanayo, isikhathi esincishisiwe sokuhlanganisa, nokulawulwa kwenqubo okuthuthukisiwe. Ivame ukusetshenziselwa ukwenziwa kwevolumu ephezulu yamadivayisi amancane.
4. Ukugcwaliswa Ngaphansi Okubunjiwe (i-MUF): Ukugcwaliswa okungaphansi okubunjiwe kuyi-epoxy engagcwalisi esetshenziswa ngesikhathi sokubumba i-encapsulation. I-underfill material isakazwa ku-substrate, bese i-chip ne-substrate ihlanganiswe ku-mold compound. Ngesikhathi sokubumba, i-epoxy igeleza futhi igcwalise igebe phakathi kwe-chip ne-substrate, inikeze ukugcwaliswa okungaphansi kanye ne-encapsulation ngesinyathelo esisodwa. Ukugcwaliswa okubunjiwe okubunjiwe kunikeza ukuqiniswa okuhle kakhulu kwemishini futhi kwenza inqubo yomhlangano ibe lula.
5. Ukungagcwalisi Ngaphansi Okungaqhubi (i-NCF): I-epoxy engakhiqizi i-underfill yenzelwe ngokukhethekile ukunikeza ukuhlukaniswa kukagesi phakathi kwamalunga e-solder ku-chip ne-substrate. Iqukethe ama-insulating fillers noma izithasiselo ezivimbela ukuqhutshwa kukagesi. I-NCF isetshenziswa ezinhlelweni lapho ukushoda kukagesi phakathi kwamajoyinti asondelene e-solder kuyinto ekhathazayo. Inikeza kokubili ukuqiniswa komshini kanye nokuhlukaniswa kukagesi.
6. I-Thermally Conductive Underfill (TCU): I-epoxy yokugcwalisa i-Thermally conductive underfill yakhelwe ukuthuthukisa amandla okukhipha ukushisa ephakheji. Iqukethe ama-thermal conductive fillers, njengezinhlayiya ze-ceramic noma zensimbi, ezithuthukisa ukuqhutshwa kwe-thermal kwento engagcwaliswanga phansi. I-TCU isetshenziswa ezinhlelweni lapho ukudluliswa kokushisa okusebenzayo kubalulekile, njengamadivayisi anamandla amakhulu noma lawo asebenza ezindaweni ezishisayo.

Lezi izibonelo ezimbalwa zezinhlobo ezahlukene ze-epoxy engagcwalisi esetshenziswa ekufakweni kwe-semiconductor. Ukukhethwa kwe-epoxy yokugcwalisa okungaphansi efanele kuncike ezintweni ezifana nokwakheka kwephakheji, inqubo yokuhlanganisa, izidingo zokushisa, nokucatshangelwa kukagesi. I-epoxy ngayinye engagcwalisi kahle inikeza izinzuzo ezithile futhi iklanyelwe ukuhlangabezana nezidingo ezihlukile zezinhlelo zokusebenza ezihlukahlukene.

I-Capillary Underfill: I-Viscosity ephansi kanye nokuthembeka okuphezulu

I-Capillary underfill isho inqubo esetshenziswa embonini yokupakisha ye-semiconductor ukuthuthukisa ukwethembeka kwezinto zikagesi. Kubandakanya ukugcwalisa izikhala phakathi kwe-microelectronic chip kanye nephakheji elizungezile ngezinto eziwuketshezi ezine-viscosity ephansi, ngokuvamile i-resin esekelwe epoxy. Lesi sici esingagcwalisi kahle sinikeza ukwesekwa kwesakhiwo, sithuthukisa ukuchithwa kwe-thermal, futhi sivikela i-chip ekucindezelekeni kwemishini, umswakama, nezinye izici zemvelo.

Esinye sezici ezibaluleke kakhulu ze-capillary underfill yi-viscosity yayo ephansi. Okubalulekile kokugcwalisa kancane kwakhiwa ukuthi kube nokuminyana okuphansi, okukuvumela ukuthi kugeleze kalula ezikhaleni ezincane phakathi kwe-chip nephakheji phakathi nenqubo yokugcwalisa kancane. Lokhu kuqinisekisa ukuthi impahla engagcwalisi kahle ingangena futhi igcwalise zonke izikhala nezikhala zomoya, kuncishiswe ubungozi bokwakheka okuyize nokuthuthukisa ubuqotho buphelele besixhumi esibonakalayo se-chip-package.

I-low-viscosity capillary underfill materials inikeza ezinye izinzuzo ezimbalwa. Okokuqala, benza kube lula ukugeleza okusebenzayo kwezinto ngaphansi kwe-chip, okuholela ekunciphiseni isikhathi senqubo kanye nokwanda kokuphuma kokukhiqiza. Lokhu kubaluleke kakhulu ezindaweni ezikhiqiza umthamo omkhulu lapho isikhathi nezindleko zibalulekile.

Okwesibili, i-viscosity ephansi inika amandla ukumanzisa okungcono kanye nezakhiwo zokunamathela zezinto ezingaphansi. Ivumela impahla ukuthi isakaze ngokulinganayo futhi yakhe izibopho eziqinile nge-chip nephakheji, idale i-encapsulation ethembekile futhi eqinile. Lokhu kuqinisekisa ukuthi i-chip ivikelekile ngokuvikelekile ekucindezelekeni komshini njengokuhamba ngebhayisikili elishisayo, ukushaqeka, nokudlidliza.

Esinye isici esibalulekile se-capillary underfill ukwethembeka kwabo okuphezulu. Izinto zokugcwalisa i-low-viscosity underfill zenziwe ngokukhethekile ukuze zibonise ukuzinza okuhle kakhulu kwe-thermal, izakhiwo zokufaka ugesi kagesi, nokumelana nomswakama kanye namakhemikhali. Lezi zici zibalulekile ekuqinisekiseni ukusebenza kwesikhathi eside nokuthembeka kwamadivayisi kagesi apakishiwe, ikakhulukazi ezinhlelweni zokusebenza ezinzima ezifana nezimoto, i-aerospace, nokuxhumana ngocingo.

Ngaphezu kwalokho, izinto zokugcwalisa i-capillary underfill zenzelwe ukuthi zibe namandla aphezulu emishini nokunamathela okuhle kakhulu ezintweni ezahlukahlukene ze-substrate, kufaka phakathi izinsimbi, i-ceramics, nezinto eziphilayo ezivame ukusetshenziswa ekufakweni kwe-semiconductor. Lokhu kuvumela okokusebenza okungagcwaliswa kahle ukuthi kusebenze njengesivimbeli sokucindezeleka, kudonse kahle futhi kuqede ukucindezeleka komshini okukhiqizwa phakathi nokusebenza noma ukuchayeka kwemvelo.

 

Ukungagcwalisi Okungagelezi Okungagelezi: Ukuzabalalisa kanye Nokusebenzisa Okuphezulu

I-No-flow underfill inqubo ekhethekile esetshenziswa embonini yokupakisha ye-semiconductor ukuthuthukisa ukuthembeka nokusebenza kahle kwezinto zikagesi. Ngokungafani nokugcwaliswa kwe-capillary underfill, okuthembele ekugelezeni kwezinto ezine-viscosity ephansi, ukugcwaliswa okungagelezi kahle kusebenzisa indlela yokuzinikezela ngezinto ezibonisa i-viscosity ephezulu. Le ndlela inikeza izinzuzo eziningana, okuhlanganisa ukuzivumelanisa, ukuphuma okuphezulu, nokuthembeka okuthuthukisiwe.

Esinye sezici ezibalulekile ze-no-flow underfill yikhono layo lokuzikhipha. I-underfill material esetshenziswe kule nqubo yenziwe nge-viscosity ephakeme, evimbela ukuthi ingagelezi ngokukhululekile. Esikhundleni salokho, okokusebenza okungagcwali phansi kunikezwa kusixhumi esibonakalayo se-chip-package ngendlela elawulwayo. Lokhu kusatshalaliswa okulawulwayo kuvumela ukubekwa okunembayo kwempahla engagcwalisi kahle, iqinisekise ukuthi isetshenziswa kuphela ezindaweni ezifunwayo ngaphandle kokuchichima noma ukusabalala ngokungalawuleki.

Imvelo yokuzabalaza yokungagcwalisi kancane ihlinzeka ngezinzuzo ezimbalwa. Okokuqala, ivumela ukuzivumelanisa ngokwakho kwento engagcwaliswa kahle. Njengoba i-underfill ikhishwa, iyaziqondanisa ngokwemvelo ne-chip nephakheji, igcwalisa izikhala kanye ne-voids ngokufanayo. Lokhu kuqeda isidingo sokuma okunembayo kanye nokuqondanisa kwe-chip phakathi nenqubo yokugcwalisa kancane, ukonga isikhathi nomzamo ekukhiqizeni.

