1. Tsev
2.  >
3. industries
4.  >
5. Ua npuas ncauj Epoxy

Ua npuas ncauj Epoxy

Underfill epoxy yog ib hom ntawm cov nplaum siv los txhim kho cov khoom siv hluav taws xob 'kev ntseeg tau, tshwj xeeb hauv cov ntawv ntim khoom semiconductor. Nws sau qhov sib txawv ntawm pob thiab cov ntawv luam tawm Circuit Board (PCB), muab kev txhawb nqa thiab kev ntxhov siab los tiv thaiv thermal expansion thiab contraction puas. Underfill epoxy kuj tseem txhim kho cov hluav taws xob ua haujlwm ntawm lub pob los ntawm kev txo cov kab mob parasitic inductance thiab capacitance. Hauv tsab xov xwm no, peb tshawb txog ntau yam kev siv ntawm cov epoxy underfill, ntau hom muaj, thiab lawv cov txiaj ntsig.

Qhov tseem ceeb ntawm Underfill Epoxy hauv Semiconductor Ntim

Underfill epoxy yog qhov tseem ceeb hauv kev ntim khoom semiconductor, muab cov cuab yeej siv zog thiab kev tiv thaiv rau cov khoom me me microelectronic. Nws yog cov khoom siv tshwj xeeb nplaum siv los sau qhov sib txawv ntawm cov semiconductor nti thiab pob substrate, txhim kho kev ntseeg tau thiab kev ua haujlwm ntawm cov khoom siv hluav taws xob. Ntawm no, peb yuav tshawb txog qhov tseem ceeb ntawm cov epoxy underfilled hauv semiconductor ntim.

Ib qho ntawm cov haujlwm tseem ceeb ntawm cov epoxy underfilled yog los txhim kho cov khoom siv dag zog thiab kev ntseeg siab ntawm pob. Thaum lub sijhawm ua haujlwm, cov chips semiconductor raug rau ntau yam kev ntxhov siab, xws li thermal expansion thiab contraction, vibration, thiab mechanical shock. Cov kev ntxhov siab no tuaj yeem ua rau muaj kev sib koom ua ke ntawm cov kab nrib pleb, uas tuaj yeem ua rau hluav taws xob tsis ua haujlwm thiab txo qis tag nrho lub neej ntawm cov cuab yeej. Underfill epoxy ua raws li tus neeg saib xyuas kev ntxhov siab los ntawm kev faib cov kev ntxhov siab txhua yam sib npaug ntawm cov nti, substrate, thiab cov pob qij txha. Nws ua tau zoo txo ​​qhov tsim ntawm cov kab nrib pleb thiab tiv thaiv kev nthuav tawm ntawm cov kab nrib pleb uas twb muaj lawm, kom ntseeg tau lub sijhawm ntev ntawm pob.

Lwm qhov tseem ceeb ntawm underfill epoxy yog nws lub peev xwm los txhim kho cov thermal kev ua tau zoo ntawm cov khoom siv semiconductor. Thaum tshav kub kub dissipation dhau los ua ib qho kev txhawj xeeb tseem ceeb vim tias cov khoom siv hluav taws xob txo qis hauv qhov loj thiab ua kom lub zog ceev, thiab cov cua kub ntau dhau tuaj yeem ua rau qhov kev ua tau zoo thiab kev ntseeg siab ntawm cov semiconductor nti. Underfill epoxy muaj cov thermal conductivity zoo heev, tso cai rau nws kom hloov cov cua sov los ntawm cov nti thiab faib nws thoob plaws hauv pob. Qhov no pab tswj qhov kub thiab txias ua haujlwm thiab tiv thaiv hotspots, yog li txhim kho tag nrho cov thermal tswj ntawm lub cuab yeej.

Underfill epoxy kuj tiv thaiv kev ya raws thiab cov kab mob. Moisture ingress tuaj yeem ua rau corrosion, hluav taws xob to, thiab kev loj hlob ntawm cov khoom siv hluav taws xob, ua rau cov cuab yeej ua haujlwm tsis zoo. Underfill epoxy ua raws li kev thaiv, sealing qhov chaw tsis zoo thiab tiv thaiv kom tsis txhob ya raws nkag mus rau hauv pob. Nws kuj tseem muaj kev tiv thaiv plua plav, av, thiab lwm yam kab mob uas tuaj yeem cuam tshuam rau kev ua haujlwm hluav taws xob ntawm semiconductor nti. Los ntawm kev tiv thaiv cov nti thiab nws cov kev sib tshuam, underfill epoxy ua kom ntseeg tau ntev thiab ua haujlwm ntawm lub cuab yeej.

Tsis tas li ntawd, underfilled epoxy enables miniaturization nyob rau hauv semiconductor ntim. Nrog rau qhov kev thov tsis tu ncua rau cov khoom siv me me thiab ntau dua, cov epoxy underfilled tso cai siv flip-chip thiab chip-scale ntim cov txheej txheem. Cov tswv yim no koom nrog ncaj qha mounting lub nti rau hauv pob substrate, tshem tawm qhov xav tau ntawm kev sib txuas ntawm cov hlau thiab txo cov pob loj. Underfill epoxy muab cov qauv kev txhawb nqa thiab tswj kev ncaj ncees ntawm cov nti-substrate interface, ua kom muaj kev ua tiav ntawm cov txheej txheem ntim khoom siab heev.

Yuav ua li cas Underfill Epoxy daws cov teeb meem

Semiconductor ntim ua lub luag haujlwm tseem ceeb hauv kev ua haujlwm ntawm cov khoom siv hluav taws xob, kev ntseeg siab, thiab kev ua haujlwm ntev. Nws koom nrog kev sib koom ua ke ntawm cov khoom siv hluav taws xob (ICs) hauv cov khoom siv tiv thaiv, muab kev sib txuas hluav taws xob, thiab cov cua kub dissipating thaum ua haujlwm. Txawm li cas los xij, kev ntim khoom semiconductor ntsib ntau yam teeb meem, suav nrog kev ntxhov siab thermal thiab warpage, uas tuaj yeem cuam tshuam rau kev ua haujlwm thiab kev ntseeg siab ntawm cov khoom ntim khoom.

Ib qho ntawm cov teeb meem tseem ceeb yog thermal stress. Kev sib xyaw ua ke ua kom muaj cua sov thaum lub sijhawm ua haujlwm, thiab qhov tsis txaus dissipation tuaj yeem ua rau kub kub hauv pob. Qhov kub hloov pauv no ua rau muaj kev ntxhov siab thermal raws li cov khoom sib txawv hauv pob nthuav dav thiab cog lus ntawm tus nqi sib txawv. Qhov tsis sib xws ntawm kev nthuav dav thiab kev cog lus tuaj yeem ua rau cov neeg kho tshuab tsis zoo, ua rau kev sib koom ua ke tsis ua haujlwm, delamination, thiab tawg. Kev ntxhov siab thermal tuaj yeem cuam tshuam cov hluav taws xob thiab kev ua haujlwm zoo ntawm lub pob, thaum kawg cuam tshuam rau kev ua haujlwm thiab kev ntseeg siab ntawm cov cuab yeej.

Warpage yog lwm qhov kev sib tw tseem ceeb hauv kev ntim khoom semiconductor. Warpage hais txog kev khoov lossis deformation ntawm pob substrate lossis tag nrho pob. Nws tuaj yeem tshwm sim thaum lub sijhawm ntim khoom lossis vim muaj kev ntxhov siab thermal. Warpage feem ntau tshwm sim los ntawm qhov tsis sib haum xeeb hauv cov coefficient ntawm thermal expansion (CTE) ntawm cov khoom sib txawv hauv pob. Piv txwv li, CTE ntawm silicon tuag, substrate, thiab pwm compound yuav txawv heev. Thaum muaj qhov kub thiab txias, cov ntaub ntawv no nthuav tawm lossis cog lus sib txawv, ua rau muaj kev sib ntaus sib tua.

Warpage muaj ntau yam teeb meem rau cov pob khoom semiconductor:

1. Nws tuaj yeem ua rau cov ntsiab lus kev ntxhov siab, ua rau muaj qhov ua tau zoo ntawm kev ua haujlwm tsis zoo thiab txo qhov kev cia siab ntawm lub thawv.
2. Warpage tuaj yeem ua rau muaj teeb meem hauv cov txheej txheem sib dhos, vim tias nws cuam tshuam rau kev sib dhos ntawm lub pob nrog lwm cov khoom, xws li cov ntawv luam tawm Circuit Board (PCB). Qhov kev sib raug zoo no tuaj yeem cuam tshuam kev sib txuas hluav taws xob thiab ua rau muaj teeb meem kev ua haujlwm.
3. Warpage tuaj yeem cuam tshuam rau tag nrho cov qauv ntawm pob, ua rau nws nyuaj rau kev sib xyaw cov cuab yeej rau hauv cov ntawv me me lossis cov PCBs uas muaj neeg coob.

Ntau cov tswv yim thiab cov tswv yim tau ua haujlwm hauv kev ntim khoom semiconductor los daws cov teeb meem no. Cov no suav nrog kev siv cov ntaub ntawv qib siab nrog CTEs sib xws kom txo qis thermal kev ntxhov siab thiab kev sib ntaus sib tua. Thermo-mechanical simulations thiab qauv yog ua los kwv yees tus cwj pwm ntawm pob nyob rau hauv txawv thermal tej yam kev mob. Cov kev hloov kho, xws li qhia txog cov qauv kev ntxhov siab thiab kev ua kom zoo, yog siv los txo cov kev ntxhov siab thiab kev ua tsov rog. Tsis tas li ntawd, kev txhim kho cov txheej txheem tsim khoom thiab cov cuab yeej siv tau zoo tuaj yeem pab txo qis qhov tshwm sim ntawm warpage thaum sib dhos.

