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Ukuzalisa ngaphantsi kwe-Epoxy

I-Underfill epoxy luhlobo lokuncamathelisa olusetyenziselwa ukomeleza ukuthembeka kwamalungu e-elektroniki, ngakumbi kwi-semiconductor yokupakisha izicelo. Izalisa isithuba phakathi kwepakethe kunye nebhodi yesekethe eprintiweyo (PCB), ukubonelela ngenkxaso yomatshini kunye noxinzelelo loxinzelelo ukukhusela ukwanda kwe-thermal kunye nomonakalo wokunqanda. I-epoxy engagcwaliswanga iphinda iphucule ukusebenza kombane wepakethe ngokunciphisa i-parasitic inductance kunye ne-capacitance. Kweli nqaku, siphonononga usetyenziso olwahlukeneyo lwe-epoxy engaphantsi, iintlobo ezahlukeneyo ezikhoyo, kunye nezibonelelo zazo.

Ukubaluleka kokuNgagcwaliswa kwe-Epoxy kwi-Semiconductor Packaging

I-epoxy engagcwaliswanga ibalulekile kwipakethe ye-semiconductor, ibonelela ngokuqiniswa koomatshini kunye nokhuseleko kwizinto ezibuthathaka ze-microelectronic. Yimpahla ekhethekileyo yokubambelela esetyenziselwa ukuzalisa isithuba phakathi kwe-chip ye-semiconductor kunye ne-substrate yephakheji, ukuphucula ukuthembeka kunye nokusebenza kwezixhobo zombane. Apha, siza kuphonononga ukubaluleka kwe-epoxy engagcwaliswanga ngokwaneleyo kwipakethe ye-semiconductor.

Omnye wemisebenzi ephambili ye-epoxy engagcwaliswanga kukuphucula amandla omatshini kunye nokuthembeka kwepakethe. Ngexesha lokusebenza, iitshiphusi ze-semiconductor ziphantsi koxinzelelo olwahlukeneyo lomatshini, olufana nokwandiswa kwe-thermal kunye nokucutheka, ukungcangcazela, kunye nomothuko womatshini. Olu xinzelelo lunokukhokelela ekubunjweni kweentanda ezidibeneyo ze-solder, ezinokubangela ukusilela kombane kunye nokunciphisa ixesha elide lobomi besixhobo. I-epoxy engagcwaliswanga isebenza njenge-arhente yokunciphisa uxinzelelo ngokusabalalisa uxinzelelo lomatshini ngokulinganayo kwi-chip, i-substrate, kunye ne-solder joints. Ukunciphisa ngokufanelekileyo ukubunjwa kokuqhekeka kunye nokuthintela ukusasazwa kweengqungquthela ezikhoyo, ukuqinisekisa ukuthembeka kwexesha elide lepakethe.

Omnye umba obalulekileyo wokuzaliswa ngaphantsi kwe-epoxy kukukwazi ukunyusa ukusebenza kwe-thermal yezixhobo ze-semiconductor. Ukutshatyalaliswa kobushushu kuba yinkxalabo ebalulekileyo njengoko izixhobo ze-elektroniki ziyancipha ngobukhulu kunye nokwandisa ubuninzi bamandla, kwaye ukushisa okugqithisileyo kunokunciphisa ukusebenza kunye nokuthembeka kwe-chip ye-semiconductor. I-epoxy ye-underfill ineempawu ezibalaseleyo ze-thermal conductivity, eyivumela ukuba idlulise ngokufanelekileyo ubushushu kwi-chip kwaye isasazwe kuyo yonke iphakheji. Oku kunceda ukugcina amaqondo okushisa asebenzayo kunye nokuthintela iindawo ezitshisa kakhulu, ngaloo ndlela kuphuculwe ulawulo olupheleleyo lwe-thermal yesixhobo.

I-epoxy engagcwaliswanga kwakhona ikhusela ukufuma kunye nezinto ezingcolisayo. Ukungena kobumanzi kunokukhokelela kwi-corrosion, ukuvuza kombane, kunye nokukhula kwezinto eziqhubayo, okubangela ukungasebenzi kakuhle kwesixhobo. I-epoxy engagcwaliswanga isebenza njengesithintelo, ukutywina iindawo ezisengozini kunye nokuthintela umswakama ukuba ungangeni kwiphakheji. Ikwabonelela ngokhuseleko kuthuli, ukungcola, kunye nezinye izinto ezingcolisayo ezinokuchaphazela kakubi ukusebenza kombane we-chip semiconductor. Ngokukhusela i-chip kunye nokudibanisa kwayo, i-epoxy engagcwaliswanga iqinisekisa ukuthembeka kwexesha elide kunye nokusebenza kwesixhobo.

Ngaphaya koko, i-epoxy engagcwaliswanga ngokwaneleyo yenza ukuba i-miniaturization ifakwe kwi-semiconductor package. Ngemfuno eqhubekayo yezixhobo ezincinci kunye nezixineneyo, i-epoxy engagcwaliswanga ngokwaneleyo ivumela ukusebenzisa i-flip-chip kunye ne-chip-scale packaging techniques. Obu buchule bubandakanya ukunyuswa ngokuthe ngqo kwe-chip kwi-substrate yephakheji, ukuphelisa imfuno yokudibanisa ucingo kunye nokunciphisa ubungakanani bephakheji. I-epoxy ye-Underfill ibonelela ngenkxaso yesakhiwo kunye nokugcina imfezeko ye-chip-substrate interface, eyenza ukuphunyezwa ngempumelelo kobu buchwepheshe bokupakisha buhamba phambili.

Indlela i-Underfill Epoxy ejongene ngayo nemingeni

Ukupakishwa kweSemiconductor kudlala indima ebalulekileyo ekusebenzeni kwesixhobo sombane, ukuthembeka, kunye nobomi obude. Ibandakanya i-encapsulating circuits (ICs) kwii-casings ezikhuselayo, ukubonelela ukudibanisa kombane, kunye nokukhupha ukushisa okwenziwa ngexesha lokusebenza. Nangona kunjalo, ukupakishwa kwe-semiconductor kujongene nemingeni emininzi, kubandakanya uxinzelelo lwe-thermal kunye ne-warpage, enokuthi ibe nefuthe elikhulu ekusebenzeni kunye nokuthembeka kwezixhobo ezipakishweyo.

Olunye ucelomngeni oluphambili luxinzelelo lobushushu. Iisekethe ezidibeneyo zivelisa ukushisa ngexesha lokusebenza, kwaye ukuchithwa okungonelanga kunokunyusa amaqondo okushisa ngaphakathi kwephakheji. Olu tshintsho lweqondo lokushisa lubangela uxinzelelo lwe-thermal njengoko izinto ezahlukeneyo ngaphakathi kwepakethe zanda kwaye zikhontrakthi kumazinga ahlukeneyo. Ukwandiswa okungekho yunifomu kunye nokucutha kunokubangela ukuxinana koomatshini, okukhokelela ekungaphumelelini kokuhlangana kwe-solder, i-delamination, kunye nokuqhekeka. Uxinzelelo lwe-thermal lunokuphazamisa ingqibelelo yombane kunye nomatshini wepakethe, ekugqibeleni ichaphazela ukusebenza kunye nokuthembeka kwesixhobo.

I-Warpage ngomnye umngeni obalulekileyo kwipakethe ye-semiconductor. Iphepha leWarpage libhekisa ekugobeni okanye ekujikeni kwesubstrate yephakheji okanye umqulu wonke. Ingenzeka ngexesha lenkqubo yokupakisha okanye ngenxa yoxinzelelo lwe-thermal. I-Warpage ngokuyinhloko ibangelwa ukungahambi kakuhle kwi-coefficient yokwandiswa kwe-thermal (CTE) phakathi kwezinto ezahlukeneyo kwiphakheji. Ngokomzekelo, i-CTE ye-silicon die, i-substrate, kunye ne-mold compound inokwahluka kakhulu. Xa ziphantsi kokutshintsha kweqondo lokushisa, ezi zixhobo zanda okanye zikhontrakthi ngamaxabiso ahlukeneyo, okukhokelela kwi-warpage.

I-Warpage ibeka iingxaki ezininzi kwiipakethe ze-semiconductor:

1. Inokubangela ukuba kugxininiswe kumanqaku oxinzelelo, ukwandisa amathuba okuba ukusilela komatshini kunye nokunciphisa ukuthembeka kwebhokisi.
2. I-Warpage inokukhokelela kubunzima kwinkqubo yendibano, njengoko ichaphazela ukulungelelaniswa kwephakheji kunye namanye amacandelo, njengebhodi yesekethe eprintiweyo (PCB). Oku kungahambi kakuhle kunokuphazamisa ukudityaniswa kombane kwaye kubangele imiba yokusebenza.
3. I-Warpage inokuchaphazela yonke ifom ye-package, iyenze kube nzima ukudibanisa isixhobo kwi-application factor encinci okanye ii-PCB ezinabantu abaninzi.

Ubuchule obahlukeneyo kunye nezicwangciso zisetyenziswa kwipakethe ye-semiconductor ukujongana nale mingeni. Ezi ziquka ukusebenzisa izinto eziphambili kunye nee-CTE ezihambelanayo zokunciphisa uxinzelelo lwe-thermal kunye ne-warpage. Ukulinganisa kwe-Thermo-mechanical kunye nemodeli kuqhutyelwa ukuqikelela ukuziphatha kwephakheji phantsi kweemeko ezahlukeneyo zokushisa. Ukuguqulwa koyilo, okufana nokwazisa izakhiwo zokunciphisa uxinzelelo kunye nezakhiwo eziphuculweyo, ziphunyezwa ukunciphisa uxinzelelo lwe-thermal kunye ne-warpage. Ukongeza, uphuhliso lweenkqubo eziphuculweyo zokuvelisa kunye nezixhobo zinceda ukunciphisa ukwenzeka kwe-warpage ngexesha lokuhlanganisa.