Okwesibili, isici esizikhiphayo sokungagcwaliswa okuncane kokugeleza kuvumela ukuphuma okuphezulu ekukhiqizeni. Inqubo yokukhipha ingenziwa ngokuzenzakalelayo, ivumele ukusetshenziswa okusheshayo nokungaguquguquki kwezinto ezingagcwali kahle kuwo wonke ama-chips amaningi ngesikhathi esisodwa. Lokhu kuthuthukisa ukusebenza kahle kokukhiqiza okuphelele futhi kunciphisa izindleko zokukhiqiza, kukwenze kube nenzuzo ikakhulukazi ezindaweni zokukhiqiza umthamo omkhulu.

Ngaphezu kwalokho, izinto zokungagcwali kahle ezingagelezi ziklanyelwe ukunikeza ukwethembeka okuphezulu. Izinto zokugcwalisa i-viscosity ephezulu zinikeza ukumelana okuthuthukisiwe kokuhamba ngebhayisikili okushisayo, ukucindezeleka komshini, nezici zemvelo, okuqinisekisa ukusebenza kwesikhathi eside kwamadivayisi kagesi ahlanganisiwe. Izinto ezisetshenziswayo zibonisa ukuzinza okuhle kakhulu kwe-thermal, izakhiwo zokufaka ugesi kagesi, nokumelana nomswakama namakhemikhali, okunikela ekuthembekeni okuphelele kwamadivayisi.

Ukwengeza, izinto ezingaphansi kwe-viscosity ephezulu ezisetshenziswa ekugcwaliseni okungagelezi zithuthukise amandla emishini kanye nezakhiwo zokunamathela. Zakha izibopho eziqinile nge-chip nephakheji, zimunca ngempumelelo futhi ziqede ukucindezeleka komshini okukhiqizwa ngesikhathi sokusebenza noma ukuchayeka kwemvelo. Lokhu kusiza ukuvikela i-chip ekulimaleni okungaba khona futhi kuthuthukisa ukumelana kwedivayisi nokuthuthumela nokudlidliza kwangaphandle.

Ukugcwaliswa Okungaphansi Okubunjiwe: Ukuvikela Okuphezulu Nokuhlanganiswa

Ukugcwaliswa okungaphansi okubunjiwe kuyindlela ethuthukisiwe esetshenziswa embonini yokupakisha ye-semiconductor ukuhlinzeka ngamazinga aphezulu okuvikela nokuhlanganiswa kwezinto zikagesi. Kubandakanya ukumboza yonke i-chip kanye nephakeji elizungezile ngenhlanganisela yesikhunta ehlanganisa okokugcwaliswa ngaphansi. Le nqubo inikeza izinzuzo ezibalulekile mayelana nokuvikelwa, ukuhlanganiswa, nokuthembeka kukonke.

Enye yezinzuzo ezibalulekile zokungagcwalisi okubunjiwe yikhono layo lokunikeza ukuvikeleka okuphelele kwe-chip. Inhlanganisela yesikhunta esetshenziswa kule nqubo isebenza njengesithiyo esiqinile, ehlanganisa yonke i-chip nephakheji kugobolondo elivikelayo. Lokhu kunikeza isivikelo esisebenzayo ngokumelene nezici zemvelo ezinjengomswakama, uthuli, nokungcola okungase kuthinte ukusebenza nokuthembeka kwedivayisi. I-encapsulation iphinde isize ukuvimbela i-chip ekucindezelekeni kwemishini, ukuhamba ngebhayisikili okushisayo, namanye amandla angaphandle, iqinisekisa ukuqina kwayo kwesikhathi eside.

Ukwengeza, ukugcwaliswa okungaphansi okubunjiwe kunika amandla amazinga aphezulu okuhlanganiswa ngaphakathi kwephakheji ye-semiconductor. I-underfill material ixubene ngqo kwinhlanganisela yesikhunta, okuvumela ukuhlanganiswa okungenamthungo kwezinqubo zokungagcwalisi kanye ne-encapsulation. Lokhu kuhlanganiswa kuqeda isidingo sesinyathelo esihlukile sokugcwalisa kancane, ukwenza lula inqubo yokukhiqiza nokunciphisa isikhathi sokukhiqiza nezindleko. Iphinde iqinisekise ukusatshalaliswa okungagcwali kahle okungaguquki nokufanayo kuyo yonke iphakheji, kuncishiswe izikhala futhi kuthuthukise ubuqotho besakhiwo.

Ngaphezu kwalokho, ukugcwaliswa okubunjiwe okubunjiwe kunikeza izakhiwo ezinhle kakhulu zokulahla ezishisayo. Inhlanganisela yesikhunta iklanyelwe ukuthi ibe ne-thermal conductivity ephezulu, ukuyivumela ukuthi idlulise ukushisa kude ne-chip ngokuphumelelayo. Lokhu kubalulekile ekugcineni izinga lokushisa elilungile lokusebenza kwedivayisi nokuvimbela ukushisa ngokweqile, okungaholela ekulimaleni kokusebenza kanye nezinkinga zokuthembeka. Izakhiwo ezithuthukisiwe zokulahla okushisayo zokugcwaliswa okuncane okubunjiwe zifaka isandla ekuthembekeni kukonke kanye nokuhlala isikhathi eside kwensiza kagesi.

Ngaphezu kwalokho, ukugcwaliswa okungaphansi okubunjiwe kuvumela ukwenziwa okuncane okwengeziwe kanye nokwenza kahle kwesici sefomu. Inqubo ye-encapsulation ingenziwa ngendlela yokuthi ivumelane nosayizi bephakheji abahlukahlukene kanye nokwakheka, okuhlanganisa izakhiwo eziyinkimbinkimbi ze-3D. Lokhu kuvumelana nezimo kuvumela ukuhlanganisa ama-chips amaningi nezinye izingxenye zibe iphakheji ehlangene, eyonga isikhala. Amandla okuthola amazinga aphezulu okuhlanganiswa ngaphandle kokufaka engozini ukwethembeka kwenza ukungagcwali okuncane okubunjiwe kubaluleke kakhulu ezinhlelweni zokusebenza lapho usayizi nemingcele yesisindo ibaluleke kakhulu, njengamadivayisi eselula, izinto ezigqokwayo, nezinto zikagesi zezimoto.

Iphakheji Yesikali Se-Chip (i-CSP) Ukungagcwalisi Ngaphansi: I-Miniaturization kanye Nokuminyana Okuphezulu

Ukugcwaliswa ngaphansi kwe-Chip Scale Package (CSP) ubuchwepheshe obubalulekile obuvumela ukwenziwa kancane kanye nokuhlanganiswa kwedivayisi ye-elekthronikhi esezingeni eliphezulu. Njengoba izinto zikagesi ziqhubeka nokuncipha ngosayizi kuyilapho zinikeza ukusebenza okwengeziwe, i-CSP ayifezi indima ebalulekile ekuqinisekiseni ukwethembeka nokusebenza kwalawa madivayisi ahlangene.

I-CSP ubuchwepheshe bokupakisha obuvumela i-chip ye-semiconductor ukuthi igxunyekwe ngokuqondile ku-substrate noma ebhodini lesekethe eliphrintiwe (PCB) ngaphandle kokudinga iphakheji eyengeziwe. Lokhu kuqeda isidingo sepulasitiki yendabuko noma isitsha se-ceramic, ukunciphisa usayizi nesisindo sedivayisi. I-CSP igcwalisa kancane inqubo lapho kusetshenziswa khona uketshezi noma i-encapsulant ukugcwalisa igebe phakathi kwe-chip ne-substrate, ihlinzeka ngokusekela komshini kanye nokuvikela i-chip ezintweni zemvelo ezifana nomswakama kanye nokucindezeleka komshini.

I-Miniaturization ifinyelelwa ngokugcwalisa ngaphansi kwe-CSP ngokunciphisa ibanga phakathi kwe-chip ne-substrate. Izinto ezingagcwali phansi zigcwalisa igebe elincane phakathi kwe-chip ne-substrate, kwakheka isibopho esiqinile futhi sithuthukise ukuzinza kwemishini ye-chip. Lokhu kuvumela amadivayisi amancane namancane, okwenza kube nokwenzeka ukupakisha ukusebenza okwengeziwe endaweni elinganiselwe.