Cov txiaj ntsig ntawm Underfill Epoxy

Underfill epoxy yog ib qho tseem ceeb hauv kev ntim khoom semiconductor uas muaj ntau yam txiaj ntsig. Cov khoom siv tshwj xeeb epoxy no yog siv los ntawm cov semiconductor nti thiab pob substrate, muab cov cuab yeej siv dag zog thiab daws ntau yam teeb meem. Nov yog qee qhov txiaj ntsig tseem ceeb ntawm underfilled epoxy:

1. Txhim kho Mechanical Reliability: Ib qho ntawm cov txiaj ntsig tseem ceeb ntawm underfill epoxy yog nws lub peev xwm los txhim kho cov neeg kho tshuab kev ntseeg siab ntawm cov pob khoom semiconductor. Underfill epoxy tsim kom muaj kev sib koom ua ke uas txhim kho tag nrho cov qauv kev ncaj ncees los ntawm kev sau cov khoob thiab qhov khoob ntawm cov nti thiab substrate. Qhov no pab tiv thaiv pob warpage, txo cov kev pheej hmoo ntawm kev ua tsis tiav, thiab txhim kho kev tiv thaiv rau sab nraud kev ntxhov siab xws li kev vibrations, shocks, thiab thermal cycling. Kev txhim kho cov neeg kho tshuab kev ntseeg tau ua rau cov khoom muaj zog ntxiv thiab lub neej ntev dua rau cov cuab yeej.
2. Thermal Stress Dissipation: Underfill epoxy pab dissipate thermal stress hauv pob. Integrated circuits ua kom muaj cua sov thaum lub sijhawm ua haujlwm, thiab qhov tsis txaus dissipation tuaj yeem ua rau kub hloov pauv hauv lub thawv. Cov khoom siv epoxy underfill, nrog nws qis coefficient ntawm thermal expansion (CTE) piv rau cov nti thiab cov khoom siv substrate, ua raws li cov txheej txheem tsis. Nws absorbs cov neeg kho tshuab strain tshwm sim los ntawm thermal stress, txo qhov kev pheej hmoo ntawm solder joint tsis ua hauj lwm, delamination, thiab tawg. Los ntawm dissipating thermal stress, underfilled epoxy pab tswj lub pob hluav taws xob thiab txhua yam kev ncaj ncees.
3. Txhim khu kev ua tau zoo hluav taws xob: Underfill epoxy zoo cuam tshuam rau kev ua haujlwm hluav taws xob ntawm cov khoom siv semiconductor. Cov khoom siv epoxy sau qhov khoob ntawm cov nti thiab substrate, txo cov kab mob parasitic capacitance thiab inductance. Qhov no ua rau kev txhim kho cov teeb liab kev ncaj ncees, txo cov teeb liab poob, thiab txhim kho kev sib txuas hluav taws xob ntawm cov nti thiab cov khoom seem ntawm lub pob. Kev txo cov kab mob parasitic ua rau muaj kev ua tau zoo ntawm hluav taws xob, kev hloov cov ntaub ntawv ntau dua, thiab muaj kev ntseeg siab ntawm cov cuab yeej. Tsis tas li ntawd, underfilled epoxy muab rwb thaiv tsev thiab kev tiv thaiv ntawm ya raws, kab mob, thiab lwm yam ib puag ncig uas yuav degrade hluav taws xob kev ua tau zoo.
4. Kev ntxhov siab thiab kev txhim kho los ua ke: Underfill epoxy ua raws li cov txheej txheem kev ntxhov siab thaum sib dhos. Cov khoom siv epoxy compensates rau CTE mismatch ntawm cov nti thiab substrate, txo cov neeg kho tshuab kev ntxhov siab thaum hloov kub. Qhov no ua rau cov txheej txheem sib dhos ntau txhim khu kev qha thiab ua haujlwm tau zoo, txo qhov kev pheej hmoo ntawm pob kev puas tsuaj los yog misalignment. Kev tswj hwm kev ntxhov siab muab los ntawm underfill epoxy kuj tseem pab kom muaj kev sib raug zoo nrog lwm cov khoom ntawm cov ntawv luam tawm Circuit Board (PCB) thiab txhim kho tag nrho cov khoom sib dhos.
5. Miniaturization thiab Form Factor Optimization: Underfill epoxy enables lub miniaturization ntawm semiconductor pob thiab optimization ntawm daim ntawv zoo. Los ntawm kev muab cov txheej txheem kev txhawb nqa thiab txo kev ntxhov siab, underfill epoxy tso cai rau tsim thiab tsim cov pob me me, thinner, thiab ntau dua. Qhov no yog qhov tseem ceeb tshwj xeeb rau cov ntawv thov xws li cov khoom siv txawb thiab cov khoom siv hluav taws xob uas siv tau, qhov chaw nyob ntawm tus nqi. Lub peev xwm los ua kom zoo tshaj plaws hauv daim ntawv thiab ua tiav cov khoom siv ntau dua ua rau muaj txiaj ntsig zoo dua thiab cov khoom siv hluav taws xob tshiab.

Hom ntawm Underfill Epoxy

Ob peb hom ntawm cov epoxy formulations underfill muaj nyob rau hauv semiconductor ntim, txhua tus tsim los ua kom tau raws li cov kev cai tshwj xeeb thiab daws cov teeb meem sib txawv. Nov yog qee yam siv ntau hom underfill epoxy:

1. Capillary Underfill Epoxy: Capillary underfill epoxy yog cov khoom siv feem ntau thiab siv dav. Ib qho qis-viscosity epoxy ntws mus rau hauv qhov sib txawv ntawm cov nti thiab cov substrate los ntawm capillary nkaus. Capillary underfill feem ntau yog muab xa mus rau ntawm ntug ntawm lub nti, thiab raws li lub pob yog rhuab, epoxy ntws hauv qab nti, sau cov voids. Hom kev underfill no yog tsim rau cov pob khoom uas muaj qhov khoob me me thiab muab cov khoom siv dag zog zoo.
2. No-Flow Underfill Epoxy: Tsis muaj dej ntws tawm hauv qab epoxy yog cov txheej txheem siab-viscosity uas tsis ntws thaum kho. Nws yog siv raws li pre-applied epoxy los yog ua ib zaj duab xis ntawm lub nti thiab substrate. Tsis muaj dej ntws hauv qab epoxy yog tshwj xeeb tshaj yog muaj txiaj ntsig zoo rau cov pob khoom flip-chip, qhov twg cov pob khaus ncaj qha cuam tshuam nrog lub substrate. Nws tshem tawm qhov xav tau ntawm capillary ntws thiab txo qhov kev pheej hmoo ntawm kev puas tsuaj rau cov leeg thaum sib dhos.
3. Wafer-Level Underfill (WLU): Wafer-theem underfill yog ib qho underfill epoxy thov nyob rau theem wafer ua ntej tus neeg chips yog singulated. Nws cuam tshuam cov khoom siv underfill hla tag nrho wafer nto thiab kho nws. Wafer-theem underfill muaj ntau qhov zoo, suav nrog kev them nyiaj tsis zoo, txo lub sijhawm sib dhos, thiab txhim kho cov txheej txheem tswj. Nws yog feem ntau siv rau kev tsim khoom ntawm cov khoom siv me me.
4. Moulded Underfill (MUF): Moulded underfill yog ib qho underfill epoxy siv thaum lub sij hawm encapsulation molding. Cov khoom siv hauv qab yog dispensed mus rau lub substrate, thiab tom qab ntawd lub nti thiab substrate yog encapsulated nyob rau hauv ib tug pwm compound. Thaum lub sij hawm molding, cov epoxy ntws thiab sau qhov sib txawv ntawm cov nti thiab substrate, muab underfill thiab encapsulation hauv ib kauj ruam. Moulded underfill muaj cov cuab yeej zoo heev thiab ua kom yooj yim rau kev sib dhos.
5. Non-Conductive Underfill (NCF): Non-conductive underfill epoxy yog tsim tshwj xeeb los muab kev sib cais hluav taws xob ntawm cov pob qij txha ntawm cov nti thiab cov substrate. Nws muaj insulating fillers los yog additives uas tiv thaiv hluav taws xob conductivity. NCF yog siv rau hauv cov ntawv thov uas qhov hluav taws xob luv luv ntawm cov pob qij txha uas nyob ib sab yog kev txhawj xeeb. Nws muaj ob qho tib si mechanical reinforcement thiab hluav taws xob cais.
6. Thermally Conductive Underfill (TCU): Thermally conductive underfill epoxy yog tsim los txhim kho cov cua kub dissipation peev ntawm pob. Nws muaj thermally conductive fillers, xws li ceramic los yog hlau hais, uas txhim kho cov thermal conductivity ntawm cov khoom underfill. TCU yog siv rau hauv cov ntawv thov uas muaj kev hloov pauv hluav taws xob yog qhov tseem ceeb, xws li cov khoom siv hluav taws xob siab lossis cov kev khiav hauj lwm hauv qhov xav tau qhov chaw thermal.

Cov no tsuas yog qee qhov piv txwv ntawm ntau hom underfill epoxy siv nyob rau hauv semiconductor ntim. Kev xaiv ntawm qhov tsim nyog underfill epoxy nyob ntawm seb yam khoom xws li pob tsim, txheej txheem sib dhos, kev xav tau thermal, thiab kev xav txog hluav taws xob. Txhua qhov underfill epoxy muaj qhov tshwj xeeb zoo thiab raug kho kom tau raws li qhov tshwj xeeb xav tau ntawm ntau daim ntawv thov.

Capillary Underfill: Tsawg viscosity thiab kev ntseeg siab

Capillary underfill yog hais txog cov txheej txheem siv hauv kev lag luam ntim khoom semiconductor los txhim kho kev ntseeg tau ntawm cov khoom siv hluav taws xob. Nws suav nrog kev sau qhov khoob ntawm microelectronic nti thiab nws cov pob nyob ib puag ncig nrog cov khoom siv ua kua uas tsis muaj viscosity, feem ntau yog epoxy-based resin. Cov khoom siv underfill no muab kev txhawb nqa, txhim kho thermal dissipation, thiab tiv thaiv cov nti los ntawm kev ntxhov siab, dej noo, thiab lwm yam ib puag ncig.

Ib qho ntawm cov yam ntxwv tseem ceeb ntawm capillary underfill yog nws cov viscosity tsawg. Cov khoom siv hauv qab yog tsim kom muaj qhov ntom ntom ntom ntom ntom ntom, tso cai rau nws yooj yim rau hauv qhov nqaim ntawm lub nti thiab cov pob thaum lub sij hawm underfilling txheej txheem. Qhov no ua kom ntseeg tau tias cov khoom siv tsis zoo tuaj yeem nkag mus tau zoo thiab sau tag nrho cov voids thiab huab cua, txo qhov kev pheej hmoo ntawm kev tsim tsis muaj dab tsi thiab txhim kho tag nrho cov kev ncaj ncees ntawm nti-pob interface.

