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5. Kudzaza Epoxy

Kudzaza Epoxy

Underfill epoxy ndi mtundu wa zomatira zomwe zimagwiritsidwa ntchito kulimbitsa kudalirika kwa zida zamagetsi, makamaka pamapaketi a semiconductor. Imadzaza kusiyana pakati pa phukusi ndi bolodi losindikizidwa (PCB), kupereka chithandizo chamakina ndi mpumulo wachisokonezo kuti muteteze kuwonjezereka kwa kutentha ndi kuwonongeka kwapakati. Underfill epoxy imathandizanso magwiridwe antchito amagetsi a phukusili pochepetsa kutulutsa kwa parasitic ndi capacitance. M'nkhaniyi, tikufufuza ntchito zosiyanasiyana za underfill epoxy, mitundu yosiyanasiyana yomwe ilipo, ndi ubwino wake.

Kufunika kwa Underfill Epoxy mu Semiconductor Packaging

Underfill epoxy ndiyofunikira pakuyika kwa semiconductor, kumapereka chilimbikitso ndi chitetezo pamakina ang'onoang'ono. Ndizinthu zomatira zapadera zomwe zimagwiritsidwa ntchito kudzaza kusiyana pakati pa chip cha semiconductor ndi gawo lapansi la phukusi, kupititsa patsogolo kudalirika ndi magwiridwe antchito a zida zamagetsi. Apa, tiwona kufunikira kwa epoxy yodzaza ndi ma semiconductor.

Imodzi mwa ntchito zazikulu za epoxy yodzaza ndi kukonzanso mphamvu zamakina ndi kudalirika kwa phukusi. Panthawi yogwira ntchito, tchipisi ta semiconductor timakumana ndi zovuta zosiyanasiyana zamakina, monga kukulitsa kutentha ndi kutsika, kugwedezeka, ndi kugwedezeka kwamakina. Kupanikizika kumeneku kungayambitse kupanga ming'alu ya solder, zomwe zingayambitse kulephera kwa magetsi ndikuchepetsa moyo wonse wa chipangizocho. Underfill epoxy imagwira ntchito ngati wothandizira kuchepetsa kupsinjika pogawa kupsinjika kwamakina molingana ndi chip, gawo lapansi, ndi ma solder joints. Zimachepetsa bwino mapangidwe a ming'alu ndikuletsa kufalikira kwa ming'alu yomwe ilipo, kuonetsetsa kudalirika kwa nthawi yaitali kwa phukusi.

Chinthu chinanso chofunika kwambiri cha underfill epoxy ndi kuthekera kwake kupititsa patsogolo kutentha kwa zipangizo za semiconductor. Kuwonongeka kwa kutentha kumakhala kodetsa nkhawa kwambiri chifukwa zida zamagetsi zimacheperachepera ndikuwonjezera mphamvu, ndipo kutentha kwambiri kumatha kusokoneza magwiridwe antchito ndi kudalirika kwa chip cha semiconductor. Underfill epoxy imakhala ndi matenthedwe abwino kwambiri opangira matenthedwe, kulola kuti isunthire bwino kutentha kuchokera ku chip ndikugawa mu phukusi lonse. Izi zimathandiza kusunga kutentha kwabwino kwa ntchito ndikuletsa malo omwe ali ndi malo otentha kwambiri, potero kumapangitsa kuti chipangizochi chisamalidwe bwino.

Underfill epoxy imatetezanso ku chinyezi ndi zowononga. Kulowa kwa chinyezi kungayambitse dzimbiri, kutayikira kwamagetsi, komanso kukula kwa zinthu zoyendetsera zinthu, zomwe zimapangitsa kuti chipangizocho chisagwire bwino ntchito. Underfill epoxy imakhala ngati chotchinga, kusindikiza malo osatetezeka komanso kuteteza chinyezi kulowa phukusi. Zimaperekanso chitetezo ku fumbi, dothi, ndi zonyansa zina zomwe zingasokoneze mphamvu yamagetsi a chipangizo cha semiconductor. Poteteza chip ndi kulumikizana kwake, underfill epoxy imatsimikizira kudalirika kwanthawi yayitali komanso magwiridwe antchito a chipangizocho.