Ukuhlanganiswa kwe-High-density kungenye inzuzo yokungagcwalisi phansi kwe-CSP. Ngokususa isidingo sephakheji ehlukile, i-CSP yenza i-chip ibekwe eduze kwezinye izingxenye ze-PCB, inciphise ubude bokuxhunywa kukagesi futhi ithuthukise ubuqotho besignali. Izinto zokungagcwalisi kahle ziphinde zisebenze njenge-conductor eshisayo, ekhipha kahle ukushisa okukhiqizwa yi-chip. Leli khono lokuphatha okushisayo livumela ukuminyana kwamandla okuphezulu, okuvumela ukuhlanganiswa kwama-chips ayinkimbinkimbi futhi anamandla kumadivayisi kagesi.

Izinto zokugcwaliswa ngaphansi kwe-CSP kufanele zibe nezici ezithile ukuze zihlangabezane nezidingo ze-miniaturization kanye nokuhlanganiswa kokuminyana okuphezulu. Kudingeka babe ne-viscosity ephansi ukuze kube lula ukugcwaliswa kwezikhala ezincane, kanye nezakhiwo ezinhle kakhulu zokugeleza ukuze kuqinisekiswe ukumbozwa okufanayo nokuqeda ama-voids. Izinto zokwakha kufanele futhi zibe nokunamathela okuhle ku-chip ne-substrate, zinikeze ukusekelwa okuqinile kwemishini. Ukwengeza, kufanele babonise ukuguquguquka okuphezulu kwe-thermal ukudlulisa ukushisa kude ne-chip ngokuphumelelayo.

I-Wafer-Level CSP Underfill: Indleko Ephumelelayo Nesivuno Esiphezulu

Ukungagcwalisi kahle kwephakheji ye-wafer-level chip scale (WLCSP) kuyindlela engabizi kakhulu futhi enesivuno esikhulu enikeza izinzuzo ezimbalwa ekusebenzeni kahle kokukhiqiza kanye nekhwalithi yomkhiqizo jikelele. Ukugcwaliswa phansi kwe-WLCSP kusebenzisa okokusebenza okungagcwalisi kancane kuma-chips amaningi ngesikhathi esisodwa ngenkathi kusesesimo se-wafer ngaphambi kokuthi ahlanganiswe kumaphakheji angawodwana. Le ndlela inikeza izinzuzo eziningi mayelana nokunciphisa izindleko, ukulawulwa kwenqubo okuthuthukisiwe, kanye nesivuno esiphezulu sokukhiqiza.

Enye yezinzuzo ezibalulekile zokungagcwalisi phansi kwe-WLCSP ukusebenza kahle kwayo kwezindleko. Ukusebenzisa okokusebenza kokugcwalisa okungatheni ezingeni le-wafer kwenza inqubo yokupakisha ibe lula futhi isebenze kahle. Izinto ezingagcwaliswanga ngokwanele zikhishelwa ku-wafer kusetshenziswa inqubo elawulwayo nezenzakalelayo, ukunciphisa udoti wezinto ezibonakalayo kanye nokunciphisa izindleko zabasebenzi. Ukwengeza, ukuqeda izinyathelo zokuphatha iphakheji ngayinye nokuqondanisa kunciphisa isikhathi sokukhiqiza sisonke nokuba yinkimbinkimbi, okuholela ekongeni kwezindleko ezibalulekile uma kuqhathaniswa nezindlela zokupakisha ezivamile.

Ngaphezu kwalokho, ukungagcwalisi kahle kwe-WLCSP kunikeza ukulawulwa kwenqubo okuthuthukisiwe kanye nesivuno esiphezulu sokukhiqiza. Njengoba okokusebenza kokugcwalisa kancane kusetshenziswa ezingeni le-wafer, kunika amandla ukulawula okungcono kwenqubo yokukhipha, iqinisekisa ukumbozwa okungaguquki nokufana okufanayo kokugcwalisa okungaphansi kwe-chip ngayinye ku-wafer. Lokhu kunciphisa ubungozi be-voids noma ukungagcwali kahle okungaphelele, okungaholela ezindabeni zokuthembeka. Ikhono lokuhlola nokuhlola ikhwalithi yokungagcwalisi kahle ezingeni le-wafer liphinde livumele ukutholwa kusenesikhathi kokulimala noma ukucubungula ukuhluka, okuvumela izenzo zokulungisa ezifika ngesikhathi kanye nokunciphisa amathuba okuba namaphakheji anephutha. Njengomphumela, ukungagcwalisi kahle kwe-WLCSP kusiza ukuzuza isivuno esiphezulu sokukhiqiza kanye nekhwalithi yomkhiqizo engcono kakhulu.

Indlela ye-wafer-level ibuye inike amandla ukusebenza okuthuthukisiwe kwe-thermal nemishini. Izinto ezingagcwali phansi ezisetshenziswa ku-WLCSP ngokuvamile ziyi-viscosity ephansi, i-capillary-flowing material engavala izikhala ezincane phakathi kwama-chips kanye ne-wafer. Lokhu kunikeza ukusekelwa okuqinile kwemishini kuma-chips, kuthuthukisa ukumelana kwawo nengcindezi yemishini, ukudlidliza, kanye nokuhamba ngebhayisikili. Ukwengeza, izinto ezingaphansi kokugcwalisa zisebenza njengomqhubi oshisayo, okusiza ukuchithwa kokushisa okukhiqizwa ama-chips, ngaleyo ndlela kuthuthukise ukuphathwa kokushisa nokunciphisa ingozi yokushisa ngokweqile.

I-Flip Chip Underfill: Ukuminyana okuphezulu kwe-I/O nokusebenza

I-Flip chip underfill ubuchwepheshe obubalulekile obunika amandla ukuminyana okuphezulu/okuphumayo (I/O) nokusebenza okukhethekile kumishini kagesi. Idlala indima ebalulekile ekuthuthukiseni ukwethembeka nokusebenza kwe-flip-chip packaging, esetshenziswa kakhulu ezinhlelweni ezithuthukisiwe ze-semiconductor. Lesi sihloko sizohlola ukubaluleka kwe-flip chip underfill kanye nomthelela wako ekuzuzeni ukuminyana kwe-I/O ephezulu nokusebenza.

Ubuchwepheshe be-Flip chip bubandakanya ukuxhumana okuqondile kukagesi kwesekethe ehlanganisiwe (IC) noma i-semiconductor efayo ku-substrate, okuqeda isidingo sokubopha izintambo. Lokhu kubangela iphakheji ehlangene futhi esebenza kahle, njengoba amaphedi e-I/O atholakala endaweni engaphansi kwedayizi. Kodwa-ke, ukupakishwa kwe-flip-chip kuletha izinselelo eziyingqayizivele okufanele zibhekwe ukuze kuqinisekiswe ukusebenza kahle nokwethembeka.

Enye yezinselelo ezibucayi ekufakweni kwe-flip chip ukuvimbela ukucindezelwa komshini kanye nokungafani kokushisa phakathi kwe-die ne-substrate. Phakathi nenqubo yokukhiqiza nokusebenza okulandelayo, umehluko ku-coefficients of thermal expansion (CTE) phakathi kwe-die ne-substrate kungabangela ukucindezeleka okukhulu, okuholela ekulimazeni kokusebenza noma ngisho nokwehluleka. I-Flip chip underfill yinto evikelayo ehlanganisa i-chip, ehlinzeka ngokusekela komshini kanye nokukhulula ingcindezi. Isabalalisa ngempumelelo izingcindezi ezikhiqizwa ngesikhathi sokuhamba ngebhayisikili okushisayo futhi ivimbele ukuthi lithinte ukuxhumana okubucayi.

Ukuminyana okuphezulu kwe-I/O kubalulekile emishinini yesimanje kagesi, lapho izici zefomu ezincane kanye nokusebenza okungeziwe kubalulekile. I-Flip chip underfill inika amandla ukuminyana kwe-I/O okuphezulu ngokunikeza ukugqugquzelwa kukagesi okuphakeme namandla okuphatha okushisayo. Izinto ezingagcwali phansi zigcwalisa igebe phakathi kwefasi ne-substrate, kwakheka isixhumi esibonakalayo esiqinile futhi sinciphise ubungozi bokujikeleza okufushane noma ukuvuza kukagesi. Lokhu kuvumela ukuvala isikhala esiseduze samaphedi e-I/O, okuholela ekukhuleni kokuminyana kwe-I/O ngaphandle kokudela ukwethembeka.