Low-viscosity capillary underfill cov ntaub ntawv kuj muaj ob peb lwm yam zoo. Ua ntej, lawv pab txhawb kom muaj txiaj ntsig zoo ntawm cov khoom siv hauv qab nti, uas ua rau txo cov txheej txheem lub sijhawm thiab nce ntau lawm. Qhov no yog qhov tseem ceeb tshwj xeeb hauv kev tsim khoom ntim ntau qhov chaw uas lub sijhawm thiab tus nqi ua haujlwm tseem ceeb heev.

Qhov thib ob, qhov qis viscosity ua rau zoo dua ntub dej thiab adhesion ntawm cov khoom siv hauv qab. Nws tso cai rau cov khoom sib kis sib npaug thiab tsim cov ntawv cog lus muaj zog nrog cov nti thiab cov pob, tsim kom muaj kev ruaj ntseg thiab ruaj khov encapsulation. Qhov no ua kom cov nti tau ruaj ntseg tiv thaiv los ntawm kev ntxhov siab xws li thermal cycling, shocks, thiab vibrations.

Lwm qhov tseem ceeb ntawm capillary underfills yog lawv cov kev ntseeg siab. Cov ntaub ntawv uas tsis tshua muaj viscosity underfill yog tsim tshwj xeeb los ua kom pom kev zoo thermal stability, hluav taws xob rwb thaiv tsev zog, thiab tsis kam mus ya raws thiab tshuaj. Cov yam ntxwv no yog qhov tseem ceeb rau kev ua kom cov khoom siv hluav taws xob tau ntim rau lub sijhawm ntev thiab kev ntseeg tau, tshwj xeeb tshaj yog nyob rau hauv kev thov siv xws li tsheb, aerospace, thiab kev sib txuas lus.

Ntxiv mus, capillary underfill cov ntaub ntawv yog tsim los kom muaj zog txhua yam thiab zoo heev adhesion rau ntau yam substrate ntaub ntawv, xws li hlau, ceramics, thiab organic cov ntaub ntawv uas feem ntau siv nyob rau hauv semiconductor ntim. Qhov no ua rau cov khoom siv tsis zoo los ua qhov kev ntxhov siab tsis zoo, ua kom muaj txiaj ntsig zoo thiab cuam tshuam cov neeg kho tshuab kev ntxhov siab tsim tawm thaum lub sijhawm ua haujlwm lossis ib puag ncig raug.

 

Tsis-Flow Underfill: Self-Dispensing thiab High Throughput

Tsis-khiav underfill ib tug tshwj xeeb txheej txheem siv nyob rau hauv lub semiconductor ntim kev lag luam los txhim khu kev ntseeg thiab efficiency ntawm cov khoom siv hluav taws xob. Tsis zoo li capillary underfills, uas vam khom cov ntaub ntawv uas muaj viscosity tsawg, tsis muaj dej ntws hauv qab siv cov khoom siv rau tus kheej nrog cov khoom muaj viscosity. Txoj kev no muaj ntau yam zoo, nrog rau kev sib koom ua ke ntawm tus kheej, kev ua haujlwm siab, thiab txhim kho kev ntseeg tau.

Ib qho ntawm cov yam ntxwv tseem ceeb ntawm kev tsis muaj dej tsis txaus yog nws tus kheej muaj peev xwm dispensing. Cov khoom siv underfill siv nyob rau hauv cov txheej txheem no yog tsim nrog viscosity siab dua, uas tiv thaiv nws los ntawm kev ntws dawb. Hloov chaw, cov khoom siv tsis txaus yog muab xa mus rau lub nti-pob interface hauv kev tswj hwm. Qhov kev tswj xyuas qhov kev faib tawm no ua rau muaj qhov tso ncaj qha ntawm cov khoom siv hauv qab, kom ntseeg tau tias nws tsuas yog siv rau thaj chaw xav tau yam tsis muaj dej ntws los yog kis tsis tau.

Tus kheej-dispensing xwm ntawm tsis-flow underfill muaj ntau yam txiaj ntsig. Ua ntej, nws tso cai rau nws tus kheej sib dhos ntawm cov khoom siv underfill. Raws li lub underfill yog dispensed, nws ib txwm nws tus kheej-aligns nrog lub nti thiab pob, sau qhov khoob thiab voids uniformly. Qhov no tshem tawm qhov xav tau rau qhov tseeb qhov chaw thiab kev ua kom zoo ntawm cov nti thaum lub sij hawm underfilling txheej txheem, txuag lub sij hawm thiab kev rau siab nyob rau hauv manufacturing.

Secondly, tus kheej-dispensing feature ntawm tsis-flow underfills enables siab throughput nyob rau hauv ntau lawm. Cov txheej txheem xa tawm tuaj yeem ua haujlwm tau, tso cai rau kev siv sai thiab zoo ib yam ntawm cov khoom siv hauv qab hla ntau daim ntawv ib txhij. Qhov no txhim kho tag nrho cov kev ua tau zoo ntawm kev tsim khoom thiab txo cov nqi tsim khoom, ua rau nws muaj txiaj ntsig tshwj xeeb rau cov khoom lag luam loj.

Tsis tas li ntawd, cov ntaub ntawv tsis muaj dej tsis txaus yog tsim los muab kev ntseeg siab. High-viscosity underfill cov ntaub ntawv muab kev txhim kho kev tiv thaiv rau thermal cycling, mechanical stresses, thiab ib puag ncig yam, kom ntseeg tau lub sij hawm ntev ntawm cov khoom siv hluav taws xob ntim. Cov ntaub ntawv pov thawj zoo heev thermal stability, hluav taws xob rwb thaiv tsev zog, thiab tsis kam mus ya raws thiab tshuaj, pab txhawb rau tag nrho cov kev cia siab ntawm cov cuab yeej.

Tsis tas li ntawd, high-viscosity underfill cov ntaub ntawv siv nyob rau hauv tsis muaj-flow underfill tau txhim kho txhua yam muaj zog thiab adhesion zog. Lawv tsim cov ntawv cog lus muaj zog nrog cov nti thiab pob, zoo absorbing thiab dissipating mechanical stresses generated thaum lub sij hawm ua hauj lwm los yog ib puag ncig raug. Qhov no yuav pab tiv thaiv cov nti los ntawm kev puas tsuaj thiab txhim kho lub cuab yeej tiv thaiv rau sab nraud thiab kev co.

Moulded Underfill: Kev tiv thaiv siab thiab kev sib koom ua ke

Moulded underfill yog cov txheej txheem siab heev siv hauv kev lag luam ntim khoom semiconductor los muab kev tiv thaiv qib siab thiab kev koom ua ke rau cov khoom siv hluav taws xob. Nws suav nrog encapsulating tag nrho cov nti thiab nws cov pob nyob ib puag ncig nrog cov pwm sib xyaw nrog cov khoom siv hauv qab. Cov txheej txheem no muab cov txiaj ntsig tseem ceeb ntawm kev tiv thaiv, kev sib koom ua ke, thiab kev ntseeg tau tag nrho.

Ib qho txiaj ntsig tseem ceeb ntawm molded underfill yog nws lub peev xwm los muab kev tiv thaiv zoo rau cov nti. Cov pwm sib xyaw siv hauv cov txheej txheem no ua raws li kev tiv thaiv zoo, kaw tag nrho cov nti thiab pob hauv lub plhaub tiv thaiv. Qhov no muab kev tiv thaiv zoo tiv thaiv ib puag ncig xws li ya raws, plua plav, thiab cov kab mob uas tuaj yeem cuam tshuam rau kev ua haujlwm thiab kev ntseeg siab ntawm cov cuab yeej. Lub encapsulation tseem pab tiv thaiv cov nti los ntawm cov neeg kho tshuab kev nyuaj siab, thermal cycling, thiab lwm yam sab nraud quab yuam, ua kom nws lub sij hawm ntev.

Tsis tas li ntawd, molded underfill enables siab integration theem nyob rau hauv lub semiconductor pob. Cov khoom siv hauv qab yog sib xyaw ncaj qha rau hauv cov pwm sib xyaw, tso cai rau kev sib koom ua ke ntawm cov txheej txheem underfill thiab encapsulation. Qhov kev sib koom ua ke no tshem tawm qhov xav tau ntawm cov kauj ruam underfill cais, ua kom yooj yim rau kev tsim khoom thiab txo cov sij hawm tsim khoom thiab cov nqi. Nws tseem ua kom muaj kev sib luag thiab tsis sib xws hauv kev faib tawm thoob plaws hauv pob, txo qhov tsis muaj dab tsi thiab txhim kho tag nrho cov qauv kev ncaj ncees.

Ntxiv mus, molded underfill muaj cov thermal dissipation zoo heev. Cov pwm sib xyaw yog tsim los kom muaj cov thermal conductivity siab, tso cai rau nws hloov cov cua sov tawm ntawm cov nti zoo. Qhov no yog qhov tseem ceeb rau kev tswj xyuas qhov ntsuas kub zoo ntawm lub cuab yeej thiab tiv thaiv kom tsis txhob muaj cua sov, uas tuaj yeem ua rau kev ua haujlwm tsis zoo thiab teeb meem kev ntseeg siab. Txhim kho thermal dissipation zog ntawm molded underfill pab txhawb rau tag nrho cov kev ntseeg tau thiab ntev ntawm cov khoom siv hluav taws xob.

Tsis tas li ntawd, molded underfill enables ntau miniaturization thiab form factor optimization. Cov txheej txheem encapsulation tuaj yeem raug kho kom haum rau ntau qhov ntau thiab tsawg pob thiab cov duab, suav nrog cov qauv 3D nyuaj. Qhov kev hloov pauv no tso cai rau kev sib koom ua ke ntau lub chips thiab lwm yam khoom siv rau hauv pob khoom compact, chaw txuag. Kev muaj peev xwm ua tiav qib siab ntawm kev sib koom ua ke yam tsis muaj kev cuam tshuam kev ntseeg tau ua rau molded underfill tshwj xeeb tshaj yog muaj txiaj ntsig hauv cov ntawv thov uas qhov loj thiab qhov hnyav yog qhov tseem ceeb, xws li cov khoom siv txawb, cov khoom siv, thiab cov khoom siv hluav taws xob hauv tsheb.