Kuphatikiza apo, epoxy yodzaza pang'ono imathandizira kuti miniaturization ipangidwe mu semiconductor. Ndi kufunidwa kosalekeza kwa zida zing'onozing'ono komanso zophatikizika, epoxy yodzaza pang'ono imalola kugwiritsa ntchito njira zopangira ma flip-chip ndi chip-scale. Njirazi zimaphatikizapo kuyika chip mwachindunji pagawo la phukusi, kuchotsa kufunika kolumikiza mawaya ndikuchepetsa kukula kwa phukusi. Underfill epoxy imapereka chithandizo chokhazikika ndikusunga kukhulupirika kwa mawonekedwe a chip-substrate, zomwe zimathandiza kukhazikitsidwa bwino kwa matekinoloje apamwambawa.

Momwe Underfill Epoxy Amathetsera Zovuta

Kupaka kwa Semiconductor kumagwira ntchito yofunika kwambiri pakugwiritsa ntchito zida zamagetsi, kudalirika, komanso moyo wautali. Zimaphatikizapo kuyika ma ecapsulating integrated circuits (ICs) m'mabokosi otetezera, kupereka malumikizano amagetsi, ndi kutaya kutentha komwe kumapangidwa panthawi yogwira ntchito. Komabe, kuyika kwa semiconductor kumakumana ndi zovuta zingapo, kuphatikiza kupsinjika kwamafuta ndi tsamba lankhondo, zomwe zingakhudze kwambiri magwiridwe antchito ndi kudalirika kwa zida zomwe zidayikidwa.

Chimodzi mwazovuta zazikulu ndi kupsinjika kwa kutentha. Mabwalo ophatikizidwa amatulutsa kutentha panthawi yogwira ntchito, ndipo kutaya kosakwanira kumatha kuwonjezera kutentha mkati mwa phukusi. Kusiyanasiyana kwa kutentha kumeneku kumabweretsa kupsinjika kwa kutentha pamene zipangizo zosiyanasiyana mkati mwa phukusi zimakula ndikugwirizanitsa pamitengo yosiyana. Kukula kopanda yunifolomu ndi kutsika kungayambitse kupsinjika kwamakina, kumabweretsa kulephera kwa mgwirizano wa solder, delamination, ndi ming'alu. Kupsinjika kwamafuta kumatha kusokoneza kukhulupirika kwamagetsi ndi makina a phukusi, pamapeto pake kumakhudza magwiridwe antchito ndi kudalirika kwa chipangizocho.

Warpage ndi vuto lina lofunikira pakuyika kwa semiconductor. Warpage amatanthauza kupindika kapena kupindika kwa gawo lapansi la phukusi kapena phukusi lonse. Zitha kuchitika panthawi yolongedza katundu kapena chifukwa cha kupsinjika kwa kutentha. Warpage makamaka chifukwa cha kusagwirizana kwa coefficient of thermal expansion (CTE) pakati pa zida zosiyanasiyana mu phukusi. Mwachitsanzo, CTE ya silicon kufa, gawo lapansi, ndi nkhungu pawiri akhoza kusiyana kwambiri. Zikasintha kutentha, zidazi zimakula kapena kukhazikika pamitengo yosiyana, zomwe zimapangitsa kuti pakhale nkhondo.

Warpage imabweretsa zovuta zingapo pamaphukusi a semiconductor:

1. Zingayambitse kupsinjika maganizo, kuonjezera mwayi wa kulephera kwa makina ndi kuchepetsa kudalirika kwa bokosi.
2. Warpage kungayambitse mavuto mu ndondomeko msonkhano, monga zimakhudza mayikidwe a phukusi ndi zigawo zina, monga kusindikizidwa dera bolodi (PCB). Kusokoneza uku kungathe kusokoneza kugwirizana kwa magetsi ndikuyambitsa zovuta zogwirira ntchito.
3. Warpage imatha kukhudza mawonekedwe onse a phukusi, zomwe zimapangitsa kuti zikhale zovuta kuphatikiza chipangizocho kukhala mawonekedwe ang'onoang'ono kapena ma PCB okhala ndi anthu ambiri.

