Tlhaloso
Product ga tlhaloso di-parameter
| Model Model |
Name Product |
Color |
tloaelehileng
Viscosity (cps) |
Nako ea ho ikoetlisa |
tshebediso |
Phapang |
| EA-6513-DM |
Sekhomaretsi se kopanyang sa epoxy underfill |
Opaque Creamy Yellow |
3000 ~ 6000 |
@100℃
30min
120 ℃ 15mins
150 ℃ 10mins |
Reusable CSP (FBGA) kapa BGA filler |
Karolo e le 'ngoe ea sekhomaretsi sa epoxy resin ke CSP (FBGA) kapa BGA e ka sebelisoang hape. E fola kapele hang ha e futhumala. E etselitsoe ho fana ka tšireletso e ntle ho thibela ho hlōleha ka lebaka la khatello ea mochine. Viscosity e tlase e lumella ho tlatsa likheo tlas'a CSP kapa BGA. |
| EA-6517-DM |
Epoxy e tlatsang ka tlase |
Black |
2000 ~ 4500 |
@120℃ 5min 100℃ 10min |
CSP (FBGA) kapa BGA e tlatsitsoe |
Karolo e le 'ngoe, thermosetting epoxy resin ke CSP (FBGA) e ka sebelisoang hape (FBGA) kapa BGA filler e sebelisetsoang ho sireletsa manonyeletso a solder khatellong ea mochini ho lisebelisoa tsa elektroniki tse tšoaroang ka letsoho. |
| EA-6593-DM |
Sekhomaretsi se kopanyang sa epoxy underfill |
Black |
3500 ~ 7000 |
@150℃ 5min 165℃ 3min |
Phallo ea Capillary e Tlatsitse Chip Size Packaging |
Pheko e potlakileng, epoxy resin ea metsi e phallang ka potlako, e etselitsoeng ho pakela boholo ba chip ea capillary flow. E etselitsoe lebelo la ts'ebetso e le taba ea bohlokoa tlhahisong. Moralo oa eona oa rheological o e lumella ho kenella ka lekhalo la 25μm, ho fokotsa khatello ea maikutlo, ho ntlafatsa ts'ebetso ea libaesekele tsa mocheso, le ho ba le khanyetso e ntle ea lik'hemik'hale. |
| EA-6808-DM |
Sekhomaretsi sa epoxy underfill |
Black |
360 |
@130℃ 8min 150℃ 5min |
CSP (FBGA) kapa BGA tlase tlatsa |
Sekhomaretsi sa khale sa underfill se nang le viscosity e tlase haholo bakeng sa lits'ebetso tse ngata tse sa tlalang. |
| EA-6810-DM |
Sekhomaretsi se ka sebelisoang hape sa epoxy underfill |
Black |
394 |
@130℃ 8mins |
Reusable CSP (FBGA) kapa BGA tlase
ho tlatsa |
Epoxy primer e ka sebelisoang hape e etselitsoe lits'ebetso tsa CSP le BGA. E phekola ka potlako mochesong o itekanetseng ho fokotsa khatello ea kelello likarolong tse ling. Hang ha e se e phekotsoe, thepa e na le lisebelisoa tse ntle tsa mochini ho sireletsa manonyeletso a solder nakong ea libaesekele tse futhumetseng. |
| EA-6820-DM |
Sekhomaretsi se ka sebelisoang hape sa epoxy underfill |
Black |
340 |
@130℃ 10min 150℃ 5min 160℃ 3min |
Reusable CSP (FBGA) kapa BGA tlase
ho tlatsa |
Tlatsetso e ka sebelisoang hape e etselitsoe likopo tsa CSP, WLCSP le BGA ka kotloloho. E etselitsoe ho phekola ka potlako mochesong o itekanetseng ho fokotsa khatello ea kelello likarolong tse ling. Thepa e na le mocheso o phahameng oa phetoho ea likhalase le boima bo phahameng ba fracture bakeng sa tšireletso e ntle ea manonyeletso a solder nakong ea libaesekele tse futhumetseng. |
Litlhahiso tsa Mesebetsi
| E ka tsosolosoa |
Pheko e potlakileng ka mocheso o itekanetseng |
| Mocheso o phahameng oa phetoho ea likhalase le boima bo phahameng ba ho robeha |
Viscosity e tlase haholo bakeng sa lits'ebetso tse ngata tse sa tlalang |
Melemo ea Meriana
Ke CSP e ka sebelisoang hape (FBGA) kapa BGA filler e sebelisetsoang ho sireletsa manonyeletso a solder khatellong ea mochini lisebelisoa tsa elektroniki tse tšoaroang ka letsoho. E fola kapele hang ha e futhumala. E etselitsoe ho fana ka tšireletso e ntle khahlanong le ho hlōleha ka lebaka la khatello ea mochine. Viscosity e tlase e lumella likheo ho tlatsoa tlasa CSP kapa BGA.