Chip Scale Package (CSP) Underfill: Miniaturization thiab High Density

Chip Scale Package (CSP) underfill yog ib qho tseem ceeb thev naus laus zis ua kom muaj kev ua haujlwm me me thiab cov khoom siv hluav taws xob sib xyaw ua ke. Raws li cov khoom siv hluav taws xob txuas ntxiv me me thaum muab kev ua haujlwm ntxiv, CSP underfills lub luag haujlwm tseem ceeb hauv kev ua kom ntseeg tau thiab ua tau zoo ntawm cov khoom siv compact.

CSP yog lub tshuab ntim khoom uas tso cai rau cov nti semiconductor ncaj qha rau ntawm lub substrate lossis luam tawm Circuit Board (PCB) yam tsis tas yuav muaj pob ntxiv. Qhov no tshem tawm qhov xav tau ntawm lub thawv yas lossis ceramic, txo qhov loj thiab qhov hnyav ntawm lub cuab yeej. CSP underfill ib txheej txheem uas siv cov kua lossis cov khoom siv encapsulant los sau qhov sib txawv ntawm cov nti thiab cov substrate, muab cov khoom siv txhawb nqa thiab tiv thaiv cov nti los ntawm ib puag ncig yam xws li ya raws thiab kev ntxhov siab.

Miniaturization yog ua tiav los ntawm CSP underfill los ntawm kev txo qhov kev ncua deb ntawm cov nti thiab cov substrate. Cov khoom siv underfill ua rau qhov sib txawv nqaim ntawm cov nti thiab cov substrate, tsim kom muaj kev sib raug zoo thiab txhim kho cov neeg kho tshuab kev ruaj ntseg ntawm cov nti. Qhov no tso cai rau cov khoom siv me me thiab nyias nyias, ua rau nws tuaj yeem ntim cov haujlwm ntau dua rau hauv qhov chaw txwv.

High-density integration yog lwm qhov zoo ntawm CSP underfill. Los ntawm kev tshem tawm qhov xav tau ntawm cov pob khoom sib cais, CSP ua kom cov nti txuas mus ze rau lwm cov khoom ntawm PCB, txo qhov ntev ntawm kev sib txuas hluav taws xob thiab txhim kho cov teeb liab kev ncaj ncees. Cov khoom siv underfill kuj ua raws li tus neeg xyuas pib thermal, zoo dissipating tshav kub tsim los ntawm nti. Qhov kev tswj xyuas thermal no tso cai rau lub zog ntau dua, ua kom muaj kev sib koom ua ke ntawm ntau qhov nyuaj thiab muaj zog chips rau hauv cov khoom siv hluav taws xob.

CSP underfill cov ntaub ntawv yuav tsum muaj cov yam ntxwv tshwj xeeb kom tau raws li qhov xav tau ntawm miniaturization thiab high-density integration. Lawv yuav tsum muaj cov viscosity tsawg los pab txhawb qhov txhaws ntawm qhov khoob khoob, nrog rau cov khoom ntws zoo heev kom ntseeg tau tias muaj kev tiv thaiv zoo thiab tshem tawm cov voids. Cov ntaub ntawv tseem yuav tsum muaj adhesion zoo rau cov nti thiab cov substrate, muab cov khoom siv kho tshuab. Tsis tas li ntawd, lawv yuav tsum muaj cov thermal conductivity siab kom hloov cov cua sov tawm ntawm lub nti kom zoo.

Wafer-Level CSP Underfill: Nqi-zoo thiab muaj txiaj ntsig siab

Wafer-theem nti nplai pob (WLCSP) underfill yog tus nqi-zoo thiab cov txheej txheem ntim khoom uas muaj ntau yam zoo hauv kev tsim khoom thiab tag nrho cov khoom zoo. WLCSP underfill siv cov khoom siv tsis zoo rau ntau lub chips ib txhij thaum tseem nyob rau hauv daim ntawv wafer ua ntej lawv raug singulated rau hauv ib lub pob. Txoj hauv kev no muaj ntau yam txiaj ntsig ntsig txog kev txo nqi, txhim kho cov txheej txheem tswj, thiab ntau dua yields.

Ib qho txiaj ntsig tseem ceeb ntawm WLCSP underfill yog nws cov txiaj ntsig zoo. Kev siv cov khoom siv hauv qab ntawm qib wafer ua rau cov txheej txheem ntim tau yooj yim dua thiab ua haujlwm tau zoo. Cov khoom siv underfilled yog dispensed mus rau lub wafer siv cov txheej txheem tswj thiab automated, txo cov khoom pov tseg thiab txo nqi zog. Tsis tas li ntawd, tshem tawm cov kev tuav pov hwm ntawm tus kheej thiab cov kauj ruam sib dhos yuav txo tau tag nrho cov sij hawm tsim khoom thiab qhov nyuaj, uas ua rau cov nqi txuag tseem ceeb piv rau cov txheej txheem ntim khoom ib txwm muaj.

Ntxiv mus, WLCSP underfill muaj kev txhim kho cov txheej txheem tswj thiab ntau dua yields. Txij li cov khoom siv underfill tau siv rau ntawm qib wafer, nws ua rau muaj kev tswj xyuas zoo dua ntawm cov txheej txheem xa tawm, kom ntseeg tau tias muaj kev sib luag thiab tsis sib xws rau kev them nyiaj rau txhua daim ntawm wafer. Qhov no txo ​​qhov kev pheej hmoo ntawm qhov tsis muaj dab tsi lossis tsis tiav underfill, uas tuaj yeem ua rau muaj teeb meem kev ntseeg siab. Lub peev xwm los tshuaj xyuas thiab ntsuas qhov tsis zoo ntawm qib wafer kuj tso cai rau kev tshawb pom ntxov ntawm qhov tsis xws luag lossis cov txheej txheem kev hloov pauv, ua kom muaj kev kho raws sijhawm thiab txo qhov tshwm sim ntawm cov pob khoom tsis raug. Raws li qhov tshwm sim, WLCSP underfill pab ua tiav cov txiaj ntsig ntau dua thiab zoo dua tag nrho cov khoom zoo.

Qhov wafer-theem mus kom ze kuj ua kom zoo dua thermal thiab mechanical kev ua tau zoo. Cov khoom siv underfill siv hauv WLCSP feem ntau yog cov khoom siv uas tsis tshua muaj viscosity, capillary-flowing cov ntaub ntawv uas tuaj yeem ua tau zoo nyob rau hauv qhov chaw nqaim ntawm cov chips thiab cov wafer. Qhov no muab cov khoom siv kho tshuab rau cov chips, txhim kho lawv cov kev tiv thaiv rau cov neeg kho tshuab kev nyuaj siab, kev vibrations, thiab kub cycling. Tsis tas li ntawd, cov khoom siv underfill ua raws li tus neeg xyuas pib thermal, ua kom yooj yim rau cov cua sov uas tsim los ntawm cov chips, yog li txhim kho thermal tswj thiab txo qhov kev pheej hmoo ntawm overheating.

Flip Chip Underfill: Siab I / O ceev thiab kev ua tau zoo

Flip nti underfill yog ib qho tseem ceeb thev naus laus zis uas ua rau muaj kev tawm tswv yim / tso zis ntau (I / O) thiab kev ua tau zoo tshwj xeeb hauv cov khoom siv hluav taws xob. Nws ua lub luag haujlwm tseem ceeb hauv kev txhim kho kev ntseeg tau thiab kev ua haujlwm ntawm flip-chip ntim, uas yog siv dav hauv cov ntawv thov semiconductor siab heev. Kab lus no yuav tshawb txog qhov tseem ceeb ntawm flip nti underfill thiab nws qhov cuam tshuam rau kev ua tiav siab I / O ceev thiab kev ua tau zoo.

Flip nti thev naus laus zis suav nrog kev sib txuas hluav taws xob ncaj qha ntawm kev sib koom ua ke (IC) lossis semiconductor tuag rau hauv substrate, tshem tawm qhov xav tau ntawm kev sib txuas xov hlau. Qhov no ua rau muaj kev cog lus ntau dua thiab muaj txiaj ntsig zoo, vim tias I / O pads nyob rau hauv qab ntawm qhov tuag. Txawm li cas los xij, flip-chip ntim khoom nthuav qhia cov kev cov nyom tshwj xeeb uas yuav tsum tau daws kom ntseeg tau tias kev ua tau zoo thiab kev ntseeg siab.

Ib qho ntawm cov teeb meem tseem ceeb hauv flip nti ntim yog tiv thaiv kev ntxhov siab thiab thermal tsis sib haum ntawm cov tuag thiab cov substrate. Thaum lub sijhawm tsim khoom thiab kev ua haujlwm tom qab, qhov sib txawv ntawm qhov sib txawv ntawm cov thermal expansion (CTE) ntawm qhov tuag thiab substrate tuaj yeem ua rau muaj kev ntxhov siab loj, ua rau kev ua haujlwm tsis zoo lossis ua tsis tiav. Flip nti underfill yog cov khoom tiv thaiv uas encapsulates lub nti, muab kev txhawb zog thiab kev ntxhov siab. Nws muaj txiaj ntsig zoo faib cov kev ntxhov siab uas tau tsim thaum lub caij thermal cycling thiab tiv thaiv lawv los ntawm kev cuam tshuam rau kev sib cuam tshuam me me.

High I / O ceev yog qhov tseem ceeb hauv cov khoom siv hluav taws xob niaj hnub no, qhov twg cov qauv me me thiab kev ua haujlwm ntxiv yog qhov tseem ceeb. Flip nti underfill ua rau kom siab dua I / O densities los ntawm kev muab cov hluav taws xob zoo dua thiab kev tswj xyuas thermal. Cov khoom siv underfill ua rau qhov sib txawv ntawm qhov tuag thiab cov substrate, tsim kom muaj kev sib cuam tshuam zoo thiab txo qhov kev pheej hmoo ntawm luv circuits lossis hluav taws xob to. Qhov no tso cai rau kom ze dua qhov sib nrug ntawm I / O pads, ua rau muaj kev nce qib I / O yam tsis muaj kev ntseeg siab.

