Izinto zokuncamathelisa kwiPotting kunye ne-Ecapsulation
I-Adhesive ihamba ngaphaya kwaye ijikeleze icandelo okanye igcwalise igumbi ukukhusela amacandelo kulo. Imizekelo ibandakanya iintambo zombane onzima kunye neziqhagamshelo, izinto zombane ezikwiimeko zeplastiki, iibhodi zeesekethe kunye nokulungiswa kwekhonkrithi.
Isitywina kufuneka sibe nde kakhulu kwaye sibhetyebhetye, somelele, kwaye sisete ngokukhawuleza. Ngokwenkcazo, iziqhoboshi zoomatshini phantse zihlala zifuna itywina lesibini kuba ukungena kumphezulu kuvumela ulwelo kunye nomphunga ukuba ungene ngokukhululekileyo kwindibano.
I-Peel, i-Compression kunye ne-Tension Stresses xa utywinwa, u-Potting okanye u-Ecapsulating
Ukuba indibano idinga ukugqithelana kabini okanye ukudityaniswa kweempundu ukuba kutywinwe, i-sealant idla ngokuvezwa kumandla e-peel. Ukuhamba ngeenyawo ngaphaya kwemigubasi yesango okanye umoya kuphahla lwekharaji kaloliwe ngokuqhubekayo uzama ukuxobula isitywina, nokuba yiteyiphu okanye incamathelisa, ukusuka kwindawo. Ukuba isicelo sifakwe kwi-potted okanye i-encapsulated, i-adhesive (iiteyiphu ayifanelekanga kakuhle apha) ihlala ibona ukunyanzeliswa kunye noxinzelelo njengoko inxalenye ifumana ukwanda kwe-thermal okanye ukucutha. Iinxalenye ezininzi zeembiza, kwiibhodi zeesekethe, umzekelo, zinokubona zonke iingcinezelo ezintathu - i-peel, i-compression kunye ne-tension.
Umgca we-deepmaterial wemveliso uqukethe i-epoxies, i-silicones, i-polyurethanes kunye neenkqubo ezinyangekayo ze-UV. Zisetyenziswa kwizicelo zamandla ombane aphantsi, aphakathi, aphezulu kwaye zineempawu ezibalaseleyo zokugquma umbane, amandla ancamathelayo aphezulu, uzinzo lobushushu kunye nokumelana neekhemikhali okugqwesileyo. Iimveliso zibonelela ngokusebenza okuthembekileyo kwexesha elide kwi-microelectronic, i-elektroniki, izixhobo zombane, izinto ezibandakanya:
*Izixhobo zombane
*Iitshintshi
*Iikhoyili zokulayita
*Iimodyuli ze-elektroniki
*IiMoto
*Iziqhagamshelo
*Izivamvo
*Ukudityaniswa kwentambo zokubopha
*IiCapacitors
*Iziguquli
*Abahlaziyi
Iipropathi zePotting, Encapsulation and Casting Systems
Ukusuka "phantsi kwe-hood" ukuya kwi-photovoltaic junction box assembly Ukupakishwa kwe-LED kwiimodyuli zaselwandle kwiimpompo ezingaphantsi kwamanzi i-Master Bond potting, i-encapsulation, izinto zokuphosa azikwazi ukumelana neemeko zokusingqongileyo. Banikezela ngezi ncedo zilandelayo:
*Iipropati zolawulo oluphuculweyo lwe-thermal
*I-coefficients ephantsi kakhulu yokwandiswa kwe-thermal
*Ukuxhathisa kwi-crack
*Ukhuseleko kumhlwa
*Ubushushu obunyusiweyo kunye nenkonzo ye-cryogenic
*Ukumelana nebhayisekile eshushu kunye nokothuka
Amanqaku athile asetyenziselwa ukuthintela ukuphazamisa, ukungena kwiinxalenye ezipakishwe ngokuxineneyo, ukutywina iikhoyili zamanxeba eziqinileyo, ukugcwalisa ngaphantsi, kumbane ophezulu ombane wangaphakathi/usetyenziso lwangaphandle apho i-arcing/tracking iyinkxalabo kunye neemeko eziphezulu zevacuum. Ukongeza i-Master Bond ibonelela ngeenkqubo ezicacileyo ezinyangekayo ze-UV ezibandakanya ukunyangwa kabini (i-UV / ukunyangeka kobushushu) iikhompawundi zeendawo "ezinomthunzi" ezidlula iiyure ezili-1000 kwi-85 ° C / 85% yovavanyo lwe-RH.