Njira ndi njira zosiyanasiyana zimagwiritsidwa ntchito poyika semiconductor kuti athetse mavutowa. Izi zikuphatikiza kugwiritsa ntchito zida zapamwamba zofananira ndi ma CTEs kuti muchepetse kupsinjika kwamafuta ndi tsamba lankhondo. Mafanizidwe a thermo-mechanical ndi ma modeling amachitidwa kuti athe kulosera momwe phukusi limakhalira pansi pa kutentha kosiyanasiyana. Zosintha zamapangidwe, monga kuyambitsa zida zochepetsera kupsinjika ndi masanjidwe okhathamiritsa, zimayendetsedwa kuti muchepetse kupsinjika kwamafuta ndi tsamba lankhondo. Kuphatikiza apo, kupititsa patsogolo njira zopangira zopangira ndi zida kumathandizira kuchepetsa kuchitika kwa zida zankhondo panthawi yosonkhanitsa.

Ubwino wa Underfill Epoxy

Underfill epoxy ndi gawo lofunikira pakuyika kwa semiconductor komwe kumapereka maubwino angapo. Zinthu zapaderazi za epoxy zimagwiritsidwa ntchito pakati pa semiconductor chip ndi gawo lapansi la phukusi, kupereka kulimbitsa kwamakina ndikuthana ndi zovuta zosiyanasiyana. Nawa maubwino ena ofunikira a epoxy osadzaza:

1. Kudalirika Kwamakina Okwezeka: Chimodzi mwamaubwino a underfill epoxy ndi kuthekera kwake kopititsa patsogolo kudalirika kwamakina a semiconductor phukusi. Underfill epoxy imapanga mgwirizano wogwirizana womwe umapangitsa kukhulupirika kwadongosolo lonse podzaza mipata ndi zotuluka pakati pa chip ndi gawo lapansi. Izi zimathandiza kupewa kugunda kwa phukusi, kumachepetsa chiopsezo cha kulephera kwamakina, ndikuwonjezera kukana kupsinjika kwakunja monga kugwedezeka, kugwedezeka, ndi njinga zamatenthedwe. Kudalirika kwamakina kumawonjezera kukhazikika kwazinthu komanso moyo wautali wa chipangizocho.
2. Kuwonongeka kwa Kupsinjika kwa Matenthedwe: Kudzaza epoxy kumathandizira kuthetsa kupsinjika kwamafuta mkati mwa phukusi. Mabwalo ophatikizika amatulutsa kutentha panthawi yogwira ntchito, ndipo kutayika kosakwanira kungayambitse kusiyana kwa kutentha mkati mwa chidebecho. Zomwe zili pansi pa epoxy, zomwe zimakhala ndi mphamvu zochepa zowonjezera kutentha (CTE) poyerekeza ndi chip ndi zipangizo zapansi, zimakhala ngati buffer layer. Imayamwa kupsinjika kwamakina komwe kumabwera chifukwa cha kupsinjika kwamafuta, kuchepetsa chiopsezo cha kulephera kwa mgwirizano wa solder, delamination, ndi ming'alu. Pochotsa kupsinjika kwamafuta, epoxy yodzaza kwambiri imathandizira kusunga kukhulupirika kwamagetsi ndi makina.
3. Kukhathamiritsa Kwamagetsi: Kudzaza kwa epoxy kumakhudza magwiridwe antchito amagetsi a zida za semiconductor. Zinthu za epoxy zimadzaza mipata pakati pa chip ndi gawo lapansi, kuchepetsa mphamvu ya parasitic ndi inductance. Izi zimabweretsa kukhulupirika kwa ma siginecha, kutayika kwa ma siginecha, komanso kulumikizana kwamagetsi pakati pa chip ndi phukusi lonse. Zotsatira zochepetsedwa za parasitic zimathandizira kuti magetsi azigwira bwino ntchito, kukwera mtengo kwa data, komanso kudalirika kwa chipangizocho. Kuonjezera apo, epoxy yodzaza pansi imapereka chitetezo ndi chitetezo ku chinyezi, zowonongeka, ndi zinthu zina zachilengedwe zomwe zingawononge mphamvu zamagetsi.
4. Kutsitsimula Kupsinjika ndi Msonkhano Wotukuka: Underfill epoxy imakhala ngati njira yochepetsera nkhawa panthawi ya msonkhano. Zinthu za epoxy zimalipira kusagwirizana kwa CTE pakati pa chip ndi gawo lapansi, kuchepetsa kupsinjika kwamakina pakusintha kwa kutentha. Izi zimapangitsa kuti msonkhano ukhale wodalirika komanso wogwira ntchito bwino, kuchepetsa chiopsezo cha kuwonongeka kwa phukusi kapena kusokoneza. Kugawa kwapang'onopang'ono komwe kumaperekedwa ndi underfill epoxy kumathandizanso kutsimikizira kulumikizana koyenera ndi zigawo zina pa bolodi losindikizidwa (PCB) ndikuwongolera zokolola za msonkhano wonse.
5. Miniaturization ndi Form Factor Optimization: Underfill epoxy imathandizira kuti pakhale maphukusi a semiconductor ndi kukhathamiritsa kwa mawonekedwe. Popereka chilimbikitso chokhazikika komanso kuchepetsa nkhawa, epoxy yodzaza pansi imalola kupanga ndi kupanga zing'onozing'ono, zowonda komanso zophatikizika. Izi ndizofunikira kwambiri pamapulogalamu monga zida zam'manja ndi zamagetsi zovala, pomwe malo amakhala okwera mtengo. Kutha kukhathamiritsa zinthu zama fomu ndikukwaniritsa kachulukidwe kazinthu zambiri kumathandizira kuti pakhale zida zamagetsi zapamwamba kwambiri.

