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Epoxy underfill jajabka xabagta

Xabagta qalinka ah ee waxtarka leh ee baakadaha chip iyo isku xidhka

Alaabtani waa hal qayb oo ka mid ah kuwa daawaynaya kulaylka epoxy-ga oo leh ku dheggan wanaagsan oo agabyo kala duwan leh. Xabag heersare ah oo ka hooseeya oo leh viscosity aadka u hooseeya oo ku habboon inta badan codsiyada buuxinta. Epoxy primer dib loo isticmaali karo waxaa loogu talagalay codsiyada CSP iyo BGA.

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Description

Halbeegyada Tilmaamaha Alaabta

Habka alaabta Product Name Color caadiga

Viscosity (cps)

 Waqtiga Daawaynta Isticmaal Kala soocida
DM-6513 Epoxy underfill xabagta isku xidhka Jaallaha kareemka ah ee aan muuqan 3000 ~ 6000 @ 100 ℃

30min

120 ℃ 15 daqiiqo

150 ℃ 10 daqiiqo

 Dib loo isticmaali karo CSP (FBGA) ama buuxinta BGA Xabagta xabagta xabagta ee hal-qayb ka kooban waa xabagta dib loo isticmaali karo ee CSP (FBGA) ama BGA. Si dhakhso ah ayay u dawaysaa marka la kululeeyo. Waxaa loogu talagalay inay bixiso difaac wanaagsan si looga hortago fashilka sababtoo ah cadaadiska farsamada. Viscosity hoose wuxuu ogolaanayaa buuxinta daldaloolada hoos yimaada CSP ama BGA.
DM-6517 Buuxiyaha hoose ee Epoxy Black 2000 ~ 4500 @ 120℃ 5min 100℃ 10 daqiiqo CSP (FBGA) ama BGA la buuxiyey Hal qayb, resin epoxy resin thermosetting waa CSP (FBGA) ama buuxinta BGA ee dib loo isticmaali karo si looga ilaaliyo kala-goysyada alxanka culeysyada farsamada gacanta ee elektiroonigga ah.
DM-6593 Epoxy underfill xabagta isku xidhka Black 3500 ~ 7000 @ 150℃ 5min 165℃ 3 daqiiqo Baakadaha cabbirka Chip-ka ee socodka dhiigga kabuuxa Daawaynta degdega ah, resin epoxy dareere ah oo si degdeg ah u qulqulaya, oo loogu talagalay buuxinta qulqulka xididada baakadaha cabbirka chip. Waxaa loogu talagalay xawaaraha geeddi-socodka oo ah arrin muhiim u ah wax soo saarka. Naqshaddeeda rheological waxay u oggolaanaysaa inay gasho farqiga 25μm, yarayso walbahaarka, hagaajinta waxqabadka wareegga heerkulka, oo ay yeelato iska caabin kiimiko oo heer sare ah.
DM-6808 Xabagta Epoxy ka hooseysa Black 360 @130℃ 8daqiiqo 150℃ 5 daqiiqo CSP (FBGA) ama BGA hoose ayaa buuxinaya Xabag-buuxinta caadiga ah oo leh muuqasho aad u hooseeya inta badan codsiyada buuxinta.
DM-6810 Xabag dib loo shaqayn karo Black 394 @130℃ 8 daqiiqo Dib loo isticmaali karo CSP (FBGA) ama BGA hoose

buufin

 Epoxy primer dib loo isticmaali karo waxaa loogu talagalay codsiyada CSP iyo BGA. Waxay si dhakhso ah u daawaysaa heerkulka dhexdhexaadka ah si loo yareeyo walbahaarka qaybaha kale. Marka la daaweeyo, maaddadu waxay leedahay sifooyin farsamo oo aad u fiican si ay u ilaaliyaan kala-goysyada alxanka inta lagu jiro baaskiil wadida kulaylka.
DM-6820 Xabag dib loo shaqayn karo Black 340 @130℃ 10min 150℃ 5min 160℃ 3daqiiqo Dib loo isticmaali karo CSP (FBGA) ama BGA hoose

buufin

 Buuxinta dib loo isticmaali karo waxaa si gaar ah loogu talagalay codsiyada CSP, WLCSP iyo BGA. Waxaa loo qaabeeyey in si degdeg ah loogu daweeyo heerkul dhexdhexaad ah si loo yareeyo walbahaarka qaybaha kale. Qalabku wuxuu leeyahay heerkul sare oo kala-guurka dhalada ah iyo adkaanta jabka sare ee ilaalinta wanaagsan ee kala-goysyada alxanka inta lagu jiro baaskiil wadida kulaylka.

 

Features Product

Dib loo isticmaali karo Daawaynta degdega ah ee heerkul dhexdhexaad ah
Heerkulka kala-guurka dhalada sare iyo adkaanta jabka sare Viscosity aadka u hooseeya ee badi codsiyada aan buuxin

 

Faa'iidada Waxyaabaha

Waa CSP (FBGA) ama buuxinta BGA ee dib loo isticmaali karo si looga ilaaliyo kala-goysyada alxanka culeyska farsamada ee aaladaha elektiroonigga ah ee gacanta lagu qaato. Si dhakhso ah ayay u dawaysaa marka la kululeeyo. Waxaa loogu talagalay inay bixiso difaac wanaagsan oo ka hortagga fashilka sababtoo ah cadaadiska farsamada. Viscosity hoose wuxuu ogolaanayaa in daldaloolada lagu buuxiyo CSP ama BGA.