Iinzuzo ze-Underfill Epoxy

I-epoxy engagcwaliswanga licandelo elibalulekileyo kwipakethe ye-semiconductor ebonelela ngeenzuzo ezininzi. Esi sixhobo esikhethekileyo se-epoxy sisetyenziswa phakathi kwe-chip ye-semiconductor kunye ne-substrate yephakheji, ukubonelela ngokuqiniswa koomatshini kunye nokujongana nemingeni eyahlukeneyo. Nazi ezinye zezibonelelo ezibalulekileyo ze-epoxy engagcwaliswanga:

1. Ukuphucula ukuthembeka kweMechanical: Enye yeenzuzo eziphambili ze-epoxy engagcwaliswanga kukukwazi ukunyusa ukuthembeka koomatshini beepakethe ze-semiconductor. I-epoxy engagcwaliswanga idala iqhina elibambeneyo eliphucula imfezeko yesakhiwo ngokuzalisa izikhewu kunye ne-voids phakathi kwe-chip kunye ne-substrate. Oku kunceda ukuthintela i-warpage yepakethe, kunciphisa umngcipheko wokungaphumeleli koomatshini, kunye nokwandisa ukuchasana noxinzelelo lwangaphandle olufana nokungcangcazela, ukothuka, kunye nokuhamba ngebhayisekile eshushu. Ukuphuculwa kokuthembeka koomatshini kukhokelela ekongezeni kokuqina kwemveliso kunye nobomi obude besixhobo.
2. I-Thermal Stress Dissipation: Ukuzaliswa kwe-epoxy ngaphantsi kunceda ukukhupha uxinzelelo lwe-thermal ngaphakathi kwephakheji. Iisekethe ezidibeneyo zivelisa ukushisa ngexesha lokusebenza, kwaye ukuchithwa okungonelanga kunokubangela ukuhluka kweqondo lokushisa ngaphakathi kwesitya. Isixhobo se-epoxy esingagcwaliswanga, kunye ne-coefficient esezantsi yokwandiswa kwe-thermal (CTE) xa kuthelekiswa ne-chip kunye ne-substrate materials, isebenza njenge-buffer layer. Ifunxa i-mechanical strain ebangelwa kuxinzelelo lwe-thermal, ukunciphisa umngcipheko wokungaphumeleli kwe-solder, i-delamination, kunye nokuqhekeka. Ngokuchitha uxinzelelo lwe-thermal, i-epoxy engagcwaliswanga inceda ukugcina umbane wepakethi kunye nokunyaniseka komatshini.
3. Intsebenzo yoMbane eyomeleziweyo: Ukungagcwaliswa kwe-epoxy kuchaphazela kakuhle ukusebenza kombane kwezixhobo zesemiconductor. Izinto ze-epoxy zigcwalisa izithuba phakathi kwe-chip kunye ne-substrate, ukunciphisa i-parasitic capacitance kunye ne-inductance. Oku kubangela ukuphuculwa kwemfezeko yomqondiso, ukunciphisa ilahleko yesignali, kunye noqhagamshelo oluphuculweyo lombane phakathi kwetshiphu kunye nayo yonke ipakethe. Iziphumo ezincitshisiweyo zeparasitic zinegalelo ekusebenzeni ngcono kombane, amazinga aphezulu wokudluliselwa kwedatha, kunye nokwenyuka kokuthembeka kwesixhobo. Ukongeza, i-epoxy engazaliswanga ngokwaneleyo ibonelela ngokugquma kunye nokukhuselwa kumswakama, ungcoliseko, kunye nezinye izinto zokusingqongileyo ezinokuthoba ukusebenza kombane.
4. Ukunciphisa uxinzelelo kunye neNdibano ePhuculweyo: I-epoxy engagcwalisi isebenza njengendlela yokunciphisa uxinzelelo ngexesha lendibano. Izinto ze-epoxy zihlawulela ukungafani kwe-CTE phakathi kwe-chip kunye ne-substrate, ukunciphisa uxinzelelo lomatshini ngexesha lokutshintsha kweqondo lokushisa. Oku kwenza inkqubo yendibano ithembeke ngakumbi kwaye isebenze kakuhle, inciphisa umngcipheko womonakalo wepakethe okanye ukungahambi kakuhle. Ukuhanjiswa koxinzelelo olulawulwayo olubonelelwa yi-epoxy engagcwaliswanga kwakhona kunceda ukuqinisekisa ulungelelwaniso olufanelekileyo kunye namanye amacandelo kwibhodi yesekethe eprintiweyo (PCB) kunye nokuphucula isivuno sendibano ngokubanzi.
5. I-Miniaturization kunye neFom Factor Optimization: Ukungagcwaliswa kwe-epoxy kwenza i-miniaturization yeephakheji ze-semiconductor kunye nokulungiswa kwefom yefom. Ngokubonelela ngokuqiniswa kwesakhiwo kunye nokunciphisa uxinzelelo, i-epoxy engagcwaliswanga ivumela ukuyila kunye nokuveliswa kweepakethe ezincinci, ezincinci, kunye ne-compact. Oku kubaluleke kakhulu kwizicelo ezifana nezixhobo eziphathwayo kunye ne-elektronikhi ezinxitywayo, apho isithuba siphezulu. Ukukwazi ukukhulisa izinto zefom kunye nokufezekisa ukuxinana kwamacandelo aphezulu kunegalelo kwizixhobo zombane eziqhubela phambili kunye nentsha.

Iintlobo ze-Epoxy yokungagcwalisi

Iindidi ezininzi zokuzaliswa kwe-epoxy formulations ziyafumaneka kwipakethe ye-semiconductor, nganye eyenzelwe ukuhlangabezana neemfuno ezithile kunye nokujongana nemingeni eyahlukeneyo. Nazi ezinye iintlobo ezisetyenziswa ngokuqhelekileyo ze-epoxy yokuzalisa ngaphantsi:

1. I-Capillary Underfill Epoxy: I-Capillary underfill epoxy lolona hlobo lwemveli nolusetyenziswa kakhulu. I-epoxy ye-viscosity ephantsi igeleza kwi-gap phakathi kwe-chip kunye ne-substrate ngokusebenzisa i-capillary action. I-Capillary underfill idla ngokunikezelwa kumda we-chip, kwaye njengoko iphakheji ishushu, i-epoxy ihamba phantsi kwe-chip, igcwalisa i-voids. Olu hlobo lokungaphumeleli lufanelekile kwiiphakheji ezinezikhewu ezincinci kwaye zibonelela ngokuqiniswa kakuhle komatshini.
2. I-No-Flow Underfill Epoxy: Akukho-flow underfill epoxy yi-high-viscosity formulation engahambi ngexesha lokunyanga. Isetyenziswe njenge-epoxy efakwe ngaphambili okanye njengefilimu phakathi kwe-chip kunye ne-substrate. I-epoxy engagcwaliswanga ngaphantsi iluncedo kakhulu kwiiphakheji ze-flip-chip, apho i-solder bumps idibana ngokuthe ngqo ne-substrate. Iphelisa imfuno yokuhamba kwe-capillary kwaye inciphisa umngcipheko wokulimala kwe-solder ngexesha lokuhlanganisa.
3. I-Wafer-Level Underfill (i-WLU): I-Wafer-level underfill yi-epoxy engagcwaliswanga esetyenziswa kwinqanaba le-wafer phambi kokuba iitshiphusi ezizimeleyo zivalwe. Kubandakanya ukuhambisa imathiriyeli yokuzaliswa ngaphantsi komhlaba wonke kunye nokuwunyanga. I-Wafer-level underfill ibonelela ngeenzuzo ezininzi, kubandakanywa ukugqunywa kwe-uniform underfill, ukunciphisa ixesha lokuhlanganisa, kunye nokuphuculwa kolawulo lwenkqubo. Ngokuqhelekileyo isetyenziselwa ukwenza umthamo ophezulu wezixhobo ezincinci.
4. I-Molded Underfill (i-MUF): I-Underfill ebunjiweyo yi-epoxy engaphantsi kwe-epoxy esetyenziswa ngexesha lokubumba i-encapsulation. Izinto zokuzaliswa ngaphantsi zichithwa kwi-substrate, kwaye ke i-chip kunye ne-substrate zifakwe kwi-compound mold. Ngexesha lokubumba, i-epoxy igeleza kwaye igcwalise isithuba phakathi kwe-chip kunye ne-substrate, ukubonelela ngokuzaliswa ngaphantsi kunye ne-encapsulation kwisinyathelo esisodwa. Ukuzaliswa ngaphantsi okubunjiweyo kunika ukomelezwa koomatshini kunye nokwenza lula inkqubo yokuhlanganisa.
5. I-non-Conductive Underfill (NCF): I-epoxy engaqhubiyo yokuzaliswa ngaphantsi kwe-non-conductive ilungiselelwe ngokukodwa ukubonelela ngombane wodwa phakathi kwamalungu e-solder kwi-chip kunye ne-substrate. Iqulethe i-insulating fillers okanye izongezo ezithintela ukuhanjiswa kombane. I-NCF isetyenziswa kwizicelo apho ukunqanyulwa kombane phakathi kwamalungu e-solder akufutshane kuyinkxalabo. Inika zombini ukuqiniswa koomatshini kunye nokuhlukaniswa kombane.
6. I-Thermally Conductive Underfill (TCU): I-epoxy yokugcwalisa i-Thermally conductive yenzelwe ukunyusa amandla okuphelisa ubushushu bephakheji. Iqulethe iifayili ze-thermal conductive, ezifana ne-ceramic okanye iincinci zetsimbi, eziphucula ukuqhutyelwa kwe-thermal ye-underfill material. I-TCU isetyenziswa kwizicelo apho ukuhanjiswa kobushushu okufanelekileyo kubalulekile, njengezixhobo ezinamandla amakhulu okanye ezo zisebenza kwindawo ezifuna ubushushu.

Le yimizekelo nje embalwa yeentlobo ezahlukeneyo zokuzaliswa ngaphantsi kwe-epoxy ezisetyenziswa kwipakethe ye-semiconductor. Ukukhethwa kwe-epoxy efanelekileyo yokuzaliswa ngaphantsi kuxhomekeke kwizinto ezifana noyilo lwephakheji, inkqubo yokuhlanganisa, iimfuno ze-thermal, kunye nokuqwalaselwa kombane. I-epoxy nganye yokuzaliswa ngaphantsi inika iingenelo ezithile kwaye ilungiselelwe ukuhlangabezana neemfuno ezizodwa zezicelo ezahlukeneyo.

I-Capillary Underfill: I-Viscosity ephantsi kunye nokuthembeka okuphezulu

I-Capillary underfill ibhekisa kwinkqubo esetyenziswa kwishishini lokupakisha le-semiconductor ukwandisa ukuthembeka kwezixhobo zombane. Kubandakanya ukuzaliswa kwezithuba phakathi kwe-microelectronic chip kunye nephakheji yayo ejikelezileyo kunye ne-low-viscosity liquid material, ngokuqhelekileyo i-resin e-epoxy-based. Le nto ingaphantsi inika inkxaso yesakhiwo, iphucula ukuchithwa kwe-thermal, kwaye ikhusela i-chip kuxinzelelo lomatshini, ukufuma kunye nezinye izinto zokusingqongileyo.

Enye yeempawu ezibalulekileyo ze-capillary underfill yi-viscosity yayo ephantsi. Izinto zokuzaliswa ngaphantsi ziqulunqwe ukuba zibe noxinano oluphantsi, oluvumela ukuba luhambe lula kwizithuba ezimxinwa phakathi kwe-chip kunye nephakheji ngexesha lenkqubo yokuzaliswa ngaphantsi. Oku kuqinisekisa ukuba izinto ezingaphantsi komhlaba zingangena ngokufanelekileyo kwaye zizalise zonke i-voids kunye nezikhala zomoya, ukunciphisa umngcipheko wokwakhiwa kwe-void kunye nokuphucula ingqibelelo yonke ye-interface ye-chip-package.