Ngaphezu kwalokho, ukugcwaliswa kwe-flip chip kunomthelela ekwenzeni ngcono ukusebenza kukagesi. Inciphisa ama-parasites kagesi phakathi kwe-die ne-substrate, inciphisa ukubambezeleka kwesignali futhi ithuthukise ubuqotho besignali. I-underfill material iphinde ibonise izici ezinhle kakhulu ze-thermal conductivity, isusa kahle ukushisa okukhiqizwa yi-chip ngesikhathi sokusebenza. Ukukhipha ukushisa okusebenzayo kuqinisekisa ukuthi izinga lokushisa lihlala lingaphakathi kwemikhawulo eyamukelekayo, kuvimbela ukushisa ngokweqile nokugcina ukusebenza kahle.

Ukuthuthuka kokusebenza kwe-flip chip kunikeze amandla ukuminyana kwe-I/O okuphakeme nakakhulu namazinga okusebenza. I-Nanocomposite underfills, ngokwesibonelo, ikhulisa izigcwalisi ze-nanoscale ukuze kuthuthukiswe ukuguquguquka kokushisa namandla emishini. Lokhu kuvumela ukunqanyulwa kokushisa okuthuthukisiwe nokuthembeka, okuvumela amadivayisi asebenza kahle kakhulu.

I-Ball Grid Array (BGA) Ukungagcwalisi Ngaphansi: Ukusebenza Okushisayo Okuphezulu Nokusebenza Komshini

I-Ball Grid Array (BGA) ayigcwalisanga kahle ubuchwepheshe obubalulekile obunikeza ukusebenza okuphezulu okushisayo nokokusebenza kumishini kagesi. Idlala indima ebalulekile ekuthuthukiseni ukwethembeka nokusebenza kwamaphakheji e-BGA, asetshenziswa kakhulu ezinhlelweni ezahlukahlukene. Kulesi sihloko, sizohlola ukubaluleka kokungagcwalisi kahle kwe-BGA kanye nomthelela wako ekuzuzeni ukusebenza okuphezulu okushisayo nokokusebenza.

Ubuchwepheshe be-BGA bubandakanya idizayini yephakheji lapho isekethe ehlanganisiwe (IC) noma i-semiconductor die ifakwe ku-substrate, futhi ukuxhunywa kukagesi kwenziwa ngoxhaxha lwamabhola e-solder atholakala endaweni engaphansi yephakheji. I-BGA igcwalisa kancane into ekhishwa esikhaleni esiphakathi kwefasi ne-substrate, ihlanganisa amabhola e-solder futhi inikeze ukusekela nokuvikelwa komshini emhlanganweni.

Enye yezinselelo ezibucayi ekufakweni kwe-BGA ukuphatha izingcindezi ezishisayo. Ngesikhathi sokusebenza, i-IC ikhiqiza ukushisa, futhi ukunwetshwa kwe-thermal kanye nokufinyela kungabangela ukucindezela okukhulu kumalungu e-solder axhuma i-die kanye ne-substrate. I-BGA ayifezi indima ebalulekile ekwehliseni lezi zingcindezi ngokwakha isibopho esiqinile ne-die kanye ne-substrate. Isebenza njengesivimbeli sokucindezeleka, imunca ukunwebeka nokufinyela okushisayo futhi inciphise ubunzima kumalunga e-solder. Lokhu kusiza ukuthuthukisa ukwethembeka jikelele kwephakheji futhi kunciphisa ubungozi bokuhluleka kokuhlangana kwe-solder.

Esinye isici esibalulekile sokungagcwalisi kahle kwe-BGA yikhono layo lokuthuthukisa ukusebenza kwemishini kwephakheji. Amaphakheji e-BGA avame ukuba ngaphansi kokucindezeleka kwemishini ngesikhathi sokuphatha, ukuhlanganisa, nokusebenza. I-underfill material igcwalisa igebe phakathi kwe-die kanye ne-substrate, inikeza ukusekelwa kwesakhiwo kanye nokuqiniswa kumalungu e-solder. Lokhu kuthuthukisa amandla emishini ewonke, kuyenze imelane nokushaqeka komshini, ukudlidliza, namanye amandla angaphandle. Ngokusabalalisa ngempumelelo izingcindezi zemishini, ukugcwaliswa ngaphansi kwe-BGA kusiza ukuvimbela ukuqhekeka kwephakheji, i-delamination, noma okunye ukwehluleka kwemishini.

Ukusebenza okuphezulu okushisayo kubalulekile kumishini kagesi ukuze kuqinisekiswe ukusebenza okufanele nokuthembeka. Izinto zokugcwaliswa ngaphansi kwe-BGA zenzelwe ukuthi zibe nezakhiwo ezinhle kakhulu ze-thermal conductivity. Lokhu kuzivumela ukuthi zidlulise kahle ukushisa kude kude futhi zisabalalise kuyo yonke i-substrate, okuthuthukisa ukuphathwa kokushisa okuphelele kwephakheji. Ukukhipha ukushisa okusebenzayo kusiza ukugcina izinga lokushisa eliphansi lokusebenza, ukuvimbela izindawo ezishisayo kanye nokonakaliswa kokusebenza okungaba khona. Iphinde ibe nomthelela ekuphileni isikhathi eside kwebhokisi ngokunciphisa ingcindezi yokushisa yezingxenye.

Ukuthuthuka kwezinto ezingagcwali phansi kwe-BGA kuholele ekusebenzeni okuphezulu kakhulu kwe-thermal nemishini. Ukwakhiwa okuthuthukisiwe kanye nezinto zokugcwalisa, ezifana nama-nanocomposites noma izigcwalisi ze-thermal conductivity ephezulu, zinike amandla ukukhishwa okungcono kokushisa namandla emishini, kuqhubeke kuthuthukisa ukusebenza kwamaphakheji e-BGA.

I-Quad Flat Package (QFP) Ukungagcwalisi Ngaphansi: I-I/O Ukubala Enkulu Nokuqina

I-Quad Flat Package (QFP) iyiphakheji yesekethe edidiyelwe (IC) esetshenziswa kabanzi kwezobuchwepheshe. Ifaka umumo oyisikwele noma ongunxande ngemikhondo esukela kuzo zonke izinhlangothi ezine, ihlinzeka ngoxhumano oluningi lokufakwayo/okuphumayo (I/O). Ukuze kuthuthukiswe ukwethembeka nokuqina kwamaphakheji e-QFP, izinto ezisetshenziswayo ezingagcwalisi kahle zivame ukusetshenziswa.

I-Underfill yinto evikelayo esetshenziswa phakathi kwe-IC ne-substrate ukuze kuqiniswe amandla emishini yamalunga e-solder nokuvimbela ukwehluleka okubangelwa ukucindezeleka. Kubaluleke kakhulu kuma-QFP anesibalo esikhulu se-I/O, njengoba inani eliphezulu lokuxhumana lingaholela ekucindezelekeni okubalulekile komshini ngesikhathi sokuhamba ngamabhayisikili ashisayo nezimo zokusebenza.

Izinto ezingagcwali phansi ezisetshenziselwa amaphakheji e-QFP kumele zibe nezici ezithile zokuqinisekisa ukuqina. Okokuqala, kufanele ibe nokunamathela okuhle kakhulu kukho kokubili i-IC kanye ne-substrate ukuze kwakhe ibhondi eqinile futhi kuncishiswe ubungozi bokuhlukaniswa noma ukuhlukaniswa. Ukwengeza, kufanele ibe ne-coefficient ephansi yokunwetshwa kwe-thermal (CTE) ukuze ifane ne-CTE ye-IC ne-substrate, inciphise ukungezwani kwengcindezi okungaholela ekuqhekekeni noma ekuqhekekeni.

Ngaphezu kwalokho, izinto ezingagcwalisi kahle kufanele zibe nezindawo zokugeleza ezinhle zokuqinisekisa ukumbozwa okufanayo kanye nokugcwaliswa okuphelele kwegebe phakathi kwe-IC ne-substrate. Lokhu kusiza ekuqedeni ama-voids, okunganciphisa amalunga e-solder futhi kubangele ukwethembeka okuncishisiwe. Impahla kufanele futhi ibe nezindawo ezinhle zokuphulukisa, ukuyivumela ukuthi yakhe ungqimba oluqinile noluqinile lokuvikela ngemva kokufaka isicelo.

Ngokuya kokuqina kwemishini, ukugcwaliswa ngaphansi kufanele kube namandla okushefa okuphezulu namandla ukuze imelane namandla angaphandle futhi kuvimbele ukuwohloka kwephakheji noma ukuhlukaniswa. Kufanele futhi ibonise ukumelana okuhle nomswakama nezinye izici zemvelo ukuze kugcinwe izakhiwo zayo zokuzivikela ngokuhamba kwesikhathi. Lokhu kubaluleke kakhulu ezinhlelweni zokusebenza lapho iphakethe le-QFP lingase livezwe ezimeni ezinzima noma libe nokuhlukahluka kwezinga lokushisa.