I-viscosity ephantsi, i-self leveling rigid, i-semi-rigid kunye neengqungquthela eziguquguqukayo zisusa ukuvalelwa kwegesi kwaye zilungele ukusetyenziswa kwemveliso yomthamo ophezulu. Ezi zistim ze-solvent zasimahla ze-100% eziqinileyo zibonisa ukucutheka okuphantsi, uzinzo olubalaseleyo lwe-dimensional, iipropathi ezigqwesileyo zoomatshini kwaye zinokusasazwa ngesandla / ngokuzenzekelayo. Bakhusela i-abrasion, ukothuka, ukungcangcazela, impembelelo, i-UV, umngundo, ukuvezwa komswakama kubandakanya ukuntywiliselwa kwamanzi etyuwa. Amabakala athile abonisa iimpawu eziphezulu zokuchithwa kwe-thermal kunye namaqondo okushisa aphezulu eglasi. Iinkqubo ezivulwe ngubushushu zinokunyangeka kumaqondo obushushu aphantsi kwaye zibonise i-exotherm ephantsi nakwiindawo ezahlukeneyo ezinobunzima obunqamlezayo. Ithambile, i-durometer ephantsi, iingoma ezinokomelela zineempawu ezibalaseleyo zokuphelisa uxinzelelo kwizinto ezibuthathaka, ezinobuthathaka. Zonke iimveliso ziyahambelana ne-ROHS.
Qinisekisa ukusebenza kwe-elektroniki okuhlala ixesha elide kunye ne-Deepmaterial potting
Ukusuka kwizixhobo eziphathwayo zedijithali ukuya kwezothutho, izinto zombane ziya zisibakhona kubomi bethu bemihla ngemihla. Nokuba zizithuthi, ii-electronics zabathengi okanye iisistim ze-elektroniki zemizi-mveliso, ubugcisa esixhomekeke kubo busebenzisa izinto ezahlukeneyo ezifana nezinzwa, ii-actuator kunye neebhodi zeesekethe ezifuna ukhuseleko.
Isixhobo se-Deepmaterial esinenxalenye enye nambini yokubumba ilungele iimfuno zakho kunye nezisombululo ze-Deepmaterial. Oku kuvelisa itywina elifana ne-hermetic ukukhusela izixhobo zombane ezibuthathaka ngokuchasene neempembelelo zokusingqongileyo ezinjengothuli, ukufuma kunye nokwahluka kwamaqondo obushushu ukugcina ingqibelelo yamacandelo abo kunye nokuqinisekisa ukusebenza ixesha elide.
iikhompawundi kukuqinisa amalungu ngokuthi:
*Ukuphucula ukusebenza koomatshini kunye ne-thermal;
*Ukubonelela nge-insulation kunye nokumelana nokungcangcazela kunye nokothuka;
*Ukuthintela umhlwa kumanzi;
*Ukubonelela ngokumelana neekhemikhali;
*Ukuphucula ukulahla ubushushu.
Kutheni usebenzisa i-Deepmaterial kwizinto zombane ezibuthathaka?
*Ukuqinisekisa ukukhuselwa kwemathiriyeli kwizinto zokusingqongileyo;
*Ukuphucula ukuthembeka kwesicelo sokugqibela;
*Gcina imfezeko yamacandelo;
* Gcina ukusebenza ixesha elide.
Ukusetyenziswa kweembiza eziqhelekileyo
*IiPCB kunye neebhokisi zokudibanela;
* Ukufakwa kwe-LED;
*Iimodyuli zelanga;
*Izixhobo ze-elektroniki;
*Ukutshintshwa kobushushu kulawulo lobushushu.