Izinto ezisezantsi ze-viscosity capillary underfill nazo zibonelela ngezibonelelo ezininzi. Okokuqala, baququzelela ukuhamba kakuhle kwezinto eziphantsi kwe-chip, okukhokelela ekunciphiseni ixesha lenkqubo kunye nokwanda kwemveliso. Oku kubaluleke kakhulu kwiindawo zokuvelisa umthamo ophezulu apho ixesha kunye neendleko ezifanelekileyo zibalulekile.

Okwesibini, i-viscosity ephantsi yenza ukuba ngcono ukumanzisa kunye neempawu zokubambelela kwizinto ezingaphantsi. Ivumela ukuba izinto eziphathekayo zisasazeke ngokulinganayo kwaye zenze izibophelelo ezinamandla kunye ne-chip kunye nephakheji, ukudala i-encapsulation ethembekileyo neyomeleleyo. Oku kuqinisekisa ukuba itshiphu ikhuselwe ngokukhuselekileyo kuxinzelelo lomatshini olunje ngebhayisekile eshushu, ukothuka, kunye nokungcangcazela.

Omnye umba obalulekileyo we-capillary underfill kukuthembeka kwawo okuphezulu. Izinto eziphantsi kwe-viscosity underfill zenzelwe ngokukodwa ukubonisa ukuzinza kwe-thermal, iipropati zokugquma umbane, kunye nokuchasana nokufuma kunye neekhemikhali. Ezi mpawu zibalulekile ekuqinisekiseni ukusebenza kwexesha elide kunye nokuthembeka kwezixhobo zombane ezipakishiweyo, ngakumbi kwizicelo ezibangwayo ezifana nemoto, i-aerospace, kunye nonxibelelwano lomnxeba.

Ngapha koko, izixhobo zokuzalisa ii-capillary underfill ziyilelwe ukuba zibe namandla omatshini aphezulu kunye nokuncamathela okugqwesileyo kwizixhobo ezahlukeneyo ze-substrate, kubandakanya isinyithi, i-ceramics, kunye nezixhobo ze-organic eziqhelekileyo ezisetyenziswa kwipakethe ye-semiconductor. Oku kuvumela imathiriyeli yokuzaliswa ngaphantsi ukuba isebenze njengesithinteli soxinzelelo, ukufunxa ngokufanelekileyo kunye nokuchitha uxinzelelo lomatshini oluveliswa ngexesha lokusebenza okanye ukuvezwa kokusingqongileyo.

 

I-No-Flow Underfill: Ukuzabalaza kunye nokuPhumeza okuPhezulu

I-No-flow underfill yinkqubo ekhethekileyo esetyenziswa kwishishini lokupakisha le-semiconductor ukwandisa ukuthembeka kunye nokusebenza kakuhle kwezixhobo zombane. Ngokungafaniyo ne-capillary underfill, exhomekeke kwi-low-viscosity materials' flowing, akukho-flow underfills kusebenzisa indlela yokuzikhupha kunye nezixhobo eziphezulu ze-viscosity. Le ndlela inika iingenelo ezininzi, kubandakanywa ukuzilungelelanisa, ukuphumelela okuphezulu, kunye nokuthembeka okuphuculweyo.

Enye yeempawu ezibaluleke kakhulu zokungaphumeleli ngaphantsi kukukwazi ukuzikhupha. Izinto ezisetyenzisiweyo ezisetyenzisiweyo kule nkqubo zenziwe nge-viscosity ephezulu, evimbela ukuba ihambe ngokukhululekile. Endaweni yoko, i-underfill material isasazwa kwi-chip-package interface ngendlela elawulwayo. Olu lawulo olulawulwayo luvumela ukubeka ngokuchanekileyo ukufakwa kwezinto ezingaphantsi, ukuqinisekisa ukuba kusetyenziswe kuphela kwiindawo ezifunwayo ngaphandle kokuphuphuma okanye ukusasazeka ngokungalawulekiyo.

Ubume bokuzinikezela bokungabikho kokuhamba ngaphantsi kokungagcwaliswa kunika iinzuzo ezininzi. Okokuqala, ivumela ukulungelelaniswa kwezixhobo ezingaphantsi. Njengoko i-underfill ikhutshwa, iyazilungelelanisa ngokwemvelo kunye ne-chip kunye nephakheji, igcwalise izithuba kunye ne-voids ngokufanayo. Oku kuphelisa imfuno yokubeka ngokuchanekileyo kunye nokulungelelaniswa kwe-chip ngexesha lenkqubo yokungagcwaliswa, ukugcina ixesha kunye nomgudu wokuvelisa.

Okwesibini, i-self-dispensive feature ye-no-flow underfills ivumela ukuveliswa okuphezulu kwimveliso. Inkqubo yokuhambisa inokuthi izenzekele, ivumela usetyenziso olukhawulezileyo kunye nokungaguquguqukiyo kwezinto ezingagcwaliswanga phantsi kwiitshiphusi ezininzi ngaxeshanye. Oku kuphucula ukusebenza kakuhle kwemveliso kunye nokunciphisa iindleko zokuvelisa, kuyenza ibe luncedo ngakumbi kwiindawo zokuvelisa umthamo ophezulu.

Ngaphaya koko, imathiriyeli yokungazaliswanga ngaphantsi kwe-flow flow ilungiselelwe ukunika ukuthembeka okuphezulu. Izinto eziphantsi kwe-viscosity underfill zinika ukuchasana okuphuculweyo kwibhayisikile ye-thermal, uxinzelelo lomatshini, kunye nezinto ezisingqongileyo, eziqinisekisa ukusebenza kwexesha elide lezixhobo zombane ezipakishweyo. Izixhobo zibonisa ukuzinza okuhle kakhulu kwe-thermal, iipropati zokugquma umbane, kunye nokuchasana nokufuma kunye neekhemikhali, ezinegalelo ekuthembekeni okupheleleyo kwezixhobo.

Ukongeza, izixhobo zokuzaliswa kwe-viscosity ephezulu ezisetyenziselwa ukungahambi ngaphantsi kokuhamba ngaphantsi kokuphucula amandla omatshini kunye neempawu zokubambelela. Benza izibophelelo eziqinileyo kunye ne-chip kunye nephakheji, ngokufanelekileyo ukufunxa kunye nokuchitha uxinzelelo lomatshini oluveliswa ngexesha lokusebenza okanye ukuvezwa kokusingqongileyo. Oku kunceda ukukhusela itshiphu kumonakalo onokubakho kwaye konyusa ukuxhathisa kwesixhobo kwizothuso zangaphandle kunye nokungcangcazela.

I-Molded Underfill: uKhuseleko oluPhezulu kunye nokudibanisa

Ukungagcwaliswa okubunjiweyo bubuchule obuphambili obusetyenziswa kwishishini lokupakisha le-semiconductor ukubonelela ngamanqanaba aphezulu okhuseleko kunye nokuhlanganiswa kwezixhobo zombane. Ibandakanya ukugquma itshiphu yonke kunye nephakheji yayo eyingqongileyo kunye nekhompawundi yokungunda ebandakanya imathiriyeli yokungazali. Le nkqubo ibonelela ngeenzuzo ezibalulekileyo malunga nokukhusela, ukudibanisa, kunye nokuthembeka ngokubanzi.

Enye yeenzuzo ezibalulekileyo zokungagcwaliswa okubunjiweyo kukukwazi ukubonelela ngokhuseleko olubanzi lwetshiphu. I-compound yokubumba esetyenziswe kule nkqubo isebenza njengesithintelo esomeleleyo, sivale i-chip yonke kunye nephakheji kwigobolondo elikhuselayo. Oku kubonelela ngokhuselo olusebenzayo ngokuchasene nezinto zokusingqongileyo ezifana nokufuma, uthuli, kunye nongcoliseko olunokuchaphazela ukusebenza kunye nokuthembeka kwesixhobo. I-encapsulation iphinda incede ukukhusela i-chip kuxinzelelo lwe-mechanical, ibhayisikili ye-thermal, kunye neminye imikhosi yangaphandle, iqinisekisa ukuqina kwayo kwexesha elide.

Ukongezelela, ukugcwaliswa okungaphantsi okubunjiweyo kwenza amanqanaba aphezulu okudibanisa ngaphakathi kwephakheji ye-semiconductor. Izinto ezingaphantsi zixutywe ngokuthe ngqo kwi-mold compound, evumela ukuhlanganiswa okungenamthungo kokungaphumeleli kunye neenkqubo ze-encapsulation. Oku kudityaniswa kuphelisa imfuneko yenyathelo elahlukileyo lokungagcwaliswa kakuhle, ukwenza lula inkqubo yokuvelisa kunye nokunciphisa ixesha lokuvelisa kunye neendleko. Ikwaqinisekisa ukusasazwa okungaguqukiyo kunye nokufanayo kokungagcwaliswanga ngokwaneleyo kuyo yonke iphakheji, ukunciphisa i-voids kunye nokuphucula imfezeko yesakhiwo ngokubanzi.

Ngaphezu koko, ukugcwaliswa okubunjiweyo okubunjiweyo kubonelela ngeempawu ezibalaseleyo zokulahla ubushushu. Ikhompawundi yokungunda yenzelwe ukuba ne-thermal conductivity ephezulu, evumela ukuba idlulise ubushushu kude ne-chip ngokufanelekileyo. Oku kubalulekile ekugcineni ubushushu obuphezulu bokusebenza kwesixhobo kunye nokuthintela ukushisa okugqithisileyo, okunokukhokelela ekuthotyweni kokusebenza kunye nemiba yokuthembeka. Iipropathi eziphuculweyo zokuchitha ubushushu bomthamo ongaphantsi obunjiweyo unegalelo ekuthembekeni okupheleleyo kunye nobomi obude besixhobo sombane.

Ngaphaya koko, ukugcwaliswa okungaphantsi okubunjiweyo kwenza ukuba i-miniaturization eyongezelelekileyo kunye nokwenza ngcono izinto. Inkqubo yokufakwa kwe-encapsulation inokulungelelaniswa ukulungiselela ubungakanani bepakethe eyahlukeneyo kunye neemilo, kubandakanywa nezakhiwo ezintsonkothileyo ze-3D. Oku kuguquguquka kuvumela ukudibanisa iichips ezininzi kunye nezinye izinto kwi-compact, iphakheji efanelekileyo yendawo. Ukukwazi ukufikelela kumanqanaba aphezulu okudityaniswa ngaphandle kokubeka esichengeni ukuthembeka kwenza ukuba ukungagcwaliswa okubunjiweyo kuxabiseke ngakumbi kwizicelo apho ubungakanani kunye nemithintelo yobunzima ibaluleke kakhulu, njengezixhobo eziphathwayo, izinto ezinxitywayo, kunye ne-automotive electronics.