Mitundu ya Underfill Epoxy

Mitundu ingapo ya ma epoxy formulations a underfill epoxy amapezeka mu semiconductor package, iliyonse idapangidwa kuti ikwaniritse zofunikira zenizeni ndikuthana ndi zovuta zosiyanasiyana. Nayi mitundu yomwe imagwiritsidwa ntchito kwambiri ya underfill epoxy:

1. Capillary Underfill Epoxy: Capillary underfill epoxy ndiye mtundu wachikhalidwe komanso wogwiritsidwa ntchito kwambiri. Epoxy yotsika kwambiri imadutsa mumpata pakati pa chip ndi gawo lapansi kudzera mu capillary action. Capillary underfill nthawi zambiri imaperekedwa m'mphepete mwa chip, ndipo phukusi likatenthedwa, epoxy imayenderera pansi pa chip, ndikudzaza ma voids. Mtundu uwu wa underfill ndi woyenera mapaketi okhala ndi mipata yaying'ono ndipo amapereka kulimbitsa bwino kwamakina.
2. No-Flow Underfill Epoxy: No-flow underfill epoxy ndi mawonekedwe apamwamba kwambiri omwe samayenda panthawi yakuchiritsa. Amagwiritsidwa ntchito ngati epoxy yokonzedweratu kapena ngati filimu pakati pa chip ndi gawo lapansi. No-flow underfill epoxy ndi yothandiza makamaka pamaphukusi a flip-chip, pomwe ma solder amalumikizana mwachindunji ndi gawo lapansi. Amathetsa kufunika kwa capillary otaya ndi amachepetsa chiopsezo solder olowa kuwonongeka pa msonkhano.
3. Wafer-Level Underfill (WLU): Wafer-level underfill ndi underfill epoxy yomwe imagwiritsidwa ntchito pamlingo wawafa tchipisi tating'ono tisanatchulidwe. Zimaphatikizapo kugawira zinthu zodzaza pansi pamtunda wonse ndikuchiritsa. Wafer-level underfill imapereka maubwino angapo, kuphatikiza kuphimba kudzaza yunifolomu, kuchepetsa nthawi yophatikizira, komanso kuwongolera njira. Amagwiritsidwa ntchito kwambiri popanga zida zazing'ono zazing'ono.
4. Molded Underfill (MUF): Kusungunula kopangidwa ndi underfill epoxy komwe kumagwiritsidwa ntchito popanga encapsulation. Zomwe zimadzaza pansi zimaperekedwa ku gawo lapansi, ndiyeno chip ndi gawo lapansi zimakutidwa ndi nkhungu. Pakuumba, epoxy imayenda ndikudzaza kusiyana pakati pa chip ndi gawo lapansi, kupereka underfill ndi encapsulation mu sitepe imodzi. Kuwumbidwa underfill kumapereka kulimbitsa kwamakina kwabwino komanso kumapangitsa kuti msonkhano ukhale wosalira zambiri.