Izinto ezihlukahlukene zokugcwalisa kancane ziyatholakala ukuze kuzuzwe lezi zici ezifiselekayo, okuhlanganisa ukwakheka okusekelwe ku-epoxy. Ngokuya ngezidingo eziqondile zohlelo lokusebenza, lezi zinto zokusebenza zingasatshalaliswa kusetshenziswa amasu ahlukene, njengokugeleza kwe-capillary, jetting, noma ukuphrinta kwesikrini.

I-System-in-Package (SiP) I-Underfill: Ukuhlanganisa kanye Nokusebenza

I-System-in-Package (i-SiP) ubuchwepheshe bokupakisha obuthuthukile obuhlanganisa ama-semiconductor ama-chips amaningi, izakhi zokwenziwa, nezinye izici zibe iphakheji elilodwa. I-SiP inikezela ngezinzuzo eziningi, okuhlanganisa isici sefomu esincishisiwe, ukusebenza okuthuthukisiwe kukagesi, nokusebenza okuthuthukisiwe. Ukuqinisekisa ukuthembeka nokusebenza kwemihlangano ye-SiP, izinto ezingaphansi kokugcwalisa zivame ukusetshenziswa.

Ukungagcwalisi kahle kwezinhlelo ze-SiP kubalulekile ekuhlinzekeni ukuzinza kwemishini kanye nokuxhumana kukagesi phakathi kwezingxenye ezihlukahlukene ngaphakathi kwephakheji. Kuyasiza ukunciphisa ubungozi bokuhluleka okubangelwa ukucindezeleka, njengokuqhekeka okuhlangene kwe-solder noma ukuphuka, okungenzeka ngenxa yokuhluka kwama-coefficients of thermal expansion (CTE) phakathi kwezingxenye.

Ukuhlanganisa izingxenye eziningi kuphakheji ye-SiP kuholela ekuxhumaneni okuyinkimbinkimbi, okunamajoyini amaningi e-solder kanye ne-high-density circuitry. Izinto ezingagcwali phansi zisiza ukuqinisa lokhu kuxhumana, kuthuthukise amandla emishini nokuthembeka komhlangano. Basekela amalunga e-solder, ukunciphisa ingozi yokukhathala noma ukulimala okubangelwa ukuhamba ngebhayisikili okushisayo noma ukucindezeleka kwemishini.

Mayelana nokusebenza kukagesi, izinto zokungagcwalisi kahle zibalulekile ekuthuthukiseni ubuqotho besignali kanye nokunciphisa umsindo kagesi. Ngokugcwalisa izikhala phakathi kwezingxenye nokunciphisa ibanga phakathi kwazo, ukungagcwali phansi kusiza ukunciphisa i-parasitic capacitance kanye ne-inductance, okuvumela ukudluliswa kwesignali ngokushesha nangempumelelo.

Ukwengeza, izinto ezingagcwali phansi zezinhlelo zokusebenza ze-SiP kufanele zibe ne-conductivity enhle kakhulu yokushisa ukuze kukhishwe ukushisa okukhiqizwa izingxenye ezihlanganisiwe ngokuphumelelayo. Ukukhipha ukushisa okuphumelelayo kubalulekile ukuvimbela ukushisa nokugcina ukuthembeka okuphelele nokusebenza komhlangano we-SiP.

Izinto zokungagcwalisi kahle emaphaketheni e-SiP kufanele zibe nezakhiwo ezithile ukuze zihlangabezane nalezi zidingo zokuhlanganisa nokusebenza. Kufanele babe nokugeleza okuhle ukuze baqinisekise ukumbozwa okuphelele futhi bagcwalise izikhala phakathi kwezingxenye. I-underfill material kufanele futhi ibe nokubunjwa kwe-viscosity ephansi ukuvumela ukusabalalisa kalula nokugcwalisa izimbobo ezincane noma izikhala ezincane.

Ngaphezu kwalokho, okokusebenza okungagcwali phansi kufanele kubonise ukunamathela okuqinile ezindaweni ezihlukene, okuhlanganisa ama-semiconductor chips, ama-substrates, nama-passives, ukuqinisekisa ukubopha okuthembekile. Kufanele ihambisane nezinto zokupakisha ezihlukahlukene, njengama-substrates e-organic noma izitsha zobumba, futhi ibonise izici ezinhle zemishini, okuhlanganisa ukugunda okuphezulu namandla okucwecwa.

Ukukhethwa kwempahla engagcwalisi kakhulu kanye nendlela yohlelo lokusebenza kuncike ekwakhiweni kwe-SiP ethile, izidingo zengxenye, nezinqubo zokukhiqiza. Amasu okukhipha anjengokugeleza kwe-capillary, jetting, noma izindlela ezisizwa ngefilimu ngokuvamile zisebenza ukungagcwalisi kahle emibuthanweni ye-SiP.

I-Optoelectronics Underfill: Ukuqondanisa Okubonakalayo Nokuvikela

Ukungagcwalisi phansi kwe-Optoelectronics kufaka phakathi ukuhlanganisa nokuvikela amadivayisi we-optoelectronic ngenkathi kuqinisekiswa ukuqondanisa okunembile kokubona. Amadivayisi we-Optoelectronic, njengama-lasers, ama-photodetectors, nama-optical switch, ngokuvamile adinga ukuqondanisa okubucayi kwezingxenye zokubona ukuze kuzuzwe ukusebenza kahle. Ngesikhathi esifanayo, zidinga ukuvikelwa ezicini zemvelo ezingase zithinte ukusebenza kwazo. Ukungagcwalisi phansi kwe-Optoelectronics kubhekana nazo zombili lezi zidingo ngokuhlinzeka ngokuqondanisa nokuvikeleka ngenqubo eyodwa.

Ukuqondanisa okubonakalayo kuyisici esibalulekile sokukhiqiza idivayisi ye-optoelectronic. Kuhilela ukuqondanisa izakhi ezibukwayo, njengemicu, ama-waveguide, amalensi, noma ama-grating, ukuze kuqinisekiswe ukudluliswa kokukhanya okuphumelelayo nokwamukela. Ukuqondanisa okunembile kuyadingeka ukuze kukhuliswe ukusebenza kwedivayisi nokugcina ubuqotho besignali. Amasu okuqondanisa endabuko ahlanganisa ukuqondanisa okwenziwa ngesandla kusetshenziswa ukuhlola okubonakalayo noma ukuqondanisa okuzenzakalelayo kusetshenziswa izigaba zokuqondanisa. Kodwa-ke, lezi zindlela zingadla isikhathi, zisebenze kanzima, futhi zithambekele ekubeni namaphutha.

I-Optoelectronics igcwalisa isixazululo esisha ngokuhlanganisa izici zokuqondanisa ngokuqondile kokungagcwalisi kahle. Izinto zokungagcwalisi kahle ngokuvamile ziyinhlanganisela yoketshezi noma i-semi-liquid engageleza futhi igcwalise izikhala phakathi kwezingxenye ze-optical. Ngokungeza izici zokuqondanisa, njengama-microstructures noma ama-fiducial marks, ngaphakathi kokungagcwalisi kahle, inqubo yokuqondanisa ingenziwa ibe lula futhi izenzekele. Lezi zici zisebenza njengeziqondiso ngesikhathi sokuhlanganisa, ziqinisekisa ukuqondanisa okunembile kwezingxenye ze-optical ngaphandle kwesidingo sezinqubo zokuqondanisa eziyinkimbinkimbi.

Ngaphezu kokuqondanisa okubonakalayo, izinto ezingagcwali phansi zivikela amadivaysi e-optoelectronic. Izingxenye ze-Optoelectronic zivame ukuvezwa ezindaweni ezinokhahlo, okuhlanganisa ukushintshashintsha kwezinga lokushisa, umswakama, nokucindezeleka kwemishini. Lezi zici zangaphandle zingehlisa ukusebenza nokuthembeka kwamadivayisi ngokuhamba kwesikhathi. Izinto ezingagcwali phansi zisebenza njengesivikelo esivikelayo, ezihlanganisa izingxenye ze-optical futhi zizivikele ekungcoleni kwemvelo. Ziphinde zinikeze ukuqiniswa kwemishini, ukunciphisa ingozi yokulimala ngenxa yokushaqeka noma ukudlidliza.