Ntxiv mus, flip chip underfill pab txhawb kev txhim kho hluav taws xob. Nws txo qis cov kab mob hluav taws xob nruab nrab ntawm qhov tuag thiab cov substrate, txo cov teeb liab ncua sij hawm thiab txhim kho cov teeb liab kev ncaj ncees. Cov khoom siv underfill kuj nthuav tawm cov khoom siv thermal conductivity zoo, ua kom cov cua sov ua kom zoo los ntawm cov nti thaum ua haujlwm. Kev siv hluav taws xob zoo kom ntseeg tau tias qhov kub thiab txias nyob hauv qhov kev txwv, tiv thaiv overheating thiab tswj kev ua haujlwm zoo.

Kev nce qib hauv flip chip underfill cov ntaub ntawv tau ua kom muaj qhov siab dua I / O thiab qib kev ua haujlwm. Nanocomposite underfills, piv txwv li, leverage nanoscale fillers los txhim kho thermal conductivity thiab mechanical zog. Qhov no tso cai rau kev txhim kho cov cua sov thiab kev ntseeg siab, ua kom cov khoom siv ua tau zoo dua.

Pob Grid Array (BGA) Underfill: Siab Thermal thiab Mechanical Performance

Ball Grid Array (BGA) underfills ib qho tseem ceeb thev naus laus zis muab siab thermal thiab mechanical kev ua tau zoo hauv cov khoom siv hluav taws xob. Nws ua lub luag haujlwm tseem ceeb hauv kev txhim kho kev ntseeg siab thiab kev ua haujlwm ntawm BGA pob, uas tau siv dav hauv ntau daim ntawv thov. Hauv tsab xov xwm no, peb yuav tshawb txog qhov tseem ceeb ntawm BGA underfill thiab nws qhov cuam tshuam rau kev ua tiav cov thermal thiab mechanical kev ua tau zoo.

BGA thev naus laus zis suav nrog lub pob tsim qhov chaw sib koom ua ke (IC) lossis semiconductor tuag yog mounted rau ntawm lub substrate, thiab cov hluav taws xob sib txuas yog tsim los ntawm ib qho array ntawm cov pob solder nyob rau hauv qab ntawm pob. BGA underfills ib cov khoom dispensed nyob rau hauv qhov sib txawv ntawm qhov tuag thiab lub substrate, encapsulating lub solder balls thiab muab txhua yam kev txhawb nqa thiab kev tiv thaiv rau lub rooj sib txoos.

Ib qho ntawm cov teeb meem tseem ceeb hauv BGA ntim yog kev tswj hwm ntawm thermal stresses. Thaum lub sijhawm ua haujlwm, IC tsim cov cua sov, thiab thermal expansion thiab contraction tuaj yeem ua rau muaj kev cuam tshuam loj ntawm cov pob qij txha txuas cov tuag thiab cov substrate. BGA underfils lub luag haujlwm tseem ceeb hauv kev txo cov kev ntxhov siab no los ntawm kev tsim cov ntawv cog lus nrog cov tuag thiab cov substrate. Nws ua raws li kev ntxhov siab tsis zoo, absorbing thermal expansion thiab contraction thiab txo cov strain ntawm cov pob qij txha. Qhov no pab txhim kho lub pob tag nrho kev ntseeg tau thiab txo qhov kev pheej hmoo ntawm kev sib koom ua tsis tiav.

Lwm qhov tseem ceeb ntawm BGA underfill yog nws lub peev xwm los txhim kho qhov kev ua tau zoo ntawm lub pob. Cov pob BGA feem ntau raug rau cov neeg kho tshuab kev ntxhov siab thaum tuav, sib dhos, thiab ua haujlwm. Cov khoom siv underfill ua rau qhov sib txawv ntawm qhov tuag thiab cov substrate, muab cov qauv kev txhawb nqa thiab kev txhawb zog rau cov pob qij txha. Qhov no txhim kho tag nrho cov neeg kho tshuab lub zog ntawm lub rooj sib txoos, ua rau nws tiv taus ntau dua rau kev sib tsoo, kev vibrations, thiab lwm yam sab nraud. Los ntawm kev faib cov neeg kho tshuab kev ntxhov siab, BGA underfill pab tiv thaiv pob tawg, delamination, lossis lwm yam kev ua tsis tiav.

Kev ua haujlwm siab thermal yog qhov tseem ceeb hauv cov khoom siv hluav taws xob kom ntseeg tau tias kev ua haujlwm zoo thiab kev ntseeg siab. BGA underfill cov ntaub ntawv yog tsim los kom muaj thermal conductivity zoo heev. Qhov no tso cai rau lawv kom hloov cov cua sov kom deb ntawm qhov tuag thiab faib nws hla lub substrate, txhim kho tag nrho cov thermal tswj ntawm pob. Kev siv hluav taws xob muaj txiaj ntsig zoo pab tswj kev ua haujlwm qis dua, tiv thaiv thermal hotspots thiab muaj peev xwm ua haujlwm tsis zoo. Nws kuj tseem txhawb nqa lub thawv lub neej ntev los ntawm kev txo cov khoom ' thermal stress.

Kev nce qib hauv BGA underfill cov ntaub ntawv tau ua rau muaj kev ua haujlwm siab dua thermal thiab mechanical. Txhim kho formulations thiab muab tub lim cov ntaub ntawv, xws li nanocomposites los yog siab thermal conductivity muab tub lim, tau enabled zoo dua tshav kub dissipation thiab txhua yam muaj zog, ntxiv dag zog rau kev ua tau zoo ntawm BGA pob.

Quad Flat Package (QFP) Underfill: Loj I / O suav thiab muaj zog

Quad Flat Package (QFP) yog ib qho kev sib koom ua ke (IC) pob siv dav hauv cov khoom siv hluav taws xob. Nws nta cov duab plaub los yog duab plaub nrog cov coj txuas los ntawm tag nrho plaub sab, muab ntau qhov kev tawm tswv yim / tawm (I / O) kev sib txuas. Txhawm rau txhim kho qhov kev ntseeg siab thiab muaj zog ntawm QFP cov pob khoom, cov ntaub ntawv tsis txaus yog feem ntau ua haujlwm.

Underfill yog cov khoom siv tiv thaiv uas siv nruab nrab ntawm IC thiab cov substrate los txhawb cov neeg kho tshuab lub zog ntawm cov pob qij txha thiab tiv thaiv kev ntxhov siab vim tsis ua haujlwm. Nws yog ib qho tseem ceeb tshwj xeeb tshaj yog rau QFPs nrog rau qhov loj I / O suav, vim tias cov kev sib txuas ntau tuaj yeem ua rau muaj kev ntxhov siab rau cov neeg kho tshuab tseem ceeb thaum caij tsheb kauj vab thiab kev ua haujlwm.

Cov khoom siv hauv qab siv rau QFP pob yuav tsum muaj cov yam ntxwv tshwj xeeb kom ntseeg tau tias muaj zog. Ua ntej, nws yuav tsum muaj kev sib raug zoo rau ob qho tib si IC thiab cov substrate los tsim kom muaj kev sib raug zoo thiab txo qhov kev pheej hmoo ntawm delamination lossis detachment. Tsis tas li ntawd, nws yuav tsum muaj cov coefficient tsawg ntawm thermal expansion (CTE) kom phim CTE ntawm IC thiab substrate, txo cov kev ntxhov siab tsis sib haum uas tuaj yeem ua rau tawg lossis tawg.

Tsis tas li ntawd, cov khoom siv hauv qab yuav tsum muaj cov khoom ntws zoo kom ntseeg tau tias muaj kev tiv thaiv ib puag ncig thiab ua kom tiav qhov sib txawv ntawm IC thiab substrate. Qhov no yuav pab tshem tawm cov voids, uas tuaj yeem ua rau cov pob qij txha tsis muaj zog thiab ua rau txo kev ntseeg tau. Cov khoom siv yuav tsum muaj cov khoom kho kom zoo, tso cai rau nws los tsim cov txheej txheem nruj thiab ruaj khov tom qab thov.

Nyob rau hauv cov nqe lus ntawm mechanical robustness, lub underfill yuav tsum muaj siab shear thiab tev lub zog los tiv thaiv sab nraud quab yuam thiab tiv thaiv pob deformation los yog sib cais. Nws tseem yuav tsum muaj kev tiv thaiv zoo rau cov dej noo thiab lwm yam ib puag ncig los tswj nws cov khoom tiv thaiv lub sijhawm. Qhov no yog qhov tseem ceeb tshwj xeeb hauv cov ntawv thov uas QFP pob tuaj yeem raug cuam tshuam rau cov xwm txheej hnyav lossis raug kub hloov pauv.

Muaj ntau yam khoom siv hauv qab no kom ua tiav cov yam ntxwv xav tau, suav nrog epoxy-based formulations. Nyob ntawm daim ntawv thov cov kev xav tau tshwj xeeb, cov ntaub ntawv no tuaj yeem muab faib ua cov txheej txheem sib txawv, xws li capillary flow, jetting, lossis screen printing.

System-in-Package (SiP) Underfill: Integration and Performance

System-in-Package (SiP) yog ib qho kev ntim khoom siv tshuab ua ke nrog ntau yam semiconductor chips, passive Cheebtsam, thiab lwm yam khoom rau hauv ib pob. SiP muaj ntau qhov zoo, suav nrog cov ntawv txo qis, txhim kho hluav taws xob ua haujlwm, thiab txhim kho kev ua haujlwm. Txhawm rau kom ntseeg tau tias muaj kev ntseeg siab thiab kev ua tau zoo ntawm SiP cov rooj sib txoos, cov ntaub ntawv tsis txaus yog feem ntau siv.

Underfill hauv SiP daim ntawv thov yog qhov tseem ceeb hauv kev muab kev ruaj ntseg thiab hluav taws xob sib txuas ntawm ntau yam khoom hauv pob. Nws pab txo qis qhov kev pheej hmoo ntawm kev ntxhov siab vim tsis ua haujlwm, xws li cov pob qij txha tawg lossis pob txha, uas tuaj yeem tshwm sim vim qhov sib txawv ntawm coefficients ntawm thermal expansion (CTE) ntawm cov khoom.