5. Non-Conductive Underfill (NCF): Non-conductive underfill epoxy amapangidwa makamaka kuti apereke kudzipatula kwamagetsi pakati pa zolumikizira zogulitsira pa chip ndi gawo lapansi. Lili ndi ma insulating fillers kapena zowonjezera zomwe zimalepheretsa magetsi. NCF imagwiritsidwa ntchito m'malo omwe kuchepa kwamagetsi pakati pa ma solder oyandikana ndi nkhawa. Amapereka kulimbitsa kwamakina komanso kudzipatula kwamagetsi.
6. Thermally Conductive Underfill (TCU): Thermally conductive underfill underfill epoxy idapangidwa kuti ipititse patsogolo kuthekera kwa kutentha kwa phukusi. Lili ndi zodzaza ndi thermally conductive, monga particles za ceramic kapena zitsulo, zomwe zimapangitsa kuti matenthedwe apangidwe azinthu zodzaza pansi. TCU imagwiritsidwa ntchito m'malo omwe kutentha kwabwino ndikofunikira, monga zida zamphamvu kwambiri kapena zomwe zimagwira ntchito m'malo otentha kwambiri.

Izi ndi zitsanzo zochepa chabe za mitundu yosiyanasiyana ya underfill epoxy yomwe imagwiritsidwa ntchito popanga semiconductor. Kusankhidwa kwa epoxy yoyenera yodzaza pansi kumatengera zinthu monga kapangidwe ka phukusi, dongosolo la msonkhano, zofunikira zamatenthedwe, ndi malingaliro amagetsi. Epoxy iliyonse yodzaza pansi imapereka maubwino ake ndipo imapangidwa kuti ikwaniritse zosowa zapadera zamapulogalamu osiyanasiyana.

Capillary Underfill: Low viscosity ndi High Kudalirika

Capillary underfill imatanthawuza njira yomwe imagwiritsidwa ntchito mumakampani opanga ma semiconductor kuti apititse patsogolo kudalirika kwa zida zamagetsi. Zimaphatikizapo kudzaza mipata pakati pa chipangizo cha microelectronic ndi phukusi lozungulira ndi zinthu zamadzimadzi zotsika kwambiri, zomwe zimakhala ndi epoxy-based resin. Zinthu zosadzaza izi zimapereka chithandizo chokhazikika, zimathandizira kutenthedwa kwamafuta, ndikuteteza chip kupsinjika kwamakina, chinyezi, ndi zinthu zina zachilengedwe.

Chimodzi mwazinthu zofunika kwambiri za capillary underfill ndi kutsika kwake kukhuthala. Zomwe zimapangidwira zimapangidwira kuti zikhale ndi kachulukidwe kakang'ono, zomwe zimalola kuti zizitha kuyenda mosavuta mumipata yopapatiza pakati pa chip ndi phukusi panthawi ya kudzaza. Izi zimawonetsetsa kuti zinthu zomwe sizingakwaniritsidwe zitha kulowa bwino ndikudzaza ma voids onse ndi mipata ya mpweya, kuchepetsa chiopsezo chopanga zopanda pake ndikuwongolera kukhulupirika kwathunthu kwa mawonekedwe a chip-package.