Izinto ezingagcwali phansi ezisetshenziswa ezinhlelweni ze-optoelectronics zivame ukudizayinelwa ukuthi zibe nenkomba ephansi ye-refractive kanye nokukhanya okuhle kakhulu kokubona. Lokhu kuqinisekisa ukuphazamiseka okuncane namasignali okubona adlula ocingweni. Ukwengeza, abonisa ukunamathela okuhle kuma-substrates ahlukahlukene futhi anama-coefficients aphansi okunweba okushisayo ukuze anciphise ingcindezi yedivayisi ngesikhathi sokuhamba ngebhayisikili okushisayo.

Inqubo yokugcwalisa kancane ihlanganisa ukusabalalisa okungaphansi kokugcwalisa ocingweni, ukuyivumela ukuthi igeleze futhi igcwalise izikhala phakathi kwezingxenye ze-optical, bese ikwelapha ukuze yakhe i-encapsulation eqinile. Ngokuya ngohlelo lokusebenza oluthile, okokusebenza kokugcwalisa kancane kungasetshenziswa kusetshenziswa amasu ahlukene, njengokugeleza kwe-capillary, ukukhishwa kwejethi, noma ukuphrinta kwesikrini. Inqubo yokwelapha ingafinyelelwa ngokushisa, imisebe ye-UV, noma kokubili.

I-Medical Electronics Underfill: I-Biocompatibility kanye Nokuthembeka

Imishini kagesi yezokwelapha ayigcwalisanga kahle inqubo ekhethekile ebandakanya ukuhlanganisa nokuvikela izingxenye ze-elekthronikhi ezisetshenziswa emishinini yezokwelapha. Lawa madivaysi adlala indima ebalulekile ezinhlelweni zokwelashwa ezahlukahlukene, njengamadivayisi afakelwayo, okokusebenza kokuxilonga, amasistimu okuqapha, nezinhlelo zokulethwa kwezidakamizwa. Ukungagcwalisi kahle kwemishini kagesi yezokwelapha kugxile ezicini ezimbili ezibalulekile: i-biocompatibility kanye nokuthembeka.

I-Biocompatibility iyisidingo esiyisisekelo samadivayisi wezokwelapha ahlangana nomzimba womuntu. Izinto ezingagcwalisi kahle ezisetshenziswa kuma-electronics wezokwelapha kumele zihambisane ne-biocompatible, okusho ukuthi akufanele zibangele imiphumela eyingozi noma ukusabela okungekuhle lapho zithinta izicubu eziphilayo noma uketshezi lomzimba. Lezi zinto kufanele zihambisane nemithetho eqinile namazinga, njenge-ISO 10993, ecacisa ukuhlolwa kwe-biocompatibility nezinqubo zokuhlola.

Izinto ezisetshenziswayo ezingagcwali kakhulu kuma-elekthronikhi wezokwelapha zikhethwa ngokucophelela noma zakhiwe ukuze kuqinisekiswe ukuhambisana kwezinto eziphilayo. Zenzelwe ukuthi zingabi nobuthi, zingacasuli, futhi zingabi ne-allergenic. Lezi zinto akufanele zikhiphe noma yiziphi izinto eziyingozi noma zonakalise ngokuhamba kwesikhathi, njengoba lokhu kungaholela ekulimaleni kwezicubu noma ukuvuvukala. Izinto ezingaphansi kwe-Biocompatible underfill nazo zinokumuncwa okuphansi kwamanzi ukuvimbela ukukhula kwamagciwane noma isikhunta esingadala izifo.

Ukuthembeka kungenye into ebalulekile yokungagcwalisi kahle kwemishini kagesi yezokwelapha. Imishini yezokwelapha ivamise ukubhekana nezimo zokusebenza eziyinselele, okuhlanganisa izinga lokushisa elidlulele, umswakama, uketshezi lomzimba, nokucindezeleka komshini. Izinto ezingagcwalisi kahle kufanele zivikele izingxenye ze-elekthronikhi, ziqinisekise ukwethembeka kwazo kwesikhathi eside nokusebenza kwazo. Ukuthembeka kubaluleke kakhulu ezinhlelweni zezokwelapha lapho ukwehluleka kwedivayisi kungase kuthinte kabi ukuphepha nempilo yesiguli.

Izinto ezisetshenziswayo ezingagcwali kahle zogesi wezokwelapha kufanele zimelane nomswakama ophezulu kanye namakhemikhali ukuze zimelane nokuchayeka oketshezini lomzimba noma izinqubo zokuvala inzalo. Kufanele futhi babonise ukunamathela okuhle kuma-substrates ahlukahlukene, baqinisekise ukubethelwa okuvikelekile kwezingxenye ze-elekthronikhi. Izakhiwo zemishini, njengama-coefficients aphansi okwanda okushisayo nokumelana nokushaqeka okuhle, zibalulekile ekwehliseni ingcindezi emininingwaneni ngesikhathi sokuhamba ngebhayisikili elishisayo noma ukulayisha okuzenzakalelayo.

Inqubo yokungagcwalisi kahle kwezinto zikagesi zezokwelapha ibandakanya:

• Ukusabalalisa okungaphansi kokugcwalisa ezingxenyeni ze-elekthronikhi.
• Ukugcwalisa izikhala.
• Ukuyelapha ukwenza i-encapsulation evikelayo futhi ezinzile.

Kufanele kuqashelwe ukuze kuqinisekiswe ukumbozwa okuphelele kwezici kanye nokungabikho kwama-void noma amaphakethe omoya angonakalisa ukwethembeka kwedivayisi.

Ngaphezu kwalokho, ukucatshangelwa okwengeziwe kuyacatshangelwa lapho kufakwa izinsiza zezokwelapha ezingagcwalisi kakhulu. Isibonelo, okokusebenza kokugcwalisa kancane kufanele kuhambisane nezindlela zokuvala inzalo ezisetshenziswa ocingweni. Ezinye izinto zingase zibe bucayi kumasu athile okubulala amagciwane, njengesitimu, i-ethylene oxide, noma imisebe, nezinye izinto ezingase kudingeke zikhethwe.

I-Aerospace Electronics I-Underfill: Ithempelesha Ephezulu kanye Nokumelana Nokudlidliza

I-Aerospace electronics igcwalisa kancane inqubo ekhethekile yokuhlanganisa nokuvikela izingxenye ze-elekthronikhi ezinhlelweni ze-aerospace. Indawo ye-Aerospace ibeka izinselele eziyingqayizivele, okuhlanganisa izinga lokushisa eliphezulu, ukudlidliza okwedlulele, nokucindezeleka komshini. Ngakho-ke, i-aerospace electronics underfill igxile ezicini ezimbili ezibalulekile: ukumelana nezinga lokushisa eliphezulu nokumelana nokudlidliza.

Ukumelana nezinga lokushisa eliphezulu kubalulekile kuma-elekthronikhi asemkhathini ngenxa yamazinga okushisa aphakeme atholakala ngesikhathi sokusebenza. Izinto ezingagcwali phansi ezisetshenziswa ezinhlelweni ze-aerospace kumele zimelane nalawa mazinga okushisa aphezulu ngaphandle kokuphazamisa ukusebenza nokuthembeka kwezingxenye ze-elekthronikhi. Kufanele zibonise ukunwetshwa okushisayo okuncane futhi zihlale zizinzile ebangeni lokushisa elibanzi.

Izinto ezingagcwalisi kahle zama-elekthronikhi asemkhathini zikhethiwe noma zenzelwe amazinga okushisa engilazi aphezulu (Tg) kanye nokuzinza kwe-thermal. I-Tg ephezulu iqinisekisa ukuthi impahla igcina izakhiwo zayo zemishini emazingeni okushisa aphakeme, ivimbela ukuguquguquka noma ukulahlekelwa ukunamathela. Lezi zinto zingakwazi ukumelana nezinga lokushisa elidlulele, njengalapho isuka, ingena kabusha emkhathini, noma isebenza emagumbini enjini eshisayo.

Ukwengeza, izinto ezingagcwali phansi ze-aerospace electronics kufanele zibe nama-coefficients aphansi we-thermal expansion (CTE). I-CTE ikala ukuthi inweba kangakanani into noma inkontileka ngokushintsha kwezinga lokushisa. Ngokuba ne-CTE ephansi, izinto ezingagcwali phansi zinganciphisa ingcindezi ezingxenyeni ze-elekthronikhi ezibangelwa ukuhamba ngebhayisikili okushisayo, okungaholela ekuhlulekeni kwemishini noma ukukhathala okuhlangene kwe-solder.