Kev sib xyaw ua ke ntau yam hauv ib pob SiP ua rau muaj kev sib cuam tshuam nyuaj, nrog ntau cov pob qij txha thiab cov khoom siv hluav taws xob siab. Cov khoom siv underfill pab txhawb cov kev sib tshuam no, txhim kho cov neeg kho tshuab lub zog thiab kev ntseeg siab ntawm kev sib dhos. Lawv txhawb nqa cov pob qij txha, txo qhov kev pheej hmoo ntawm qaug zog lossis kev puas tsuaj los ntawm thermal cycling lossis mechanical stress.

Hais txog kev ua haujlwm hluav taws xob, cov ntaub ntawv tsis txaus yog qhov tseem ceeb hauv kev txhim kho cov teeb liab kev ncaj ncees thiab txo qis hluav taws xob nrov. Los ntawm kev sau qhov sib txawv ntawm cov khoom thiab txo qhov kev ncua deb ntawm lawv, underfill pab txo cov kab mob parasitic capacitance thiab inductance, ua kom muaj kev sib kis tau sai thiab zoo dua.

Tsis tas li ntawd, cov ntaub ntawv tsis txaus rau SiP daim ntawv thov yuav tsum muaj cov thermal conductivity zoo heev kom tshem tawm cov cua sov los ntawm cov khoom sib xyaw ua ke kom zoo. Kev siv hluav taws xob zoo yog qhov tseem ceeb los tiv thaiv kev kub dhau thiab tswj xyuas tag nrho kev ntseeg tau thiab kev ua tau zoo ntawm SiP sib dhos.

Underfill cov ntaub ntawv hauv SiP ntim yuav tsum muaj cov khoom tshwj xeeb kom tau raws li cov kev sib koom ua ke thiab kev ua tau zoo. Lawv yuav tsum muaj flowability zoo los xyuas kom meej tag nrho cov kev pab them nqi thiab sau qhov khoob ntawm cov khoom. Cov khoom siv underfill yuav tsum muaj qhov tsawg-viscosity formulation kom yooj yim dispensing thiab sau rau hauv qhov nqaim lossis qhov chaw me me.

Tsis tas li ntawd, cov khoom siv hauv qab yuav tsum pom muaj zog adhesion rau ntau qhov chaw, nrog rau cov semiconductor chips, substrates, thiab passives, kom ntseeg tau tias muaj kev sib raug zoo. Nws yuav tsum tau sib xws nrog ntau yam khoom ntim, xws li cov organic substrates lossis ceramics, thiab nthuav tawm cov khoom siv zoo, nrog rau siab shear thiab tev lub zog.

Cov khoom siv tsis zoo thiab kev xaiv txoj kev xaiv yog nyob ntawm tus qauv SiP tshwj xeeb, cov khoom yuav tsum tau ua, thiab cov txheej txheem tsim khoom. Kev faib cov txheej txheem xws li capillary flow, jetting, los yog zaj duab xis-pab txoj kev feem ntau siv underfill hauv SiP cov rooj sib txoos.

Optoelectronics Underfill: Optical Alignment thiab Tiv Thaiv

Optoelectronics underfill suav nrog encapsulating thiab tiv thaiv cov khoom siv optoelectronic thaum ua kom pom tseeb qhov sib txawv. Optoelectronic li, xws li lasers, photodetectors, thiab kho qhov muag keyboards, feem ntau xav tau kev sib raug zoo ntawm cov khoom siv kho qhov muag kom ua tau zoo. Nyob rau tib lub sijhawm, lawv yuav tsum tau tiv thaiv los ntawm ib puag ncig yam uas tuaj yeem cuam tshuam rau lawv txoj haujlwm. Optoelectronics underfill nyob rau ob qho tib si cov kev cai no los ntawm kev muab kho qhov muag thiab kev tiv thaiv nyob rau hauv ib txoj kev.

Optical alignment yog ib qho tseem ceeb ntawm kev tsim khoom siv optoelectronic. Nws suav nrog kev ua kom pom cov ntsiab lus, xws li fibers, waveguides, lo ntsiab muag, lossis gratings, kom ntseeg tau tias lub teeb kis tau zoo thiab txais tos. Kev sib raug zoo yog qhov tsim nyog los ua kom cov cuab yeej ua tau zoo tshaj plaws thiab tswj cov teeb liab kev ncaj ncees. Cov txheej txheem kev sib xyaw ua ke ib txwm muaj xws li kev sib dhos ntawm phau ntawv siv kev tshuaj xyuas qhov muag lossis automated alignment siv cov theem sib dhos. Txawm li cas los xij, cov txheej txheem no tuaj yeem siv sijhawm ntev, siv zog ua haujlwm, thiab ua rau muaj kev ua yuam kev.

Optoelectronics underfill ib qho kev daws teeb meem tshiab los ntawm kev sib koom ua ke cov yam ntxwv ncaj qha rau hauv cov khoom siv hauv qab. Cov khoom siv hauv qab yog feem ntau yog cov kua lossis cov kua dej sib xyaw ua ke uas tuaj yeem ntws thiab sau qhov khoob ntawm cov khoom siv kho qhov muag. Los ntawm kev ntxiv cov yam ntxwv sib txawv, xws li microstructures lossis fiducial cov cim, nyob rau hauv cov khoom siv underfill, cov txheej txheem kev sib raug zoo tuaj yeem ua kom yooj yim thiab automated. Cov yam ntxwv no ua raws li cov lus qhia thaum lub sij hawm sib dhos, xyuas kom meej qhov sib txawv ntawm cov khoom siv kho qhov muag yam tsis tas yuav tsum muaj cov txheej txheem sib dhos nyuaj.

Ntxiv nrog rau kev kho qhov muag kho qhov muag, cov ntaub ntawv underfill tiv thaiv cov khoom siv optoelectronic. Optoelectronic Cheebtsam feem ntau raug rau qhov hnyav ib puag ncig, nrog rau qhov kub thiab txias, noo noo, thiab kev ntxhov siab. Cov yam ntxwv sab nraud no tuaj yeem ua rau qhov kev ua tau zoo thiab kev ntseeg siab ntawm cov cuab yeej siv lub sijhawm. Cov khoom siv underfill ua raws li kev tiv thaiv kev tiv thaiv, encapsulating cov khoom siv kho qhov muag thiab tiv thaiv lawv los ntawm ib puag ncig cov kab mob. Lawv kuj muab cov cuab yeej cuab tam, txo qhov kev pheej hmoo ntawm kev puas tsuaj vim kev poob siab lossis kev co.

Cov ntaub ntawv siv tsis tau siv hauv cov ntawv thov optoelectronics feem ntau yog tsim los kom muaj qhov ntsuas qis qis thiab pom qhov pom pom zoo. Qhov no ua kom muaj kev cuam tshuam tsawg heev nrog cov teeb liab kho qhov muag hla ntawm lub cuab yeej. Tsis tas li ntawd, lawv pom zoo adhesion rau ntau yam substrates thiab muaj thermal expansion coefficients tsawg los txo cov cuab yeej kev ntxhov siab thaum lub sij hawm thermal cycling.

Cov txheej txheem underfill suav nrog kev xa cov khoom siv hauv qab mus rau lub cuab yeej, tso cai rau nws ntws thiab sau qhov khoob ntawm cov khoom siv kho qhov muag, thiab tom qab ntawd kho nws los tsim cov khoom ntim khoom. Nyob ntawm daim ntawv thov tshwj xeeb, cov khoom siv hauv qab tuaj yeem siv tau los ntawm cov txheej txheem sib txawv, xws li capillary flow, dav hlau dispensing, lossis tshuaj ntsuam luam ntawv. Cov txheej txheem kho tuaj yeem ua tiav los ntawm tshav kub, UV hluav taws xob, lossis ob qho tib si.

Medical Electronics Underfill: Biocompatibility thiab Reliability

Cov khoom siv hluav taws xob kho mob ua tiav cov txheej txheem tshwj xeeb uas suav nrog encapsulating thiab tiv thaiv cov khoom siv hluav taws xob siv hauv cov khoom siv kho mob. Cov cuab yeej no ua lub luag haujlwm tseem ceeb hauv ntau daim ntawv thov kev kho mob, xws li cov khoom siv cog qoob loo, cov cuab yeej kuaj mob, kev tshuaj xyuas, thiab kev xa tshuaj. Kev kho mob electronics underfill tsom rau ob qhov tseem ceeb: biocompatibility thiab kev ntseeg tau.

Biocompatibility yog ib qho tseem ceeb uas yuav tsum tau muaj rau cov khoom siv kho mob uas tuaj yeem cuam tshuam nrog tib neeg lub cev. Cov khoom siv tsis zoo siv hauv cov khoom siv hluav taws xob kho mob yuav tsum yog biocompatible, txhais tau tias lawv yuav tsum tsis txhob ua rau muaj kev phom sij lossis muaj kev cuam tshuam tsis zoo thaum sib cuag nrog cov ntaub so ntswg los yog cov kua dej hauv lub cev. Cov ntaub ntawv no yuav tsum ua raws li cov kev cai nruj thiab cov qauv, xws li ISO 10993, uas qhia txog biocompatibility kuaj thiab cov txheej txheem ntsuas.

Underfill cov ntaub ntawv rau kev kho mob electronics yog ua tib zoo xaiv los yog tsim los xyuas kom meej biocompatibility. Lawv raug tsim los ua tsis muaj tshuaj lom, tsis ua rau khaus, thiab tsis ua xua. Cov ntaub ntawv no yuav tsum tsis txhob tso cov khoom tsis zoo los yog degrade thaum lub sijhawm, vim qhov no tuaj yeem ua rau cov ntaub so ntswg puas lossis mob. Biocompatible underfill cov ntaub ntawv tseem muaj cov dej nqus dej tsawg los tiv thaiv kev loj hlob ntawm cov kab mob lossis cov kab mob uas tuaj yeem ua rau kis kab mob.

Kev ntseeg tau yog lwm qhov tseem ceeb ntawm kev kho mob hluav taws xob tsis zoo. Cov cuab yeej kho mob feem ntau ntsib teeb meem kev ua haujlwm, suav nrog qhov kub thiab txias, noo noo, dej hauv lub cev, thiab kev ntxhov siab. Underfill cov ntaub ntawv yuav tsum tiv thaiv cov khoom siv hluav taws xob, kom ntseeg tau lawv lub sijhawm ntev thiab kev ua haujlwm. Kev ntseeg siab yog qhov tseem ceeb hauv cov ntawv thov kho mob uas cov cuab yeej tsis ua haujlwm tuaj yeem cuam tshuam rau tus neeg mob kev nyab xeeb thiab kev noj qab haus huv.