I-Chip Scale Package (CSP) I-Underfill: I-Miniaturization kunye ne-High Density

I-Chip Scale Package (CSP) i-underfill yitekhnoloji ebalulekileyo eyenza i-miniaturization kunye nokudibanisa okuphezulu kwesixhobo sombane. Njengoko izixhobo zombane ziqhubeka nokuncipha ngobukhulu ngelixa zibonelela ngokusebenza okwandisiweyo, i-CSP ayifezi indima ebalulekileyo ekuqinisekiseni ukuthembeka nokusebenza kwezi zixhobo zihlangeneyo.

I-CSP iteknoloji yokupakisha evumela ukuba i-chip ye-semiconductor ifakwe ngokuthe ngqo kwi-substrate okanye ibhodi yesekethe eprintiweyo (PCB) ngaphandle kokufuna iphakheji eyongezelelweyo. Oku kuphelisa imfuno yeplastiki yendabuko okanye isitya se-ceramic, ukunciphisa ubukhulu kunye nobunzima besixhobo. I-CSP igcwalisa inkqubo apho i-liquid okanye i-encapsulant isetyenziselwa ukugcwalisa umsantsa phakathi kwe-chip kunye ne-substrate, ukubonelela ngenkxaso yomatshini kunye nokukhusela i-chip kwizinto zokusingqongileyo ezifana nokufuma kunye noxinzelelo lomatshini.

I-Miniaturization ifezekiswa ngokuzaliswa ngaphantsi kwe-CSP ngokunciphisa umgama phakathi kwe-chip kunye ne-substrate. Izinto zokungaphumeleli zizalisa i-gap encinci phakathi kwe-chip kunye ne-substrate, ukudala ibhondi eqinile kunye nokuphucula ukuzinza komatshini we-chip. Oku kuvumela izixhobo ezincinci kunye nezincinci, okwenza kube lula ukupakisha ukusebenza okungaphezulu kwindawo encinci.

Umdibaniso woxinaniso oluphezulu lolunye uncedo lwe-CSP yokungagcwaliswa kakuhle. Ngokuphelisa imfuno yephakheji eyahlukileyo, i-CSP yenza ukuba i-chip ifakwe kufuphi namanye amacandelo kwi-PCB, ukunciphisa ubude boqhagamshelwano lombane kunye nokuphucula imfezeko yomqondiso. Izinto zokuzaliswa ngaphantsi zisebenza njengomqhubi we-thermal, ngokufanelekileyo ukukhupha ukushisa okwenziwa yi-chip. Esi sikhundla solawulo lwe-thermal sivumela ukuxinana kwamandla aphezulu, okwenza ukudityaniswa kweechips ezinzima kunye ezinamandla kwizixhobo zombane.

Izixhobo zokuzaliswa ngaphantsi kwe-CSP kufuneka zibe neempawu ezithile ukuhlangabezana neemfuno zeminiaturization kunye noxinaniso oluphezulu. Kufuneka babe ne-viscosity ephantsi ukwenzela ukuba kube lula ukuzaliswa kwezithuba ezinqabileyo, kunye neempawu ezihamba phambili zokuqinisekisa ukugubungela okufanayo kunye nokuphelisa i-voids. Izinto eziphathekayo kufuneka kwakhona zibe nokubambelela kakuhle kwi-chip kunye ne-substrate, ukubonelela ngenkxaso eqinile yomatshini. Ukongeza, kufuneka babonise ukuhanjiswa okuphezulu kwe-thermal ukuhambisa ubushushu kude ne-chip ngokufanelekileyo.

I-Wafer-Level ye-CSP yaNgaphantsi: Ixabiso-Ngempumelelo kunye neSivuno esiPhezulu

Ipakethe yesikali se-Wafer-level chip scale (WLCSP) yindlela yokupakisha eyonga iindleko neyimveliso ephezulu ebonelela ngeenzuzo ezininzi ekuveliseni impumelelo kunye nomgangatho wemveliso ngokubanzi. Ukuzaliswa ngaphantsi kwe-WLCSP kusebenzisa imathiriyeli yokuzaliswa ngaphantsi kweetshiphusi ezininzi ngaxeshanye zisekwimo ye-wafer phambi kokuba zifakwe kwipakethe nganye. Le ndlela ibonelela ngeenzuzo ezininzi malunga nokuncitshiswa kweendleko, ukuphuculwa kolawulo lwenkqubo, kunye nezivuno eziphezulu zemveliso.

Olunye uncedo olubalulekileyo lwe-WLCSP yokungazaliseki kakuhle kweendleko. Ukusebenzisa i-underfill material kwizinga le-wafer kwenza inkqubo yokupakisha ilungelelaniswe kwaye isebenze. Izinto ezingagcwaliswanga ngokwaneleyo zinikezelwa kwi-wafer ngokusebenzisa inkqubo elawulwayo kunye ne-automated, ukunciphisa inkunkuma yezinto kunye nokunciphisa iindleko zomsebenzi. Ukongezelela, ukuphelisa ukuphathwa kwephakheji yomntu ngamnye kunye namanyathelo okulungelelaniswa kunciphisa ixesha elipheleleyo lokuvelisa kunye nobunzima, okukhokelela ekugcinweni kweendleko ezibalulekileyo xa kuthelekiswa neendlela zokupakisha eziqhelekileyo.

Ngaphezu koko, i-WLCSP engagcwaliswanga ibonelela ngolawulo lwenkqubo oluphuculweyo kunye nezivuno eziphezulu zemveliso. Ekubeni i-underfill imathiriyeli isetyenziswa kwinqanaba le-wafer, yenza ukuba kube lula ukulawula inkqubo yokuhambisa, iqinisekisa ukugutyungelwa okungaguqukiyo kunye nokufanayo kwi-chip nganye kwi-wafer. Oku kunciphisa umngcipheko we-voids okanye ukungagcwaliswa okungaphelelanga, oku kunokukhokelela kwimiba yokuthembeka. Ukukwazi ukuhlola kunye nokuvavanya umgangatho wokuzaliswa ngaphantsi kwinqanaba le-wafer likwavumela ukubonwa kwangaphambili kweziphene okanye ukuhluka kwenkqubo, okwenza izenzo zokulungisa ngexesha elifanelekileyo kunye nokunciphisa amathuba okuba neepakethe eziphosakeleyo. Ngenxa yoko, i-WLCSP engagcwaliswanga inceda ukufezekisa izivuno eziphezulu zemveliso kunye nomgangatho ongcono wemveliso ngokubanzi.

Indlela ye-wafer-level nayo yenza ukuba kuphuculwe ukusebenza kwe-thermal kunye noomatshini. Imathiriyeli yokungagcwalisi esetyenziswa kwi-WLCSP ikholisa ukuba yi-low-viscosity, imathiriyeli equkuqelayo ye-capillary enokugcwalisa ngokufanelekileyo izithuba emxinwa phakathi kweetshiphusi kunye ne-wafer. Oku kubonelela ngenkxaso eqinileyo yoomatshini kwiitshiphusi, ukomeleza ukuxhathisa kwabo kuxinzelelo lomatshini, ukungcangcazela, kunye nokuhamba ngebhayisekile kobushushu. Ukongezelela, izinto ezingaphantsi kwe-underfill zisebenza njengomqhubi we-thermal, ukuququzelela ukutshatyalaliswa kobushushu obuveliswa yi-chips, ngaloo ndlela kuphuculwe ulawulo lwe-thermal kunye nokunciphisa umngcipheko wokushisa.

I-Flip Chip Underfill: Ubuninzi be-I / O obuphezulu kunye nokuSebenza

I-Flip chip underfill yiteknoloji ebalulekileyo eyenza igalelo / imveliso ephezulu (I/O) ingxinano kunye nokusebenza okungaqhelekanga kwizixhobo zombane. Idlala indima ebalulekileyo ekwandiseni ukuthembeka kunye nokusebenza kwe-flip-chip packaging, esetyenziswa ngokubanzi kwizicelo eziphambili ze-semiconductor. Eli nqaku liza kuphonononga ukubaluleka kwe-flip chip underfill kunye nefuthe layo ekufezekiseni ubuninzi be-I / O kunye nokusebenza.

Iteknoloji ye-Flip chip ibandakanya uxhulumaniso oluthe ngqo lombane lwesekethe edibeneyo (IC) okanye i-semiconductor die kwi-substrate, ukuphelisa imfuno yokudibanisa ucingo. Oku kubangela iphakheji edibeneyo kunye nokusebenza kakuhle, njengoko iipads ze-I / O zibekwe kwindawo ephantsi yokufa. Nangona kunjalo, ukupakishwa kwe-flip-chip kuzisa imingeni ekhethekileyo ekufuneka ijongiwe ukuze kuqinisekiswe ukusebenza kakuhle kunye nokuthembeka.

Omnye wemiceli mngeni ebalulekileyo ekupakishweni kwe-flip chip kukuthintela uxinzelelo lomatshini kunye nokungafani kobushushu phakathi kokufa kunye ne-substrate. Ngethuba lenkqubo yokuvelisa kunye nokusebenza okulandelayo, ukungafani kwe-coefficients yokwandiswa kwe-thermal (CTE) phakathi kwe-die kunye ne-substrate kunokubangela uxinzelelo olubalulekileyo, olukhokelela ekunciphiseni ukusebenza okanye ukungaphumeleli. I-Flip chip underfill yinto ekhuselayo edibanisa i-chip, ibonelela ngenkxaso yomatshini kunye noxinzelelo loxinzelelo. Isasaza ngokufanelekileyo uxinzelelo olwenziwe ngexesha lokuhamba ngebhayisikile ye-thermal kwaye lubathintele ekuchaphazeni unxibelelwano oluthambileyo.

Uxinaniso oluphezulu lwe-I/O lubalulekile kwizixhobo zombane zanamhlanje, apho izinto ezincinci zeefom kunye nokusebenza okwandisiweyo kubalulekile. I-Flip chip underfill yenza ukuba ingxinano ye-I/O ephezulu inike ubushushu bombane obuphezulu kunye nobuchule bolawulo lobushushu. I-underfill material igcwalisa i-gap phakathi kwe-die kunye ne-substrate, idala i-interface eyomeleleyo kunye nokunciphisa umngcipheko weesekethe ezimfutshane okanye ukuvuza kombane. Oku kuvumela izithuba ezikufutshane ze-I/O pads, okukhokelela ekunyukeni koxinzelelo lwe-I/O ngaphandle kokuncama ukuthembeka.