Zida zotsika kwambiri za capillary underfill zimaperekanso maubwino ena angapo. Choyamba, amathandizira kuyendetsa bwino kwa zinthu zomwe zili pansi pa chip, zomwe zimabweretsa kuchepetsedwa kwa nthawi yoyendetsera ntchito ndikuwonjezera kutulutsa kwazinthu. Izi ndizofunikira makamaka m'malo opanga zinthu zambiri zomwe nthawi ndi ndalama ndizofunikira kwambiri.

Kachiwiri, otsika mamasukidwe akayendedwe chimathandiza wetting bwino ndi adhesion katundu wa underfill zakuthupi. Zimalola kuti zinthuzo zifalikire mofanana ndikupanga zomangira zolimba ndi chip ndi phukusi, ndikupanga encapsulation yodalirika komanso yolimba. Izi zimawonetsetsa kuti chip ndi chotetezedwa ku zovuta zamakina monga kuyendetsa njinga, kugwedezeka, ndi kugwedezeka.

Chinthu chinanso chofunikira cha kuchepa kwa capillary ndi kudalirika kwawo kwakukulu. Zida zochepetsera kachulukidwe kakang'ono zimapangidwira makamaka kuti ziwonetse kukhazikika kwamafuta, mphamvu zamagetsi zamagetsi, komanso kukana chinyezi ndi mankhwala. Makhalidwewa ndi ofunikira pakuwonetsetsa kuti zida zamagetsi zomwe zili m'matumba zimagwira ntchito kwanthawi yayitali komanso kudalirika, makamaka pamapulogalamu omwe amafunikira kwambiri monga zamagalimoto, zakuthambo, ndi matelefoni.

Kuphatikiza apo, zida za capillary underfill zidapangidwa kuti zikhale ndi mphamvu zamakina apamwamba komanso kumamatira kwambiri kuzinthu zosiyanasiyana zapansi panthaka, kuphatikiza zitsulo, zoumba, ndi zinthu organic zomwe zimagwiritsidwa ntchito popanga semiconductor. Izi zimathandiza kuti zinthu zomwe sizidzadzaza pansi zizikhala ngati chotchingira kupsinjika, kutengera bwino ndikuchotsa zovuta zamakina zomwe zimapangidwira panthawi yogwira ntchito kapena kukhudzana ndi chilengedwe.

 

No-Flow Underfill: Kudzipatsa Yekha ndi Kupititsa Patsogolo

No-flow underfill njira yapadera yomwe imagwiritsidwa ntchito mumakampani opanga ma semiconductor kuti apititse patsogolo kudalirika komanso kuchita bwino kwa zida zamagetsi. Mosiyana ndi ma capillary underfill, omwe amadalira kuyenda kwa zinthu zotsika kachulukidwe kakukhuthala, kutsika kwapang'onopang'ono kumagwiritsa ntchito njira yodzipangira yokhayokha yokhala ndi ma viscosity apamwamba. Njirayi ili ndi ubwino wambiri, kuphatikizapo kudzigwirizanitsa, kupititsa patsogolo, komanso kudalirika.

Chimodzi mwazinthu zofunika kwambiri pakusadzaza kwapang'onopang'ono ndi kuthekera kwake kodzipatsa. Zomwe zimagwiritsidwa ntchito popanga ndondomekoyi zimapangidwira ndi viscosity yapamwamba, yomwe imalepheretsa kuyenda momasuka. M'malo mwake, zinthu zodzaza pansi zimaperekedwa pa mawonekedwe a chip-package mowongolera. Kugawa kolamuliridwa kumeneku kumathandizira kuyika bwino kwa zinthu zomwe sizidzadzaza, kuonetsetsa kuti zikugwiritsidwa ntchito kumadera omwe akufunidwa popanda kusefukira kapena kufalikira mosalekeza.