Ukumelana nokudlidliza kungenye imfuneko ebalulekile yokungagcwali phansi kwe-aerospace electronics. Izimoto zasemkhathini zingaphansi kokudlidliza okuhlukahlukene, okuhlanganisa injini, ukundindizela okubangelwa indiza, nokushaqeka komshini ngesikhathi sokwethulwa noma sokuhlala. Lokhu kudlidliza kungabeka engcupheni ukusebenza nokuthembeka kwezingxenye ze-elekthronikhi uma zingavikelwe ngokwanele.

Izinto ezingagcwali phansi ezisetshenziswa kuma-elekthronikhi asemkhathini kufanele zibonise izinto ezinhle kakhulu zokudlidliza. Kufanele amunce futhi ahlakaze amandla akhiqizwa ukudlidliza, ehlise ingcindezi kanye nobunzima ezingxenyeni ze-elekthronikhi. Lokhu kusiza ukuvimbela ukwakheka kokuqhekeka, ukuphuka, noma okunye ukwehluleka kwemishini ngenxa yokuvezwa kokudlidliza ngokweqile.

Ngaphezu kwalokho, izinto ezingagcwali phansi ezinokunamathela okuphezulu namandla ahlangene ziyakhethwa ezinhlelweni ze-aerospace. Lezi zakhiwo ziqinisekisa ukuthi okokusebenza okungagcwaliswanga phansi kuhlala kuxhumene ngokuqinile nezingxenye ze-elekthronikhi kanye ne-substrate, ngisho nangaphansi kwezimo zokudlidliza ngokweqile. Ukunamathela okuqinile kuvimbela izinto ezingaphansi kokugcwalisa ukuthi zinganaki noma zihlukane nezakhi, zigcine ubuqotho be-encapsulation futhi zivikele ekungeneni komswakama noma udoti.

Inqubo yokungagcwalisi kahle kwama-elekthronikhi asemkhathini ngokuvamile ihlanganisa ukusabalalisa impahla engagcwali phansi ezingxenyeni ze-elekthronikhi, ukuyivumela ukuthi igeleze futhi igcwalise izikhala, bese iyakwelapha ukuze kwakhe ukuhlanganisa okuqinile. Inqubo yokwelapha ingafezwa kusetshenziswa izindlela ezishisayo noma ze-UV, kuye ngezidingo eziqondile zohlelo lokusebenza.

Ukumelana nokuhamba ngebhayisikili okushisayo kungenye imfuneko ebalulekile yokungagcwalisi kahle kwemishini kagesi yezimoto. Izimoto zezimoto zihlangabezana nokwehluka kwezinga lokushisa okuvamile, ikakhulukazi ngesikhathi sokuqalisa nokusebenza kwenjini, futhi le mijikelezo yezinga lokushisa ingadala ukucindezeleka okushisayo ezingxenyeni ze-elekthronikhi nezinto ezingagcwalisi ezizungezile. Izinto ezingagcwali phansi ezisetshenziswa ezinhlelweni zezimoto kufanele zibe nokumelana okuhle kakhulu nokuhamba ngebhayisikili okushisayo ukuze zimelane nalokhu kushintshashintsha kwezinga lokushisa ngaphandle kokuphazamisa ukusebenza kwazo.

Izinto ezingagcwalisi kahle zama-automotive electronics kufanele zibe nama-coefficients aphansi we-thermal expansion (CTE) ukuze kuncishiswe ingcindezi yezingxenye ze-elekthronikhi ngesikhathi sokuhamba ngebhayisikili elishisayo. I-CTE ehambisana kahle phakathi kwezinto ezingagcwali phansi kanye nezithako kunciphisa ingozi yokukhathala okuhlangene kwe-solder, ukuqhekeka, noma okunye ukwehluleka kwemishini okubangelwa ukucindezeleka okushisayo. Ukwengeza, izinto ezingagcwalisi kahle kufanele zibonise ukuqhutshwa kwe-thermal okuhle ukuze kuqedwe ukushisa kahle, kuvinjwe izindawo ezishisayo ezingase zibe nomthelela ekusebenzeni nokuthembeka kwezingxenye.

Ngaphezu kwalokho, izinto zikagesi ezingaphansi kwezimoto kufanele zimelane nomswakama, amakhemikhali, noketshezi. Kufanele babe nokumuncwa kwamanzi okuphansi ukuvimbela ukukhula kwesikhunta noma ukugqwala kwezingxenye ze-elekthronikhi. Ukumelana namakhemikhali kuqinisekisa ukuthi into engagcwalisi kahle ihlala izinzile lapho ichayeke kuketshezi lwezimoto, olufana namafutha, izibaseli, noma izinto zokuhlanza, ukugwema ukuwohloka noma ukulahlekelwa ukunamathela.

Inqubo yokungagcwalisi kahle kwama-elekthronikhi ezimoto ngokuvamile ihlanganisa ukusabalalisa izinto ezingagcwali phansi ezingxenyeni ze-elekthronikhi, ukuyivumela ukuthi igeleze futhi igcwalise izikhala, bese iyelapha ukuze yakhe i-encapsulation eqinile. Inqubo yokwelapha ingafezwa ngezindlela zokwelashwa ezishisayo noma ze-UV, kuye ngezidingo eziqondile zohlelo kanye nezinto ezingagcwalisi phansi ezisetshenzisiwe.

Ukukhetha i-Underfill Epoxy Elungile

Ukukhetha i-epoxy yokugcwalisa kahle kuyisinqumo esibalulekile ekuhlanganisweni nasekuvikelweni kwezingxenye ze-elekthronikhi. Ama-epoxies angagcwalisi kakhulu ahlinzeka ngokuqiniswa kwemishini, ukuphatha okushisayo, nokuvikelwa ezicini zemvelo. Nazi ezinye izinto ezibalulekile zokucatshangelwa lapho ukhetha i-epoxy efanele yokugcwalisa okungaphansi:

1. Izakhiwo Ezishisayo: Omunye wemisebenzi eyinhloko ye-epoxy engagcwalisi kakhulu ukukhipha ukushisa okukhiqizwa izingxenye ze-elekthronikhi. Ngakho-ke, kubalulekile ukucabangela ukuqhutshwa kokushisa kwe-epoxy kanye nokumelana nokushisa. Ukushisa okuphezulu kwe-thermal kusiza ukudluliswa kokushisa okuphumelelayo, ukuvimbela izindawo ezishisayo nokugcina ukwethembeka kwengxenye. I-epoxy kufanele futhi ibe nokumelana okuphansi kokushisa ukuze kuncishiswe ukucindezeleka kokushisa ezingxenyeni ngesikhathi sokuhamba ngebhayisikili.
2. I-CTE Match: I-underfill epoxy's thermal expansion coefficient (CTE) kufanele ihambisane kahle ne-CTE yezingxenye ze-elekthronikhi kanye ne-substrate ukuze kuncishiswe ukucindezeleka okushisayo futhi kuvimbele ukuhluleka kokuhlangana kwe-solder. I-CTE ehambisana eduze isiza ukunciphisa ingozi yokwehluleka kwemishini ngenxa yokuhamba ngebhayisikili okushisayo.
3. Ikhono Lokugeleza Nokugcwalisa I-Gap: I-epoxy engagcwalisiwe kufanele ibe nezici ezinhle zokugeleza kanye nekhono lokugcwalisa izikhala phakathi kwezingxenye ngempumelelo. Lokhu kuqinisekisa ukumbozwa okuphelele futhi kunciphisa ama-void noma amaphakethe omoya angathinta ukuzinza komshini womhlangano nokusebenza okushisayo. I-viscosity ye-epoxy kufanele ifanele ukusetshenziswa okukhethekile kanye nendlela yokuhlanganisa, noma ngabe ukugeleza kwe-capillary, i-jet dispensing, noma ukuphrinta kwesikrini.
4. Ukunamathela: Ukunamathela okuqinile kubalulekile ekugcwaliseni i-epoxy ukuze kuqinisekiswe ukuhlangana okuthembekile phakathi kwezingxenye ne-substrate. Kufanele ikhombise ukunamathela okuhle ezintweni ezahlukahlukene, kufaka phakathi izinsimbi, izitsha zobumba, namapulasitiki. Izakhiwo zokunamathisela ze-epoxy zifaka isandla kubuqotho bemishini yomhlangano nokwethembeka kwesikhathi eside.
5. Indlela Yokwelapha: Cabangela indlela yokwelapha efaneleka kakhulu inqubo yakho yokukhiqiza. Ama-epoxies angagcwali angelapheka ngokushisa, ngemisebe ye-UV, noma inhlanganisela yakho kokubili. Indlela ngayinye yokwelapha inezinzuzo nemikhawulo, futhi ukukhetha leyo ehambisana nezidingo zakho zokukhiqiza kubalulekile.
6. Ukumelana Nemvelo: Linganisa ukumelana kwe-epoxy engagcwalisi ezicini zemvelo ezinjengomswakama, amakhemikhali, nokweqisa kwezinga lokushisa. I-epoxy kufanele ikwazi ukumelana nokuchayeka emanzini, ivimbele ukukhula kwesikhunta noma ukugqwala. Ukumelana namakhemikhali kuqinisekisa ukuzinza lapho uthintana noketshezi lwezimoto, izinto zokuhlanza, noma ezinye izinto ezingase zigqwalise. Ukwengeza, i-epoxy kufanele igcine izakhiwo zayo zemishini nezikagesi phezu kwebanga lokushisa elibanzi.
7. Ukuthembeka Nokuphila Isikhathi Eside: Cabangela irekhodi lokungagcwalisi kahle le-epoxy nedatha yokuthembeka. Bheka izinto ze-epoxy ezihloliwe futhi zafakazelwa ukuthi zisebenza kahle ezinhlelweni ezifanayo noma zibe nezitifiketi zomkhakha nokuhambisana nezindinganiso ezifanele. Cabangela izici ezifana nokuziphatha kokuguga, ukwethembeka kwesikhathi eside, kanye nekhono le-epoxy lokugcina izici zayo ngokuhamba kwesikhathi.