Ngaphezu koko, i-flip chip underfill inegalelo ekuphuculeni ukusebenza kombane. Inciphisa i-parasitics yombane phakathi kwe-die kunye ne-substrate, ukunciphisa ukulibaziseka komqondiso kunye nokuphucula ukunyaniseka komqondiso. Izinto ezingaphantsi komhlaba zikwabonisa iimpawu ezibalaseleyo ze-thermal conductivity, ngokufanelekileyo ukukhupha ukushisa okwenziwa yi-chip ngexesha lokusebenza. Ukutshatyalaliswa kokushisa okusebenzayo kuqinisekisa ukuba ubushushu buhlala ngaphakathi kwemida eyamkelekileyo, ukuthintela ukufudumala nokugcina ukusebenza kakuhle.

Ukuqhubela phambili kwi-flip chip imathiriyeli yokuzaliswa ngaphantsi kwenze ukuba ingxinano ye-I/O ephezulu kunye namanqanaba okusebenza. I-Nanocomposite underfills, umzekelo, i-nanoscale fillers iphakamisa i-nanoscale fillers ukunyusa i-thermal conductivity kunye namandla omatshini. Oku kuvumela ukuphuculwa kokutshatyalaliswa kobushushu kunye nokuthembeka, okwenza izixhobo zokusebenza eziphezulu.

I-Ball Grid Array (BGA) I-Underfill: i-Thermal ephezulu kunye ne-Mechanical Performance

I-Ball Grid Array (BGA) ayizaliseki itekhnoloji ebalulekileyo enika ukusebenza okuphezulu kwe-thermal kunye noomatshini kwizixhobo zombane. Idlala indima ebalulekileyo ekwandiseni ukuthembeka kunye nokusebenza kweephakheji ze-BGA, ezisetyenziswa ngokubanzi kwizicelo ezahlukeneyo. Kweli nqaku, siza kuphonononga ukubaluleka kokungagcwaliswa kwe-BGA kunye nefuthe layo ekufezekiseni ukusebenza okuphezulu kwe-thermal kunye noomatshini.

Itekhnoloji ye-BGA ibandakanya uyilo lwephakheji apho isekethe edibeneyo (IC) okanye i-semiconductor die ifakwe kwi-substrate, kwaye uqhagamshelo lombane lwenziwa ngoluhlu lweebhola ze-solder ezibekwe kumphezulu ongezantsi wepakethe. I-BGA igcwalisa izinto ezichithwa kwi-gap phakathi kwe-die kunye ne-substrate, ifake iibhola ze-solder kunye nokubonelela ngenkxaso yomatshini kunye nokukhusela kwindibano.

Omnye wemingeni ebaluleke kakhulu kwi-BGA yokupakishwa kulawulo loxinzelelo lwe-thermal. Ngethuba lokusebenza, i-IC ivelisa ukushisa, kunye nokwandiswa kwe-thermal kunye nokunciphisa kunokubangela uxinzelelo olubalulekileyo kumalungu e-solder adibanisa i-die kunye ne-substrate. I-BGA ayifezekisi indima ebalulekileyo ekuthomalaliseni olu xinzelelo ngokwenza iqhina eliqinileyo lokufa kunye ne-substrate. Isebenza njengesithinteli soxinzelelo, ifunxa ukwanda kwe-thermal kunye nokunciphisa kunye nokunciphisa uxinzelelo kumalungu e-solder. Oku kunceda ukuphucula ukuthembeka kwepakethi ngokubanzi kwaye kunciphisa umngcipheko wokungaphumeleli kwe-solder joint.

Omnye umba obalulekileyo wokungagcwaliswa kwe-BGA kukukwazi ukonyusa ukusebenza koomatshini bepakethe. Iiphakheji ze-BGA zihlala ziphantsi koxinzelelo lomatshini ngexesha lokuphatha, ukudibanisa, kunye nokusebenza. Izinto ezingaphantsi kokugcwalisa i-gap phakathi kwe-die kunye ne-substrate, ukubonelela ngenkxaso yesakhiwo kunye nokuqiniswa kumalungu e-solder. Oku kuphucula amandla omatshini ewonke endibano, okwenza ukuba ixhathise ngakumbi ukothuka koomatshini, ukungcangcazela, kunye namanye amandla angaphandle. Ngokusasaza ngokufanelekileyo uxinzelelo lomatshini, i-BGA underfill inceda ukunqanda ukuqhekeka kwepakethe, i-delamination, okanye okunye ukusilela koomatshini.

Ukusebenza okuphezulu kwe-thermal kubalulekile kwizixhobo zombane ukuqinisekisa ukusebenza kakuhle kunye nokuthembeka. Izixhobo zokuzaliswa ngaphantsi kwe-BGA ziyilelwe ukuba zibe neempawu ezibalaseleyo zokuqhuba i-thermal. Oku kubavumela ukuba badlulise ngokufanelekileyo ubushushu kude kwi-die kwaye basasaze kuyo yonke i-substrate, ukuphucula ulawulo lwe-thermal yephakheji. Ukutshatyalaliswa kobushushu okusebenzayo kunceda ukugcina amaqondo okushisa aphantsi okusebenza, ukuthintela iindawo ezitshisayo kunye nokunciphisa ukusebenza okunokwenzeka. Ikwanegalelo kubomi obude bebhokisi ngokunciphisa amacandelo 'uxinzelelo lwe-thermal.

Ukuqhubela phambili kwizinto ze-BGA zokuzaliswa ngaphantsi kukhokelela ekusebenzeni okuphezulu kwe-thermal kunye noomatshini. Ukuqulunqwa okuphuculweyo kunye nezixhobo zokuzalisa, ezifana ne-nanocomposites okanye iifayili eziphezulu ze-thermal conductivity, zenze ukuba ukutshatyalaliswa kobushushu obungcono kunye namandla omatshini, kuphuculwe ngakumbi ukusebenza kweephakheji ze-BGA.

I-Quad Flat Package (QFP) I-Underfill: I-I / O enkulu yokubala kunye nokuqina

I-Quad Flat Package (QFP) yiphakheji edibeneyo yesekethe (IC) esetyenziswa kakhulu kwi-electronics. Ibonisa imilo yesikweri okanye uxande kunye nemikhombandlela ephuma kuwo onke amacala amane, ibonelela ngee-input/outputs ezininzi (I/O) zoqhagamshelo. Ukuphucula ukuthembeka kunye nokomelela kweepakethi ze-QFP, izinto ezingaphantsi komgangatho zisetyenziswa ngokuqhelekileyo.

I-Underfill yinto ekhuselayo esetyenziswayo phakathi kwe-IC kunye ne-substrate ukuqinisa amandla omatshini we-solder joints kunye nokukhusela ukungaphumeleli okubangelwa uxinzelelo. Kubaluleke kakhulu kwii-QFPs ezinobalo olukhulu lwe-I/O, njengoko inani eliphezulu loqhagamshelo linokukhokelela kuxinzelelo olubalulekileyo lomatshini ngexesha lokuhamba ngebhayisikile eshushu kunye neemeko zokusebenza.

Imathiriyeli yokuzaliswa ngaphantsi esetyenziselwa iiphakheji ze-QFP kufuneka ibe neempawu ezithile zokuqinisekisa ukomelela. Okokuqala, kufuneka ibe nokunamathela okugqwesileyo kuzo zombini i-IC kunye ne-substrate ukudala ibhondi eyomeleleyo kunye nokunciphisa umngcipheko wokuchithwa okanye ukuchithwa. Ukongezelela, kufuneka ibe ne-coefficient ephantsi yokwandiswa kwe-thermal (CTE) ukufanisa i-CTE ye-IC kunye ne-substrate, ukunciphisa ukuxhatshazwa koxinzelelo olunokuthi lukhokelela ekuqhekekeni okanye ukuphuka.

Ngaphezu koko, izinto zokuzaliswa ngaphantsi kufuneka zibe neepropati ezihamba kakuhle zokuqinisekisa ukugubungela okufanayo kunye nokuzaliswa okupheleleyo kwesithuba phakathi kwe-IC kunye ne-substrate. Oku kunceda ekupheliseni i-voids, enokuthi yenze buthathaka i-solder joints kunye nesiphumo sokunciphisa ukuthembeka. Izinto eziphathekayo kufuneka zibe neempawu ezintle zokuphilisa, ezivumela ukuba zenze umaleko okhuselekileyo okhuselekileyo emva kokusetyenziswa.

Ngokokomelela koomatshini, ukugcwaliswa ngaphantsi kufuneka kube ne-chear ephezulu kunye namandla e-peel ukumelana namandla angaphandle kunye nokuthintela ukonakala kwephakheji okanye ukwahlula. Kufuneka kwakhona ibonise ukuxhathisa okulungileyo kumswakama kunye nezinye izinto zokusingqongileyo ukugcina iimpawu zayo zokukhusela ekuhambeni kwexesha. Oku kubaluleke kakhulu kwizicelo apho iphakheji ye-QFP inokuthi ibonakaliswe kwiimeko ezinzima okanye iguquke kwiqondo lokushisa.

Izixhobo ezahlukeneyo zokuzaliswa ngaphantsi zikhoyo ukuze kuphunyezwe ezi mpawu zinqwenelekayo, kubandakanywa ukwakhiwa kwe-epoxy-based formulations. Ngokuxhomekeke kwiimfuno ezithile zesicelo, ezi zixhobo zinokusasazwa kusetyenziswa iindlela ezahlukeneyo, ezifana nokuhamba kwe-capillary, i-jetting, okanye ukuprintwa kwesikrini.

I-System-in-Package (SiP) I-Underfill: Ukudibanisa kunye nokuSebenza

I-System-in-Package (i-SiP) yitekhnoloji yokupakisha ephucukileyo edibanisa iitshiphusi ezininzi ze-semiconductor, ii-passive components, kunye nezinye izinto kwi-package enye. I-SiP ibonelela ngezinto ezininzi eziluncedo, kubandakanya ukuncitshiswa kwefomu, ukuphuculwa kokusebenza kombane, kunye nokusebenza okuphuculweyo. Ukuqinisekisa ukuthembeka kunye nokusebenza kweendibano ze-SiP, izinto zokuzaliswa ngaphantsi zisetyenziswa ngokuqhelekileyo.

Ukungagcwaliswa kwezicelo ze-SiP kubalulekile ekunikeni uzinzo lomatshini kunye noqhagamshelo lombane phakathi kwamacandelo ahlukeneyo ngaphakathi kwepakethe. Inceda ukunciphisa umngcipheko wokungaphumeleli okubangelwa uxinzelelo, njengokuqhekeka kwe-solder okanye i-fractures, enokuthi yenzeke ngenxa yokwahlukana kwe-coefficients yokwandiswa kwe-thermal (CTE) phakathi kwamacandelo.

Ukudibanisa amacandelo amaninzi kwiphakheji ye-SiP kukhokelela kwi-interconnectivity eyinkimbinkimbi, kunye namalungu amaninzi e-solder kunye ne-high-density circuitry. Izinto zokuzalisa ngaphantsi zinceda ukuqinisa ezi zidibaniso, ukwandisa amandla omatshini kunye nokuthembeka kwendibano. Baxhasa i-solder joints, ukunciphisa umngcipheko wokukhathala okanye umonakalo obangelwa ukuhamba ngebhayisikili ye-thermal okanye uxinzelelo lomatshini.