Cov khoom siv hluav taws xob tsis zoo rau kev kho mob hluav taws xob yuav tsum muaj kev tiv thaiv siab rau cov dej noo thiab cov tshuaj tiv thaiv kom tiv taus cov kua dej hauv lub cev lossis cov txheej txheem kom tsis muaj menyuam. Lawv kuj yuav tsum tau ua kom pom zoo adhesion rau ntau yam substrates, kom ruaj ntseg encapsulation ntawm cov khoom siv hluav taws xob. Cov khoom siv tshuab, xws li qis coefficients ntawm thermal expansion thiab zoo poob siab, yog qhov tseem ceeb rau kev txo qis kev ntxhov siab ntawm cov ntsiab lus thaum lub sij hawm thermal cycling los yog tsis siv neeg loading.

Cov txheej txheem underfill rau kev kho mob electronics suav nrog:

• Dispensing cov khoom underfill mus rau cov khoom siv hluav taws xob.
• Sau qhov khoob.
• Kho nws los tsim kev tiv thaiv thiab mechanically ruaj khov encapsulation.

Kev saib xyuas yuav tsum tau ua kom ntseeg tau tias muaj kev pov hwm tag nrho ntawm cov yam ntxwv thiab qhov tsis muaj qhov tsis muaj dab tsi lossis lub hnab ntim cua uas tuaj yeem cuam tshuam cov cuab yeej kev ntseeg tau.

Tsis tas li ntawd, cov kev txiav txim siab ntxiv yog muab rau hauv tus account thaum underfilling cov cuab yeej kho mob. Piv txwv li, cov khoom siv underfill yuav tsum tau sib haum nrog txoj kev ua kom tsis muaj menyuam siv rau lub cuab yeej. Qee cov ntaub ntawv yuav nkag siab rau cov txheej txheem ua kom tsis muaj menyuam, xws li chav dej, ethylene oxide, lossis hluav taws xob, thiab lwm yam ntaub ntawv yuav tsum tau xaiv.

Aerospace Electronics Underfill: Kub Kub thiab Vibration Resistance

Aerospace electronics underfill ib tug tshwj xeeb txheej txheem los encapsulate thiab tiv thaiv hluav taws xob Cheebtsam nyob rau hauv aerospace daim ntawv thov. Aerospace ib puag ncig ua rau muaj kev sib tw tshwj xeeb, suav nrog qhov kub thiab txias, kev co tsis zoo, thiab kev ntxhov siab. Yog li, aerospace electronics underfill tsom rau ob qhov tseem ceeb: kev kub siab ua haujlwm thiab kev co tsis kam.

High-temperature resistance yog qhov tseem ceeb tshaj plaws nyob rau hauv aerospace electronics vim qhov kub siab tau ntsib thaum ua haujlwm. Cov khoom siv tsis zoo siv hauv kev siv aerospace yuav tsum tiv taus cov kub kub no yam tsis muaj kev cuam tshuam rau kev ua haujlwm thiab kev ntseeg siab ntawm cov khoom siv hluav taws xob. Lawv yuav tsum tau nthuav tawm tsawg kawg thermal expansion thiab nyob ruaj khov nyob rau hauv ntau qhov kub thiab txias.

Underfill cov ntaub ntawv rau aerospace electronics raug xaiv los yog tsim rau cov iav hloov pauv kub (Tg) thiab thermal stability. Lub siab Tg kom ntseeg tau tias cov khoom khaws cia nws cov khoom siv kho tshuab ntawm qhov kub siab, tiv thaiv deformation lossis poob ntawm adhesion. Cov ntaub ntawv no tuaj yeem tiv taus qhov kub thiab txias, xws li thaum lub sij hawm nqa tawm, atmospheric reentry, los yog ua hauj lwm nyob rau hauv kub engine compartments.

Tsis tas li ntawd, cov ntaub ntawv underfill rau aerospace electronics yuav tsum muaj tsawg coefficients ntawm thermal expansion (CTE). CTE ntsuas ntau npaum li cas cov khoom nthuav tawm lossis cog lus nrog kev hloov pauv kub. Los ntawm kev muaj CTE qis, cov ntaub ntawv tsis txaus tuaj yeem txo qhov kev ntxhov siab ntawm cov khoom siv hluav taws xob uas tshwm sim los ntawm thermal cycling, uas tuaj yeem ua rau kev ua haujlwm tsis zoo lossis kev sib koom ua ke.

Kev vibration tsis kam yog lwm qhov tseem ceeb tshaj plaws rau aerospace electronics underfill. Aerospace tsheb yog raug rau ntau yam kev vibrations, nrog rau lub cav, lub davhlau-vim vibrations, thiab mechanical shocks thaum lub sij hawm tso tawm los yog tsaws. Cov kev vibrations no tuaj yeem cuam tshuam kev ua haujlwm thiab kev ntseeg siab ntawm cov khoom siv hluav taws xob yog tias tsis muaj kev tiv thaiv zoo.

Cov khoom siv hauv qab siv hauv aerospace electronics yuav tsum muaj cov khoom zoo heev vibration-damping. Lawv yuav tsum nqus thiab dissipate lub zog tsim los ntawm kev co, txo cov kev ntxhov siab thiab kev nyuaj siab ntawm cov khoom siv hluav taws xob. Qhov no pab tiv thaiv kev tsim cov kab nrib pleb, tawg, lossis lwm yam kev ua tsis tiav vim muaj kev co ntau dhau.

Ntxiv mus, underfill cov ntaub ntawv nrog siab adhesion thiab cohesive zog yog nyiam nyob rau hauv aerospace daim ntaub ntawv. Cov khoom no ua kom cov khoom siv tsis zoo nyob ruaj khov rau cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob, txawm tias nyob rau hauv cov xwm txheej tsis zoo. Muaj zog adhesion tiv thaiv cov khoom tsis zoo los ntawm delaminating los yog sib cais los ntawm cov khoom, tswj kev ncaj ncees ntawm encapsulation thiab tiv thaiv cov dej los yog khib nyiab ingress.

Cov txheej txheem underfill rau aerospace electronics feem ntau suav nrog kev xa cov khoom siv hauv qab mus rau hauv cov khoom siv hluav taws xob, tso cai rau nws ntws thiab sau cov qhov khoob, thiab tom qab ntawd kho nws los ua ib qho chaw ruaj khov. Cov txheej txheem kho tuaj yeem ua tiav siv cov txheej txheem thermal lossis UV kho, nyob ntawm daim ntawv thov tshwj xeeb.

Thermal cycling resistance yog lwm qhov tseem ceeb rau kev siv hluav taws xob hauv tsheb. Automotive tsheb tau hloov pauv qhov kub thiab txias, tshwj xeeb tshaj yog thaum pib lub cav thiab ua haujlwm, thiab cov kev kub ntxhov no tuaj yeem ua rau muaj kev ntxhov siab ntawm cov khoom siv hluav taws xob thiab cov khoom siv nyob ib puag ncig. Cov ntaub ntawv siv tsis tau siv hauv kev siv tsheb yuav tsum muaj cov thermal cycling zoo heev los tiv thaiv cov kub hloov pauv yam tsis muaj kev cuam tshuam lawv qhov kev ua tau zoo.

Cov khoom siv hluav taws xob tsis zoo rau cov khoom siv hluav taws xob hauv tsheb yuav tsum muaj cov thermal expansion (CTE) coefficients kom txo tau cov khoom siv hluav taws xob 'kev ntxhov siab thaum caij tsheb kauj vab. CTE zoo sib xws ntawm cov khoom siv tsis zoo thiab cov khoom xyaw txo cov kev pheej hmoo ntawm kev sib koom ua ke qaug zog, tawg, lossis lwm yam kev ua tsis tiav los ntawm thermal stress. Tsis tas li ntawd, cov ntaub ntawv underfill yuav tsum muaj cov thermal conductivity zoo kom dissipate tshav kub zoo, tiv thaiv cov hotspots hauv zos uas tuaj yeem cuam tshuam qhov kev ua tau zoo thiab kev ntseeg siab ntawm cov khoom.

Ntxiv mus, automotive electronics underfill cov ntaub ntawv yuav tsum tiv thaiv ya raws, tshuaj, thiab kua. Lawv yuav tsum muaj qhov nqus dej tsawg los tiv thaiv pwm kev loj hlob lossis corrosion ntawm cov khoom siv hluav taws xob. Tshuaj tiv thaiv kom ntseeg tau tias cov khoom siv tsis zoo nyob ruaj khov thaum raug cov kua hauv tsheb, xws li roj, roj, lossis tshuaj ntxuav, tsis txhob degradation lossis poob ntawm adhesion.

Cov txheej txheem underfill rau automotive electronics feem ntau cuam tshuam nrog kev xa cov khoom underfill mus rau cov khoom siv hluav taws xob, tso cai rau nws ntws thiab sau cov qhov khoob, thiab tom qab ntawd kho nws kom tsim tau cov khoom siv ruaj khov. Cov txheej txheem kho tuaj yeem ua tiav los ntawm cov txheej txheem thermal lossis UV curing, nyob ntawm daim ntawv thov cov kev cai tshwj xeeb thiab cov khoom siv tsis siv.

