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I-Epoxy Adhesive

I-DeepMaterial inikezela ngokugcwalisa okungaphansi kokugeleza kwe-capillary ku-flip chip, i-CSP namadivayisi e-BGA. I-DeepMaterial's new capillary flow underfills yi-fluidity ephezulu, ukuhlanzeka okuphezulu, izinto zokubumba zengxenye eyodwa ezakha umfaniswano, izendlalelo ezingenalutho ezingenalutho ezithuthukisa ukuthembeka kanye nezakhiwo zemishini zezingxenye ngokuqeda ukucindezeleka okubangelwa izinto ezithengiswayo. I-DeepMaterial inikeza ukwakheka kokugcwalisa ngokushesha izingxenye zezwi ezinhle kakhulu, amandla okwelapha ngokushesha, ukusebenza isikhathi eside nempilo yokuphila, kanye nokusebenza kabusha. Ukusebenza kabusha konga izindleko ngokuvumela ukususwa kokugcwalisa ukuze kusetshenziswe kabusha ibhodi.

Ukuhlanganiswa kwe-Flip chip kudinga ukukhululeka kwengcindezi komthungo wokushisela futhi ngokuguga okushisayo nempilo yomjikelezo. Ukuhlanganiswa kwe-CSP noma i-BGA kudinga ukusetshenziswa kokungagcwalisi kahle ukuze kuthuthukiswe ubuqotho bemishini yomhlangano ngesikhathi sokuhlola i-flex, vibration noma drop.

I-DeepMaterial's flip-chip underfill inokuqukethwe okuphezulu kwesigcwalisi ngenkathi igcina ukugeleza okusheshayo kuma-pitches amancane, enekhono lokuba nezinga lokushisa eliphezulu lokushintsha kwengilazi kanye ne-modulus ephezulu. Okungagcwalisi phansi kwe-CSP yethu kuyatholakala kumazinga ahlukahlukene wokugcwalisa, akhethelwe izinga lokushisa lengilazi lokushintsha kanye nemodulus yohlelo oluhlosiwe.

I-COB encapsulant ingasetshenziselwa ukubopha ngocingo ukuze kuhlinzekwe ukuvikelwa kwemvelo nokwandisa amandla emishini. Ukuvalwa kokuvikela kwama-chips ahlanganiswe ngocingo kufaka phakathi ukuhlanganisa okuphezulu, i-cofferdam, nokugcwaliswa kwegebe. Ama-adhesives anomsebenzi wokugeleza wokulungisa kahle ayadingeka, ngoba ikhono lawo lokugeleza kufanele liqinisekise ukuthi izintambo zihlanganisiwe, futhi okunamathelayo ngeke kugeleze ku-chip, futhi kuqinisekise ukuthi kungasetshenziswa emithonjeni emihle kakhulu ye-pitch.

I-DeepMaterial's COB encapsulating adhesives ingaba i-thermal or UV yelashwe i-DeepMaterial's COB encapsulation adhesive ingelapheka ukushisa noma yelashwe nge-UV ngokwethembeka okuphezulu kanye ne-thermal coefficient yokuvuvukala okuphansi, kanye nezinga lokushisa eliphezulu lokuguqulwa kwengilazi nokuqukethwe kwe-ion ephansi. I-DeepMaterial's COB encapsulating adhesives ivikela umkhondo kanye neplumbum, ama-chrome nama-silicon wafers avela endaweni yangaphandle, ukulimala komshini kanye nokugqwala.

I-DeepMaterial COB encapsulating adhesives yenziwe nge-heat-curing epoxy, i-UV-curing acrylic, noma i-silicone chemistries ukuze kufakwe kahle ugesi. I-DeepMaterial COB encapsulating adhesives inikeza ukuzinza okuhle kwezinga lokushisa eliphezulu kanye nokumelana nokushaqeka okushisayo, izakhiwo zokuvikela ugesi ngaphezu kwebanga lokushisa elibanzi, kanye nokuncipha okuphansi, ukucindezeleka okuphansi, nokumelana namakhemikhali lapho welashwa.

I-Deepmaterial iyi-glue enamathelayo engangeni manzi engaphezulu kwepulasitiki kumkhiqizi wensimbi nengilazi, hlinzeka ngeglue enamathelayo engaphenduki ye-epoxy enamathelayo yezingxenye ze-elekthronikhi ezingagcwali, izinamatheliso ze-semiconductor zomhlangano we-elekthronikhi, izinga lokushisa eliphansi lokwelapha i-bga flip chip underfill pcb epoxy process adhesive glue material nokunye. ku

I-DeepMaterial Epoxy Resin Base Chip Phansi Ukugcwaliswa kanye Nethebula Lokukhetha Lokukhetha Lokupakisha I-Cob
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