Ngokubhekiselele ekusebenzeni kombane, izinto zokungaphumeleli zibaluleke kakhulu ekuphuculeni ukunyaniseka komqondiso kunye nokunciphisa ingxolo yombane. Ngokuzalisa izikhewu phakathi kwamacandelo kunye nokunciphisa umgama phakathi kwabo, ukungaphumeleli kunceda ukunciphisa i-parasitic capacitance kunye ne-inductance, eyenza ukuhanjiswa kwesignali ngokukhawuleza nangempumelelo.

Ukongezelela, izixhobo ezingaphantsi kwezicelo ze-SiP kufuneka zibe ne-conductivity egqwesileyo ye-thermal yokuchitha ukushisa okwenziwa ngamacandelo adibeneyo ngokufanelekileyo. Ukutshatyalaliswa kokushisa okusebenzayo kubalulekile ukukhusela ukushisa nokugcina ukuthembeka okupheleleyo kunye nokusebenza kwendibano ye-SiP.

Izinto zokungaphumeleli kwipakethe ye-SiP kufuneka zibe neepropati ezithile ukuhlangabezana nezi mfuno zokudibanisa kunye nokusebenza. Kufuneka babe nokuhamba kakuhle kokuqinisekisa ukugubungela okupheleleyo kunye nokuvala izikhewu phakathi kwamacandelo. Izinto ezingaphantsi komhlaba kufuneka kwakhona zibe ne-low-viscosity formulation ukuvumela ukusabalalisa lula kunye nokuzaliswa kwimingxuma emincinci okanye izithuba ezincinci.

Ngapha koko, imathiriyeli yokuzaliswa ngaphantsi kufuneka ibonise ukunamathela okuqinileyo kwiindawo ezahlukeneyo, kubandakanya iitshiphusi ze-semiconductor, ii-substrates, kunye ne-passives, ukuqinisekisa ukubamba okuthembekileyo. Kufuneka ihambelane nezinto ezahlukeneyo zokupakisha, ezifana ne-organic substrates okanye i-ceramics, kwaye ibonise iimpawu ezintle zoomatshini, kubandakanywa ukucheba okuphezulu kunye namandla e-peel.

Isixhobo sokungagcwaliswa kunye nendlela yokusetyenziswa kwesicelo ixhomekeke kuyilo oluthile lweSiP, iimfuno zecandelo, kunye neenkqubo zokuvelisa. Iindlela zokukhupha ezifana nokuhamba kwe-capillary, i-jetting, okanye iindlela zokuncedisa ifilimu zihlala zisebenza ngaphantsi kweendibano ze-SiP.

I-Optoelectronics i-Underfill: Ulungelelwaniso lwe-Optical kunye noKhuseleko

I-Optoelectronics underfill ibandakanya ukugquma kunye nokukhusela izixhobo ze-optoelectronic ngelixa uqinisekisa ulungelelwaniso oluchanekileyo. Izixhobo ze-Optoelectronic, ezinjengee-lases, ii-photodetectors, kunye nokutshintsha kwamehlo, zihlala zifuna ulungelelwaniso olucekethekileyo lwamacandelo okubona ukuze kuphunyezwe ukusebenza kakuhle. Kwangaxeshanye, kufuneka bakhuselwe kwizinto ezisingqongileyo ezinokuchaphazela ukusebenza kwazo. I-Optoelectronics underfill ilungisa zombini ezi mfuno ngokubonelela ngolungelelwaniso lwe-optical kunye nokhuseleko kwinkqubo enye.

Ukulungelelaniswa kwe-Optical yinkalo ebalulekileyo yokwenziwa kwesixhobo se-optoelectronic. Kubandakanya ukulungelelanisa izinto ezibonwayo, ezinjengeentsinga, ii-waveguides, iilensi, okanye iigratisi, ukuqinisekisa ukuhanjiswa kokukhanya okufanelekileyo kunye nokwamkelwa. Ulungelelwaniso oluchanekileyo luyimfuneko ukwandisa ukusebenza kwesixhobo kunye nokugcina imfezeko yesignali. Ubuchule bokulungelelanisa bemveli bubandakanya ukulungelelaniswa kwezandla usebenzisa uhlolo olubonakalayo okanye ukulungelelaniswa ngokuzenzekelayo usebenzisa izigaba zokulungelelanisa. Nangona kunjalo, ezi ndlela zinokutya ixesha, zifuna umsebenzi omkhulu kwaye zithande ukwenza iimpazamo.

I-Optoelectronics ingaphantsi kwesisombululo esihlaziyiweyo ngokubandakanya iimpawu zokulungelelanisa ngokuthe ngqo kwizinto ezingaphantsi. Imathiriyeli yokungagcwaliswa ngokuqhelekileyo ilulwelo okanye isiqingatha solwelo iikhompawundi ezinokuqukuqela kwaye zivale izikhewu phakathi kwezinto ezibonakalayo. Ngokudibanisa iimpawu zokulungelelanisa, ezifana ne-microstructures okanye amanqaku e-fiducial, ngaphakathi kwezinto ezingaphantsi, inkqubo yokulungelelanisa ingenziwa lula kwaye izenzekelayo. Ezi mpawu zisebenza njengezikhokelo ngexesha lokudibanisa, ukuqinisekisa ukulungelelaniswa ngokuchanekileyo kwamacandelo e-optical ngaphandle kwesidingo seenkqubo zokulungelelanisa eziyinkimbinkimbi.

Ukongeza kwi-optical alignment, izinto ezingaphantsi kokugcwalisa zikhusela izixhobo ze-optoelectronic. Amacandelo e-Optoelectronic ahlala evezwe kwindawo erhabaxa, kubandakanya nokutshintsha kobushushu, ukufuma, kunye noxinzelelo lomatshini. Ezi zinto zangaphandle zinokunciphisa ukusebenza kunye nokuthembeka kwezixhobo ngexesha. Izinto zokungaphumeleli zisebenza njengesithintelo esikhuselayo, ukugubungela amacandelo e-optical kunye nokukhusela kwizinto ezingcolileyo zokusingqongileyo. Bakwabonelela ngokuqiniswa koomatshini, ukunciphisa umngcipheko womonakalo ngenxa yokothuka okanye ukungcangcazela.

Imathiriyeli yokungagcwalisi esetyenziswa kwizicelo ze-optoelectronics ngokwesiqhelo ziyilelwe ukuba zibe nesalathiso esisezantsi se-refractive kunye nokukhanya okubalaseleyo okubonakalayo. Oku kuqinisekisa ukuphazamiseka okuncinci kunye neempawu ze-optical ezidlula kwisixhobo. Ukongeza, babonisa ukunamathela okulungileyo kwii-substrates ezahlukeneyo kwaye bane-coefficients yokwandisa i-thermal ephantsi ukunciphisa uxinzelelo lwesixhobo ngexesha lokuhamba ngebhayisikile eshushu.

Inkqubo yokungagcwaliswa ngaphantsi ibandakanya ukukhupha izinto ezingaphantsi kwesixhobo, ukuyivumela ukuba ihambe kwaye igcwalise izithuba phakathi kwamacandelo okukhanya, kwaye emva koko uyinyange ukwenza i-encapsulation eqinile. Ngokuxhomekeke kwisicelo esithile, i-underfill material ingasetyenziswa ngokusebenzisa iindlela ezahlukeneyo, ezifana nokuhamba kwe-capillary, i-jet dispensing, okanye ukuprintwa kwesikrini. Inkqubo yokunyanga inokufezekiswa ngobushushu, imitha ye-UV, okanye zombini.

I-Medical Electronics i-Underfill: i-Biocompatibility kunye nokuthembeka

Ii-elektroniki zezoNyango zingaphantsi kwenkqubo ekhethekileyo ebandakanya ukugquma kunye nokukhusela izixhobo zombane ezisetyenziswa kwizixhobo zonyango. Ezi zixhobo zidlala indima ebalulekileyo kwizicelo ezahlukeneyo zonyango, njengezixhobo ezifakelwayo, izixhobo zokuxilonga, iinkqubo zokubeka iliso, kunye neenkqubo zokuhanjiswa kweziyobisi. I-elektroniki yezobuchwephesha yonyango igxile kwimiba emibini ebalulekileyo: i-biocompatibility kunye nokuthembeka.

I-Biocompatibility yimfuneko esisiseko yezixhobo zonyango ezidibana nomzimba womntu. Izixhobo ezingagcwalisiyo ezisetyenziswa kwi-elektroniki yezonyango kufuneka zihambelane ne-biocompatible, oko kuthetha ukuba akufuneki zibangele iziphumo ezinobungozi okanye iziphumo ezibi xa zidibana nezicubu eziphilayo okanye ulwelo lomzimba. Ezi zixhobo kufuneka zihambelane nemigaqo engqongqo kunye nemigangatho, efana ne-ISO 10993, echaza uvavanyo lwe-biocompatibility kunye neenkqubo zovavanyo.

Izixhobo zombane ezingagcwaliswanga kakhulu kwizixhobo zombane zezonyango zikhethwe ngononophelo okanye zenzelwe ukuqinisekisa ukuhambelana kwezinto eziphilayo. Zenzelwe ukuba zingabi netyhefu, zingacaphukisi, kwaye zingabi allergenic. Ezi zixhobo akufanele zikhuphe nayiphi na into enobungozi okanye zithobe ngokuhamba kwexesha, njengoko oku kunokukhokelela kumonakalo wezicubu okanye ukuvuvukala. Izixhobo zokuzaliswa ngaphantsi kweBiocompatible zikwanalo nokufunxa kwamanzi aphantsi ukuthintela ukukhula kwebhaktheriya okanye umngundo onokubangela usulelo.

Ukuthembeka ngomnye umba obalulekileyo wokungasebenzi kakuhle kwe-elektroniki yezonyango. Izixhobo zonyango zihlala zijongana neemeko zokusebenza ezinzima, ezibandakanya ubushushu obugqithisileyo, ukufuma, ulwelo lomzimba, kunye noxinzelelo lomatshini. Izinto zokungaphumeleli kufuneka zikhusele amacandelo e-elektroniki, ziqinisekise ukuthembeka kwazo kwexesha elide kunye nokusebenza. Ukuthembeka kubaluleke kakhulu kwizicelo zonyango apho ukungaphumeleli kwesixhobo kunokuchaphazela kakhulu ukhuseleko lwesigulane kunye nokuphila kakuhle.