Xaiv txoj cai Underfill Epoxy

Xaiv txoj cai underfill epoxy yog qhov kev txiav txim siab tseem ceeb hauv kev sib dhos thiab kev tiv thaiv cov khoom siv hluav taws xob. Underfill epoxies muab cov cuab yeej siv zog, kev tswj xyuas thermal, thiab kev tiv thaiv ib puag ncig. Nov yog qee qhov kev txiav txim siab tseem ceeb thaum xaiv qhov tsim nyog underfill epoxy:

1. Thermal Properties: Ib qho ntawm cov haujlwm tseem ceeb ntawm underfill epoxy yog dissipating tshav kub tsim los ntawm cov khoom siv hluav taws xob. Yog li ntawd, nws yog ib qho tseem ceeb los xav txog cov epoxy thermal conductivity thiab thermal kuj. High thermal conductivity pab hloov cov cua sov kom zoo, tiv thaiv hotspots thiab tswj kev ntseeg tau ntawm cov khoom. Cov epoxy kuj tseem yuav tsum muaj cov thermal tsis tshua muaj zog los txo cov thermal kev nyuab siab ntawm cov khoom thaum lub caij kub.
2. CTE Match: Lub underfill epoxy's thermal expansion coefficient (CTE) yuav tsum tau ua kom zoo nrog CTE ntawm cov khoom siv hluav taws xob thiab cov substrate kom txo qis thermal kev nyuab siab thiab tiv thaiv kev sib koom tes ua tsis tiav. Kev sib raug zoo nrog CTE pab txo qis kev pheej hmoo ntawm kev ua haujlwm tsis zoo vim thermal cycling.
3. Flow thiab Gap-Filling Ability: Lub underfilled epoxy yuav tsum muaj cov yam ntxwv zoo ntws thiab muaj peev xwm ua kom muaj qhov sib txawv ntawm cov khoom siv tau zoo. Qhov no ua kom tiav kev pab them nqi thiab txo qis cov voids lossis cov hnab ntim cua uas tuaj yeem cuam tshuam rau lub rooj sib txoos cov khoom siv kho tshuab thiab kev ua haujlwm thermal. Lub viscosity ntawm epoxy yuav tsum haum rau cov kev thov tshwj xeeb thiab kev sib dhos, txawm tias nws yog capillary flow, dav hlau dispensing, lossis tshuaj ntsuam luam ntawv.
4. Adhesion: Muaj zog adhesion yog ib qho tseem ceeb heev rau underfilling epoxy los xyuas kom meej kev ruaj ntseg ntawm cov khoom thiab cov substrate. Nws yuav tsum pom zoo adhesion rau ntau yam ntaub ntawv, xws li hlau, ceramics, thiab plastics. epoxy cov khoom adhesion ua rau lub rooj sib txoos ua haujlwm zoo thiab kev ntseeg tau ntev.
5. Txoj Kev Kho: Xav txog txoj kev kho kom zoo tshaj plaws rau koj txoj kev tsim khoom. Underfill epoxies tuaj yeem kho tau los ntawm tshav kub, hluav taws xob UV, lossis kev sib xyaw ua ke ntawm ob qho tib si. Txhua txoj kev kho kom zoo muaj qhov zoo thiab kev txwv, thiab xaiv ib qho uas haum rau koj cov kev xav tau ntau lawm yog qhov tseem ceeb.
6. Environmental Resistance: Ntsuam xyuas qhov underfill epoxy tsis kam rau ib puag ncig yam xws li ya raws, tshuaj, thiab kub heev. Cov epoxy yuav tsum muaj peev xwm tiv taus cov dej, tiv thaiv kev loj hlob ntawm pwm lossis corrosion. Tshuaj tiv thaiv ua kom muaj kev ruaj ntseg thaum nyob rau hauv kev sib cuag nrog automotive kua, ntxuav cov neeg ua hauj lwm, los yog lwm yam khoom uas muaj corrosive. Tsis tas li ntawd, epoxy yuav tsum tswj hwm nws cov khoom siv hluav taws xob thiab hluav taws xob dhau qhov kub thiab txias.
7. Kev ntseeg tau thiab kev ua neej ntev: Xav txog qhov underfill epoxy cov ntaub ntawv taug qab thiab cov ntaub ntawv kev ntseeg siab. Nrhiav cov ntaub ntawv epoxy uas tau sim thiab ua pov thawj tias ua tau zoo hauv cov ntawv thov zoo sib xws lossis muaj ntawv pov thawj kev lag luam thiab ua raws li cov qauv tsim nyog. Xav txog yam xws li kev laus tus cwj pwm, kev ntseeg tau ntev, thiab epoxy lub peev xwm los tswj nws cov khoom nyob rau lub sijhawm.

Thaum xaiv txoj cai underfill epoxy, nws yog ib qho tseem ceeb los xav txog cov kev cai tshwj xeeb ntawm koj daim ntawv thov, suav nrog kev tswj xyuas thermal, kev ruaj ntseg, kev tiv thaiv ib puag ncig, thiab kev tsim cov txheej txheem sib xws. Kev sab laj nrog cov neeg muag khoom epoxy lossis nrhiav cov kws tshaj lij cov lus qhia tuaj yeem ua tau zoo hauv kev txiav txim siab uas ua tau raws li koj daim ntawv thov cov kev xav tau thiab ua kom muaj txiaj ntsig zoo thiab kev ntseeg siab.

Yav tom ntej Trends hauv Underfill Epoxy

Underfill epoxy yog tsis tu ncua hloov zuj zus, tsav los ntawm kev nce qib hauv cov thev naus laus zis hluav taws xob, cov ntawv thov tshiab, thiab xav tau kev txhim kho kev ua tau zoo thiab kev ntseeg siab. Ob peb lub neej yav tom ntej tuaj yeem pom hauv kev txhim kho thiab kev siv cov epoxy underfill:

1. Miniaturization thiab Higher Density Ntim: Raws li cov khoom siv hluav taws xob txuas ntxiv zuj zus thiab muaj cov khoom siv ntau dua, cov epoxy underfill yuav tsum hloov raws li. Cov qauv yav tom ntej yuav tsom mus rau kev tsim cov khoom siv tsis zoo uas nkag mus thiab ua kom muaj qhov sib txawv me me ntawm cov khoom siv, ua kom muaj kev tiv thaiv tiav thiab kev tiv thaiv txhim khu kev qha hauv cov khoom siv hluav taws xob me me.
2. High-Frequency Applications: Nrog rau qhov kev thov loj zuj zus rau cov khoom siv hluav taws xob ntau zaus thiab kev kub ceev, cov txheej txheem epoxy underfill yuav tsum tau hais txog cov kev cai tshwj xeeb ntawm cov ntawv thov no. Cov ntaub ntawv tsis tshua muaj dielectric tsis tu ncua thiab tsis tshua muaj qhov poob qis yuav yog qhov tseem ceeb los txo cov teeb liab poob thiab tswj kom muaj kev ncaj ncees ntawm cov teeb liab ntau zaus hauv kev sib txuas lus siab, 5G thev naus laus zis, thiab lwm yam kev siv tshiab.
3. Txhim kho Thermal Management: Thaum tshav kub kub dissipation tseem yog ib qho kev txhawj xeeb tseem ceeb rau cov khoom siv hluav taws xob, tshwj xeeb tshaj yog nrog cov hluav taws xob ntau ntxiv. Yav tom ntej underfill epoxy formulations yuav tsom rau kev txhim kho thermal conductivity los txhim kho cov cua sov hloov thiab tswj cov teeb meem thermal zoo. Advanced fillers thiab additives yuav muab tso rau hauv underfill epoxies kom ua tau zoo dua thermal conductivity thaum tuav lwm yam khoom uas xav tau.
4. Flexible thiab Stretchable Electronics: Kev nce siab ntawm cov khoom siv hluav taws xob hloov tau yooj yim thiab nthuav dav qhib qhov muaj peev xwm tshiab rau cov khoom siv epoxy underfilling. Saj zawg zog underfill epoxies yuav tsum ua kom pom zoo adhesion thiab mechanical zog txawm nyob rau hauv rov qab khoov los yog ncab. Cov ntaub ntawv no yuav ua rau lub encapsulation thiab tiv thaiv cov khoom siv hluav taws xob hauv cov khoom siv coj los siv, khoov tau, thiab lwm yam kev siv uas xav tau kev hloov kho tshuab.
5. Environmentally Friendly Solutions: Sustainability thiab ib puag ncig kev txiav txim siab yuav ua lub luag haujlwm tseem ceeb hauv kev tsim cov khoom siv epoxy underfill. Yuav muaj kev tsom mus rau kev tsim cov epoxy formulations dawb los ntawm cov khoom phom sij thiab txo cov kev cuam tshuam ib puag ncig thoob plaws hauv lawv lub neej, suav nrog kev tsim khoom, kev siv, thiab pov tseg. Bio-based lossis cov khoom siv txuas ntxiv tuaj yeem tau txais txiaj ntsig zoo li lwm txoj hauv kev ruaj ntseg.
6. Cov Txheej Txheem Txhim Kho Kev Txhim Kho: Cov txheej txheem yav tom ntej hauv underfill epoxy yuav tsom rau cov khoom siv thiab kev nce qib hauv kev tsim khoom. Cov txheej txheem xws li kev tsim khoom ntxiv, kev xaiv cov khoom siv, thiab cov txheej txheem kho siab heev yuav raug tshawb nrhiav los txhim kho daim ntawv thov thiab kev ua tau zoo ntawm underfill epoxy hauv ntau cov txheej txheem hluav taws xob sib dhos.
7. Kev sib xyaw ua ke ntawm kev soj ntsuam txuj ci siab thiab cov yam ntxwv ua kom muaj zog thiab cov kev xav tau ntawm cov khoom siv hluav taws xob, yuav muaj kev ntseeg tau thiab ua tau zoo ntawm underfilled epoxy. Cov txheej txheem xws li kev sim tsis muaj kev puas tsuaj, kev soj ntsuam hauv qhov chaw, thiab cov cuab yeej simulation yuav pab txhim kho thiab tswj kom zoo ntawm cov ntaub ntawv epoxy underfilled.

xaus

Underfill epoxy plays lub luag haujlwm tseem ceeb hauv kev txhim kho kev ntseeg tau thiab kev ua haujlwm ntawm cov khoom siv hluav taws xob, tshwj xeeb hauv cov ntim khoom semiconductor. Qhov sib txawv ntawm underfill epoxy muaj ntau yam txiaj ntsig, suav nrog kev ntseeg siab, kev faib tus kheej, siab ceev, thiab siab thermal thiab kev ua haujlwm zoo. Kev xaiv txoj cai underfill epoxy rau daim ntawv thov thiab pob ua kom muaj kev ruaj ntseg thiab siv tau ntev. Raws li thev naus laus zis nce qib thiab pob qhov loj me me, peb cia siab tias yuav muaj ntau lub tswv yim tshiab underfill epoxy cov kev daws teeb meem muab kev ua tau zoo, kev sib koom ua ke, thiab kev ua haujlwm me me. Underfill epoxy tau teeb tsa los ua lub luag haujlwm tseem ceeb hauv lub neej yav tom ntej ntawm cov khoom siv hluav taws xob, ua kom peb ua tiav qib siab ntawm kev ntseeg siab thiab kev ua tau zoo hauv ntau yam kev lag luam.