Lapho ukhetha i-epoxy efanele yokugcwalisa ngaphansi, kubalulekile ukucabangela izimfuneko ezithile zohlelo lwakho lokusebenza, okuhlanganisa ukuphathwa kwezinga lokushisa, ukuzinza kwemishini, ukuvikelwa kwemvelo, nokuhambisana kwenqubo yokukhiqiza. Ukubonisana nabahlinzeki be-epoxy noma ukufuna iseluleko sochwepheshe kungaba yinzuzo ekwenzeni isinqumo esinolwazi esihlangabezana nezidingo zohlelo lwakho lokusebenza futhi siqinisekise ukusebenza kahle nokwethembeka.

Amathrendi Esikhathi esizayo ku-Underfill Epoxy

I-underfill epoxy ithuthuka ngokuqhubekayo, iqhutshwa intuthuko kubuchwepheshe be-elekthronikhi, izinhlelo zokusebenza ezivelayo, kanye nesidingo sokusebenza okuthuthukisiwe nokwethembeka. Amathrendi amaningana esikhathi esizayo angabonwa ekuthuthukisweni nasekusetshenzisweni kwe-epoxy engagcwalisi kakhulu:

1. I-Miniaturization ne-Higher Density Packaging: Njengoba izinto ze-elekthronikhi ziqhubeka nokuncipha futhi zifaka ukuminyana okuphezulu kwezingxenye, ama-epoxies angagcwalisi kufanele azivumelanise ngokufanele. Amathrendi esikhathi esizayo azogxila ekuthuthukiseni izinto ezingagcwalisi kahle ezingena futhi zigcwalise izikhala ezincane phakathi kwezingxenye, ukuqinisekisa ukumbozwa okuphelele nokuvikelwa okuthembekile kuma-electronics akhula kancane kancane.
2. Izinhlelo zokusebenza Zemvamisa Ephakeme: Ngesidingo esikhulayo samadivayisi kagesi anemvamisa ephezulu kanye nesivinini esikhulu, ukwakheka kwe-epoxy okungagcwali kahle kuzodinga ukubhekana nezimfuneko ezithile zalezi zinhlelo zokusebenza. Izinto zokungagcwalisi kahle ezinama-dielectric aphansi ahlala njalo kanye nama-tangents okulahlekelwa kancane zizobaluleka ukuze kuncishiswe ukulahlekelwa kwesignali nokugcina ubuqotho bezimpawu zemvamisa ephezulu ezinhlelweni zokuxhumana ezithuthukisiwe, ubuchwepheshe be-5G, nezinye izinhlelo zokusebenza ezivelayo.
3. Ukulawulwa Okuthuthukisiwe Kokushisa: Ukuchithwa kokushisa kuhlala kuwukukhathazeka okubalulekile kwemishini kagesi, ikakhulukazi ngokuqina kwamandla okwandayo. Ukwakhiwa kwe-epoxy okungagcwaliswanga ngokuzayo kuzogxila ekuphatheni okuthuthukisiwe kwe-thermal ukuze kuthuthukiswe ukudluliswa kokushisa nokuphatha izindaba ezishisayo ngempumelelo. Izihlungi ezithuthukisiwe nezithasiselo zizofakwa kuma-epoxies angagcwali ukuze kuzuzwe ukuqhutshwa kwe-thermal okuphezulu ngenkathi kugcinwa ezinye izakhiwo ezifiselekayo.
4. I-Flexible and Stretchable Electronics: Ukukhuphuka kwezinto zikagesi eziguquguqukayo nezinwebekayo kuvula amathuba amasha okugcwalisa izinto ze-epoxy. Ama-epoxies angagcwalisi kahle aguquguqukayo kufanele abonise ukunamathela okuhle kakhulu kanye nezakhiwo zemishini ngisho nangaphansi kokugoba okuphindaphindiwe noma ukwelula. Lezi zinto zizovumela ukuhlanganisa nokuvikelwa kwezinto zikagesi kumadivayisi agqokekayo, izibonisi ezigobekayo, nezinye izinhlelo zokusebenza ezidinga ukuguquguquka kwemishini.
5. Izixazululo Ezilungele Imvelo: Ukusimama kanye nokucatshangelwa kwemvelo kuzodlala indima ebaluleke kakhulu ekuthuthukisweni kwezinto ezisetshenziswayo ze-epoxy. Kuzogxilwa ekwakhiweni kwe-epoxy engenazo izinto eziyingozi futhi anciphise umthelela wemvelo kuwo wonke umjikelezo wabo wokuphila, okuhlanganisa ukukhiqiza, ukusetshenziswa, nokulahlwa. Izinto ezisekelwe ku-bio noma ezivuselelekayo nazo zingazuza ukuvelela njengezinye izindlela ezisimeme.
6. Izinqubo Zokukhiqiza Ezithuthukisiwe: Amathrendi wesikhathi esizayo ku-underfill epoxy azogxila ezintweni ezibonakalayo kanye nentuthuko yezinqubo zokukhiqiza. Amasu afana nokukhiqiza okungeziwe, ukusabalalisa okukhethiwe, nezindlela zokwelapha ezithuthukisiwe zizocutshungulwa ukuze kusetshenziswe ngokugcwele kanye nokusebenza kwe-epoxy engagcwali kahle ezinqubweni ezihlukahlukene zokuhlanganisa i-elekthronikhi.
7. Ukuhlanganiswa Kwezindlela Zokuhlola Okuthuthukisiwe Nezimo Zezinhlamvu: Ngobunzima obukhulayo kanye nezidingo zemishini kagesi, kuzoba nesidingo sokuhlola okuthuthukile nezindlela zokulinganisa ukuze kuqinisekiswe ukwethembeka nokusebenza kwe-epoxy engagcwaliswanga kahle. Amasu afana nokuhlola okungalimazi, ukuqapha okungaphakathi kwendawo, namathuluzi okulingisa azosiza ekuthuthukisweni nasekulawuleni ikhwalithi yezinto ze-epoxy ezingagcwaliswanga ngokwanele.

Isiphetho

I-Underfill epoxy idlala indima ebalulekile ekuthuthukiseni ukwethembeka nokusebenza kwezingxenye ze-elekthronikhi, ikakhulukazi ekufakweni kwe-semiconductor. Izinhlobo ezahlukene ze-epoxy engagcwalisi kahle zinikeza uhla lwezinzuzo, okufaka ukwethembeka okuphezulu, ukuzikhipha, ukuminyana okuphezulu, nokusebenza okushisayo okuphezulu nokusebenzayo kwemishini. Ukukhetha i-epoxy efanele yokugcwalisa ngaphansi kohlelo lokusebenza nephakheji kuqinisekisa ibhondi eqinile nehlala isikhathi eside. Njengoba ubuchwepheshe buthuthuka nosayizi bephakheji bencipha, silindele izixazululo ezintsha zokungagcwalisi kahle kwe-epoxy ezinikeza ukusebenza okuphakeme, ukuhlanganiswa, kanye nokwenza kancane. I-underfill epoxy isethwe ukuthi idlale indima ebaluleke kakhulu esikhathini esizayo sezinto zikagesi, okusenza sikwazi ukufeza amazinga aphezulu okuthembeka nokusebenza ezimbonini ezahlukahlukene.