Izixhobo zombane ezingagcwaliswanga kwizixhobo zombane zonyango kufuneka zixhathise ukufuma kunye neekhemikhali ukumelana nokuvezwa kulwelo lomzimba okanye iinkqubo zokuvala inzala. Kufuneka kwakhona babonise ukunamathela okulungileyo kwii-substrates ezahlukeneyo, ukuqinisekisa ukubethelwa okukhuselekileyo kwezinto ze-elektroniki. Iipropathi zoomatshini, ezifana ne-coefficients ephantsi yokwandiswa kwe-thermal kunye nokumelana nokothuka okuhle, kubalulekile ekunciphiseni uxinzelelo kwiinkcukacha ngexesha lokuhamba ngebhayisikile eshushu okanye ukulayisha ngokuzenzekelayo.

Inkqubo yokungagcwaliswa kakuhle kwezixhobo ze-elektroniki zonyango ibandakanya:

• Ukuhambisa imathiriyeli yokuzaliswa ngaphantsi kwizinto ze-elektroniki.
• Ukuzalisa izithuba.
• Ukuyinyanga ukwenza i-encapsulation ekhuselayo kunye nomatshini ozinzile.

Kufuneka kuthathwe unonophelo ukuze kuqinisekiswe ukugutyungelwa ngokupheleleyo kweempawu kunye nokungabikho kwe-voids okanye iipokotho zomoya ezinokubeka esichengeni ukuthembeka kwesixhobo.

Ngaphezu koko, ingqwalasela eyongezelelweyo ithathelwa ingqalelo xa kungazaliswanga izixhobo zonyango. Umzekelo, imathiriyeli yokuzalisa ngaphantsi kufuneka ihambelane neendlela zokuvala ezisetyenziswa kwisixhobo. Ezinye iimathiriyeli zinokuba novakalelo kubuchule obuthile bokuvala inzala, obufana nomphunga, i-ethylene oxide, okanye i-radiation, kunye nemathiriyeli eyenye inokufuneka ikhethwe.

I-Aerospace Electronics i-Underfill: Ubushushu obuphezulu kunye nokumelana nokungcangcazela

Ii-elektroniki ze-aerospace zingaphantsi kwenkqubo ekhethekileyo yokufaka kunye nokukhusela izixhobo ze-elektroniki kwizicelo ze-aerospace. Ubume be-aerospace bubeka imingeni ekhethekileyo, kubandakanya amaqondo obushushu aphezulu, ukungcangcazela okugqithisileyo, kunye noxinzelelo lomatshini. Ke ngoko, i-aerospace electronics underfill igxile kwimiba emibini ebalulekileyo: ukumelana nobushushu obuphezulu kunye nokumelana nokungcangcazela.

Ukumelana nobushushu obuphezulu yeyona nto iphambili kwi-elektroniki ye-aerospace ngenxa yobushushu obuphakamileyo obufunyenwe ngexesha lokusebenza. Izinto ezisetyenziswayo kwizicelo ze-aerospace kufuneka zimelane nobushushu obuphezulu ngaphandle kokuphazamisa ukusebenza kunye nokuthembeka kwamacandelo e-elektroniki. Kufuneka babonise ukwanda okuncinci kwe-thermal kwaye bahlale bezinzile kuluhlu olubanzi lobushushu.

Izinto zombane ezingagcwaliswanga kwi-aerospace yombane zikhethiwe okanye zenzelwe amaqondo obushushu obuphezulu beglasi (Tg) kunye nokuzinza kwe-thermal. I-Tg ephezulu iqinisekisa ukuba izinto eziphathekayo zigcina iimpawu zayo zemishini kumaqondo okushisa aphakamileyo, ukuthintela ukuguqulwa okanye ukulahleka kokubambelela. Ezi zixhobo ziyakwazi ukumelana nobushushu obugqithileyo, obufana nexesha lokumka, ukuphinda ungene emoyeni, okanye ukusebenza kumagumbi enjini ashushu.

Ukongezelela, izixhobo ezingaphantsi kwezinto zombane we-aerospace kufuneka zibe ne-coefficients ephantsi yokwandisa kwe-thermal (CTE). I-CTE ilinganisa ukuba ingakanani into eyandayo okanye inkontileka kunye nokutshintsha kweqondo lokushisa. Ngokuba ne-CTE ephantsi, izinto zokuzaliswa ngaphantsi zinokunciphisa uxinzelelo kumacandelo e-elektroniki abangelwa ukuhamba ngebhayisikili eshushu, enokukhokelela ekungaphumelelini komatshini okanye ukudinwa ngokubambisana kwe-solder.

Ukuxhathisa ukungcangcazela yenye imfuneko ebalulekileyo kwi-aerospace electronics underfill. Iimoto ze-aerospace zixhomekeke kwii-vibrations ezahlukeneyo, kuquka i-injini, ii-vibrations ezibangelwa ukubhabha, kunye nezothuso zoomatshini ngexesha lokuqaliswa okanye ukuhla. Ezi vibrations zinokubeka emngciphekweni ukusebenza kunye nokuthembeka kwamacandelo e-elektroniki ukuba akukhuselwanga ngokwaneleyo.

Izixhobo zombane ezingazaliswanga kakuhle ezisetyenziswa kwi-aerospace electronics kufuneka zibonise iimpawu ezibalaseleyo zokungcangcazela. Zifanele zifunxe kwaye zichithe amandla aveliswa kukungcangcazela, ukunciphisa uxinzelelo kunye noxinzelelo kumacandelo e-elektroniki. Oku kunceda ukuthintela ukwakheka kweentanda, iifractures, okanye ezinye iintsilelo zoomatshini ngenxa yokuvezwa kokungcangcazela okugqithisileyo.

Ngaphezu koko, izixhobo zokuzalisa ngaphantsi ezinokubambelela okuphezulu kunye namandla adibeneyo zikhethwa kwizicelo ze-aerospace. Ezi zakhiwo ziqinisekisa ukuba izinto zokuzaliswa ngaphantsi zihlala zibophene ngokuqinileyo kumacandelo e-elektroniki kunye ne-substrate, naphantsi kweemeko zokungcangcazela. Ukubambelela okuqinileyo kuthintela izinto ezingaphantsi kokunciphisa okanye ukwahlula kwizinto, ukugcina ingqibelelo ye-encapsulation kunye nokukhusela umswakama okanye i-debris ingress.

Inkqubo yokungagcwaliswa nganeno kwezixhobo ze-elektroniki ze-aerospace ibandakanya ukukhupha imathiriyeli engaphantsi kwizinto zombane, ukuyivumela ukuba iqukuqele kwaye ivale izikhewu, kwaye emva koko iyinyange ukuze yenze i-encapsulation eyomeleleyo. Inkqubo yokunyanga inokufezekiswa kusetyenziswa iindlela zokunyanga i-thermal okanye i-UV, ngokuxhomekeke kwiimfuno ezikhethekileyo zesicelo.

Ukuchasana nokuhamba ngebhayisekile ngobushushu yenye imfuneko ebalulekileyo kwimoto yombane yombane. Izithuthi eziziThuthi zenziwa rhoqo ukuguquguquka kwamaqondo obushushu, ngakumbi ngexesha lokuqalisa kunye nokusebenza kwe-injini, kwaye le mijikelo yeqondo lobushushu inokubangela uxinzelelo lobushushu kwizinto ze-elektroniki kunye nemathiriyeli engaphantsi yokuzaliswa. Izixhobo zokungagcwalisi ezisetyenziswa kwizicelo zeemoto kufuneka zibe nokuxhathisa okubalaseleyo kwebhayisekile yobushushu ukumelana nolu tshintsho lobushushu ngaphandle kokubeka esichengeni ukusebenza kwazo.

Iimathiriyeli ezingagcwaliswanga kwi-automotive electronics kufuneka zibe ne-low thermal expansion (CTE) coefficients ukunciphisa uxinzelelo lwamacandelo e-elektroniki ngexesha lokuhamba ngebhayisekile eshushu. I-CTE ehambelana kakuhle phakathi kwezinto ezingaphantsi kunye nezithako zinciphisa umngcipheko we-solder joint fatigue, cracking, okanye ezinye iintsilelo zomatshini ezibangelwa uxinzelelo lwe-thermal. Ukongezelela, izinto zokuzaliswa ngaphantsi kufuneka zibonise i-conductivity efanelekileyo ye-thermal ukukhupha ukushisa ngokufanelekileyo, ukukhusela iindawo ezithintekayo zendawo ezinokuchaphazela ukusebenza kunye nokuthembeka kwamacandelo.

Ngapha koko, izixhobo zombane ezingaphantsi kweemoto kufuneka zixhathise ukufuma, iikhemikhali kunye nolwelo. Kufuneka babe nokufunxa kwamanzi aphantsi ukuthintela ukukhula komngundo okanye ukubola kwezinto ze-elektroniki. Ukuchasana kweekhemikhali kuqinisekisa ukuba izinto ezingaphantsi kwe-subfill zihlala zizinzile xa zibonakaliswe kwi-automotive fluids, njenge-oyile, i-fuel, okanye i-agent agents zokucoca, ukuphepha ukuthotywa okanye ukulahlekelwa kokubambelela.

Inkqubo yokungagcwaliswa nganeno kwezixhobo ze-elektroniki zemoto ibandakanya ukukhupha imathiriyeli engaphantsi kwizinto ze-elektroniki, ukuyivumela ukuba ihambe kwaye igcwalise izithuba, kwaye emva koko iyinyange ukuze yenze i-encapsulation ehlala ixesha elide. Inkqubo yokunyanga inokufezekiswa ngeendlela zokunyanga i-thermal okanye i-UV, ngokuxhomekeke kwiimfuno ezikhethekileyo zesicelo kunye nemathiriyeli engagcwalisi esetyenzisiweyo.

