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5. Epoxy Adhesive

Epoxy Adhesive

DeepMaterial muab cov capillary flow underfills tshiab rau flip nti, CSP thiab BGA li. DeepMaterial's tshiab capillary flow underfills yog cov fluidity siab, siab-purity, ib qho khoom siv potting cov ntaub ntawv uas tsim cov khaubncaws sab nraud povtseg, void-free underfill khaubncaws sab nraud povtseg uas txhim kho kev ntseeg siab thiab txhua yam khoom ntawm cov khoom los ntawm kev tshem tawm cov kev ntxhov siab los ntawm cov khoom siv solder. DeepMaterial muab cov qauv rau kev ua kom nrawm nrawm ntawm qhov chaw zoo heev, muaj peev xwm kho tau sai, ua haujlwm ntev thiab ua neej nyob, nrog rau kev ua haujlwm rov ua haujlwm dua. Reworkability txuag cov nqi los ntawm kev tso cai tshem tawm cov underfill rau rov siv lub rooj tsavxwm.

Flip chip los ua ke yuav tsum muaj kev ntxhov siab ntawm lub vuam seam dua rau kev ncua ntev thermal aging thiab lub neej voj voog. CSP los yog BGA lub rooj sib txoos yuav tsum tau siv cov khoom siv hauv qab los txhim kho cov neeg kho tshuab kev ncaj ncees ntawm lub rooj sib txoos thaum lub sij hawm flex, vibration los yog poob kev sim.

DeepMaterial's flip-chip underfills muaj cov ntsiab lus siab muab tub lim thaum tswj ceev ceev hauv qhov me me, nrog lub peev xwm kom muaj qhov kub hloov pauv iav thiab siab modulus. Peb CSP underfills muaj nyob rau hauv ntau theem muab tub lim, xaiv rau lub iav hloov kub thiab modulus rau daim ntawv thov.

COB encapsulant tuaj yeem siv rau kev sib txuas xov hlau los muab kev tiv thaiv ib puag ncig thiab ua kom lub zog muaj zog. Kev tiv thaiv kev sib khi ntawm cov hlua khi hlua khi nrog rau sab saum toj encapsulation, cofferdam, thiab qhov sib txawv filling. Adhesives nrog fine-tuning txaus muaj nuj nqi yuav tsum tau, vim hais tias lawv muaj peev xwm txaus yuav tsum xyuas kom meej tias cov xov hlau yog encapsulated, thiab cov nplaum yuav tsis ntws tawm ntawm lub nti, thiab xyuas kom meej tias yuav siv tau rau zoo heev suab coj.

DeepMaterial's COB encapsulating adhesives tuaj yeem ua thermally lossis UV kho DeepMaterial's COB encapsulation adhesive tuaj yeem kho cua sov lossis UV-kho nrog kev ntseeg siab thiab qis thermal o coefficient, nrog rau cov iav siab hloov pauv kub thiab cov ntsiab lus ion tsawg. DeepMaterial's COB encapsulating adhesives tiv thaiv cov hlau lead thiab plumbum, chrome thiab silicon wafers los ntawm ib puag ncig sab nraud, kev puas tsuaj thiab corrosion.

DeepMaterial COB encapsulating adhesives yog tsim nrog kub-kho epoxy, UV-kho acrylic, los yog silicone chemistry rau hluav taws xob zoo. DeepMaterial COB encapsulating adhesives muaj qhov kub thiab txias ruaj khov thiab thermal poob siab tsis kam, hluav taws xob insulating zog dhau qhov kub thiab txias, thiab qis shrinkage, tsis tshua muaj kev ntxhov siab, thiab tshuaj tiv thaiv thaum kho.

Deepmaterial yog qhov zoo tshaj plaws sab saum toj waterproof structural adhesive kua nplaum rau yas rau hlau thiab iav chaw tsim tshuaj paus, muab cov uas tsis yog conductive epoxy nplaum sealant kua nplaum rau underfill pcb hluav taws xob Cheebtsam, semiconductor nplaum rau hluav taws xob sib dhos, kub kub kho bga flip nti underfill pcb epoxy txheej txheem nplaum nplaum khoom thiab thiaj li. ntawm

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