Ukukhetha i-Epoxy yokuZalisa ngokufanelekileyo

Ukukhetha i-epoxy yokuzalisa ngokufanelekileyo sisigqibo esibalulekileyo kwindibano kunye nokukhuselwa kwamacandelo e-elektroniki. I-epoxies yokungagcwalisi ibonelela ngokuqiniswa koomatshini, ulawulo lobushushu, kunye nokukhuselwa kwizinto ezisingqongileyo. Nantsi iingqwalasela eziphambili xa ukhetha i-epoxy efanelekileyo yokuzaliswa ngaphantsi:

1. IiPropati zeThermal: Omnye wemisebenzi ephambili ye-epoxy engagcwaliswanga kukukhupha ubushushu obuveliswa ngamacandelo e-elektroniki. Ke ngoko, kubalulekile ukuqwalasela i-epoxy's conductivity ye-thermal kunye nokumelana nobushushu. I-conductivity ephezulu ye-thermal inceda ukuhanjiswa kobushushu ngokufanelekileyo, ukukhusela iindawo ezitshisa kakhulu kunye nokugcina ukuthembeka kwecandelo. I-epoxy kufuneka kwakhona ibe nokuchasana okuphantsi kwe-thermal ukunciphisa uxinzelelo lwe-thermal kumacandelo ngexesha lokuhamba ngebhayisikili.
2. Umdlalo we-CTE: I-epoxy ye-underfill ye-thermal expansion coefficient (CTE) kufuneka ihambelane kakuhle ne-CTE yamacandelo e-elektroniki kunye ne-substrate yokunciphisa uxinzelelo lwe-thermal kunye nokukhusela ukuhluleka kokubambisana kwe-solder. I-CTE ehambelana ngokusondeleyo inceda ukunciphisa umngcipheko wokungaphumeleli komatshini ngenxa yebhayisikili ye-thermal.
3. Ukuhamba kunye ne-Gap-Filling Ability: I-epoxy engagcwaliswanga kufuneka ibe neempawu zokuhamba kakuhle kunye nokukwazi ukuzalisa izikhewu phakathi kwamacandelo ngokufanelekileyo. Oku kuqinisekisa ukugubungela ngokupheleleyo kunye nokunciphisa i-voids okanye iipokotho zomoya ezinokuchaphazela ukuzinza komatshini kunye nokusebenza kwe-thermal. I-viscosity ye-epoxy kufuneka ifanele usetyenziso oluthile kunye nendlela yokuhlanganisa, nokuba yi-capillary flow, i-jet dispensing, okanye i-screen printing.
4. Ukubambelela: Ukubambelela okuqinileyo kubalulekile ekuzaliseni ngaphantsi kwe-epoxy ukuqinisekisa ukudibanisa okuthembekileyo phakathi kwamacandelo kunye ne-substrate. Kufuneka ibonise ukunamathela okulungileyo kwizinto ezahlukeneyo, kubandakanya isinyithi, iiseramics, kunye neeplastiki. Iimpawu zokubambelela ze-epoxy zifaka isandla kwingqibelelo yomatshini wendibano kunye nokuthembeka kwexesha elide.
5. Indlela yokuNyanga: Qwalasela indlela yokunyanga eyifanele kakhulu inkqubo yakho yokuvelisa. Ii-epoxies ezingagcwalisiyo zinokunyangeka ngenxa yobushushu, imitha ye-UV, okanye indibaniselwano yazo zombini. Indlela nganye yokunyanga ineengenelo kunye nemida, kwaye ukukhetha leyo ehambelana neemfuno zakho zemveliso kubalulekile.
6. Ukuxhathisa kokusiNgqongileyo: Vavanya ukuchasana kwe-epoxy engagcwalisi kwizinto zokusingqongileyo ezifana nokufuma, iikhemikhali, kunye nobushushu obugqithisileyo. I-epoxy kufuneka ikwazi ukumelana nokuvezwa kwamanzi, ukukhusela ukukhula kwesikhunta okanye ukubola. Ukumelana neekhemikhali kuqinisekisa ukuzinza xa udibana nolwelo lweemoto, ii-agent zokucoca, okanye ezinye izinto ezinokutshabalalisa. Ukongezelela, i-epoxy kufuneka igcine iimpawu zayo zomatshini kunye nombane phezu koluhlu olubanzi lobushushu.
7. Ukuthembeka kunye noBomi obude: Qwalasela irekhodi lomkhondo le-epoxy engagcwaliswanga kunye nedatha yokuthembeka. Jonga izinto ze-epoxy ezivavanyiweyo kwaye zingqinwe ukuba ziqhuba kakuhle kwizicelo ezifanayo okanye ube nezatifikethi zeshishini kunye nokuthotyelwa kwemigangatho efanelekileyo. Cinga ngezinto ezifana nokuziphatha okwaluphala, ukuthembeka kwexesha elide, kunye nokukwazi kwe-epoxy ukugcina iimpawu zayo ngokuhamba kwexesha.

Xa ukhetha i-epoxy elungileyo yokuzaliswa ngaphantsi, kubalulekile ukuqwalasela iimfuno ezithile zesicelo sakho, kubandakanya ulawulo lobushushu, uzinzo kumatshini, ukhuseleko lokusingqongileyo, kunye nokuhambelana kwenkqubo yokwenziwa. Ukubonisana nabanikezeli be-epoxy okanye ukufuna iingcebiso zeengcali kunokuba luncedo ekwenzeni isigqibo esinolwazi esihlangabezana neemfuno zesicelo sakho kwaye siqinisekise ukusebenza kakuhle kunye nokuthembeka.

IiNdlela zekamva kwi-Underfill Epoxy

I-epoxy ye-Underfill iqhubeka ngokuvela, iqhutywa yinkqubela phambili kwitekhnoloji ye-elektroniki, izicelo ezivelayo, kunye nesidingo sokuphucula ukusebenza kunye nokuthembeka. Iindlela ezininzi zexesha elizayo zinokubonwa kuphuhliso kunye nokusetyenziswa kwe-epoxy engagcwaliswanga:

1. I-Miniaturization kunye nokuPhakhelwa koXinano oluPhakamileyo: Njengoko izixhobo zombane ziqhubeka nokuncipha kwaye zibonakalisa ukuxinana kwamacandelo aphezulu, ii-epoxies zokuzaliswa ngaphantsi kufuneka zilungelelanise ngokufanelekileyo. Iindlela zexesha elizayo ziya kugxila ekuphuhliseni izinto ezingagcwaliswanga ngokwaneleyo ukuba zingene kwaye zizalise izikhewu ezincinci phakathi kwamacandelo, ukuqinisekisa ukugqunywa okupheleleyo kunye nokhuseleko oluthembekileyo kwiindibano ze-elektroniki eziya zisanda.
2. Ukusetyenziswa kwe-High-Frequency Applications: Ngemfuno ekhulayo ye-high-frequency kunye ne-high-speed-electronic devices, i-underfill epoxy formulations iya kufuna ukujongana neemfuno ezithile zezi zicelo. Izinto zokuzaliswa ngaphantsi kwe-dielectric ephantsi kunye nee-tangents ezilahlekileyo eziphantsi ziya kuba yimfuneko ekunciphiseni ilahleko yesignali kunye nokugcina intembeko yeempawu ze-high-frequency kwiinkqubo zonxibelelwano eziphambili, iteknoloji ye-5G, kunye nezinye izicelo ezivelayo.
3. ULawulo lweThermal olongezelelweyo: Ukutshatyalaliswa kobushushu kuhlala kuyinkxalabo ebalulekileyo kwizixhobo zombane, ngakumbi ngokunyuka koxinzelelo lwamandla. I-epoxy formulations yexesha elizayo iya kugxininisa ekuphuculeni ukuhanjiswa kwe-thermal ukunyusa ukuhanjiswa kobushushu kunye nokulawula imiba ye-thermal ngokufanelekileyo. Izihluzi eziphambili kunye nezongezelelo ziya kudityaniswa kwi-epoxies engagcwalisiyo ukufikelela kwi-conductivity ephezulu ye-thermal ngelixa ugcina ezinye iipropathi ezifunwayo.
4. I-Flexible kunye ne-Extretchable Electronics: Ukunyuka kwee-electronic flexible kunye ne-stretchable electronics kuvula amathuba amatsha okuzaliswa ngaphantsi kwezinto ze-epoxy. Ii-epoxies ezithambileyo zokuzaliswa ngaphantsi kufuneka zibonise ukunamathela okugqwesileyo kunye neempawu zoomatshini naphantsi kokugoba okuphindaphindiweyo okanye ukolula. Ezi zixhobo ziya kwenza ukuba i-encapsulation kunye nokukhuselwa kwe-electronics kwizixhobo ezinxibekayo, iziboniso ezigobekileyo, kunye nezinye izicelo ezifuna ukuguquguquka komatshini.
5. Izisombululo ezihambelana nokusiNgqongileyo: Uzinzo kunye nokuqwalaselwa kokusingqongileyo kuya kudlala indima ekhulayo ekuphuhlisweni kwezinto ezingaphantsi kwe-epoxy. Kuya kugxininiswa ekudaleni ukwakheka kwe-epoxy ngaphandle kwezinto ezinobungozi kwaye kunciphise impembelelo yokusingqongileyo kuwo wonke umjikelo wabo wobomi, kubandakanya ukwenziwa, ukusetyenziswa, kunye nokulahlwa. Izinto ezisekwe kwibhayoloji okanye ezivuselelekayo zisenokufumana ukuvelela njengezinye iindlela ezizinzileyo.
6. IiNkqubo zoMveliso eziPhuculweyo: Iintsingiselo zexesha elizayo kwi-epoxy yokungagcwaliswa ngaphantsi ziya kugxila kwiipropati eziphathekayo kunye nokuqhubela phambili kwiinkqubo zokuvelisa. Ubuchwephesha obufana nokuveliswa okongeziweyo, ukukhupha okukhethiweyo, kunye neendlela zokunyanga eziphambili ziya kuphononongwa ukuze kuphuculwe ukusetyenziswa kunye nokusebenza kwe-epoxy engagcwaliswanga kwiinkqubo ezahlukeneyo zendibano ye-elektroniki.
7. Ukudityaniswa koVavanyo oluPhakamileyo kunye nobuChwepheshe boBugcisa: Ngokunyuka kobunzima kunye neemfuno zezixhobo zombane, kuya kubakho imfuneko yovavanyo oluphezulu kunye neendlela zokulinganisa iimpawu zokuqinisekisa ukuthembeka kunye nokusebenza kwe-epoxy engagcwaliswanga. Ubuchwephesha obunjengovavanyo olungonakalisi, ukubeka iliso kwi-situ, kunye nezixhobo zokulinganisa ziya kunceda ekuphuhliseni nasekulawuleni umgangatho wezinto ze-epoxy ezingagcwaliswanga.

isiphelo

I-epoxy engagcwaliswanga idlala indima ebalulekileyo ekwandiseni ukuthembeka kunye nokusebenza kwezinto ze-elektroniki, ngakumbi kwi-semiconductor packaging. Iindidi ezahlukeneyo ze-epoxy ezingaphantsi zibonelela ngoluhlu lweenzuzo, kubandakanya ukuthembeka okuphezulu, ukuzinikezela, ukuxinana okuphezulu, kunye nokusebenza okuphezulu kwe-thermal kunye noomatshini. Ukukhetha i-epoxy efanelekileyo yokuzaliswa kwesicelo kunye nephakheji iqinisekisa ibhondi eyomeleleyo kunye nexesha elide. Njengoko ukuqhubela phambili kwetekhnoloji kunye nobungakanani bepakethe buncipha, silindele izisombululo ezingaphezulu zokuzaliswa kwe-epoxy ezinikezela ukusebenza okuphezulu, ukudibanisa, kunye ne-miniaturization. I-epoxy ye-Underfill isetelwe ukuba idlale indima ebaluleke kakhulu kwixesha elizayo le-elektroniki, lisenza ukuba sifikelele kumanqanaba aphezulu okuthembeka kunye nokusebenza kumashishini ahlukeneyo.