Chikhalidwe chodzipatulira chokha cha kuperewera kwa madzi kumapereka ubwino wambiri. Choyamba, zimalola kudzikonza nokha kwa zinthu zomwe sizingakwaniritsidwe. Pamene underfill ikuperekedwa, mwachibadwa imadzigwirizanitsa ndi chip ndi phukusi, kudzaza mipata ndi voids mofanana. Izi zimathetsa kufunikira kwa kuyika bwino ndi kuyanjanitsa kwa chip panthawi yocheperako, kupulumutsa nthawi ndi khama popanga.

Kachiwiri, mawonekedwe odzipatulira okha omwe amalephera kutulutsa amathandizira kutulutsa kwakukulu pakupanga. Njira yoperekera imatha kukhala yokha, kulola kugwiritsa ntchito mwachangu komanso kosasintha kwa zinthu zocheperako pamatchipisi angapo nthawi imodzi. Izi zimathandizira kupanga bwino ndikuchepetsa ndalama zopangira, zomwe zimapangitsa kuti zikhale zopindulitsa kwambiri m'malo opanga zinthu zambiri.

Kuphatikiza apo, zida zosefera zopanda madzi zimapangidwira kuti zipereke kudalirika kwakukulu. Zida zotsika kwambiri za viscosity zimapereka kukana bwino kwa njinga zamatenthedwe, kupsinjika kwamakina, ndi zinthu zachilengedwe, kuwonetsetsa kuti zida zamagetsi zomwe zapakidwa zikugwira ntchito kwa nthawi yayitali. Zidazi zikuwonetsa kukhazikika kwamafuta, mphamvu zamagetsi zamagetsi, komanso kukana chinyezi ndi mankhwala, zomwe zimathandizira kudalirika kwathunthu kwa zida.

Kuphatikiza apo, zida zodzaza ndi ma viscosity apamwamba zomwe zimagwiritsidwa ntchito mosasunthika zawonjezera mphamvu zamakina ndi zomatira. Amapanga zomangira zolimba ndi chip ndi phukusi, zimatengera bwino ndikuchotsa zovuta zamakina zomwe zimapangidwira panthawi yogwira ntchito kapena kukhudzana ndi chilengedwe. Izi zimathandiza kuteteza chipangizochi kuti chisawonongeke komanso chimapangitsa kuti chipangizocho chisavutike ndi kugwedezeka kwakunja ndi kugwedezeka.

Molded Underfill: Chitetezo Chapamwamba ndi Kuphatikiza

Molded underfill ndi njira yotsogola yomwe imagwiritsidwa ntchito mumakampani opanga ma semiconductor kuti apereke chitetezo chokwanira komanso kuphatikiza kwa zida zamagetsi. Zimaphatikizapo kuyika chip chonse ndi phukusi lozungulira ndi nkhungu yokhala ndi zinthu zodzaza. Njirayi imapereka zabwino zambiri zokhudzana ndi chitetezo, kuphatikiza, komanso kudalirika kwathunthu.

Ubwino wina wofunikira wa underfill wowumbidwa ndi kuthekera kwake kupereka chitetezo chokwanira cha chip. Chophimba cha nkhungu chomwe chimagwiritsidwa ntchito pochita izi chimakhala ngati chotchinga cholimba, chotsekereza chip chonse ndi phukusi mu chipolopolo choteteza. Izi zimapereka chitetezo chokwanira kuzinthu zachilengedwe monga chinyezi, fumbi, ndi zowonongeka zomwe zingakhudze ntchito ndi kudalirika kwa chipangizocho. The encapsulation imathandizanso kupewa chip kupsinjika kwamakina, kuyendetsa njinga zamatenthedwe, ndi mphamvu zina zakunja, kuonetsetsa kukhazikika kwake kwanthawi yayitali.

Kuphatikiza apo, kudzaza kowumbidwa kumathandizira kuphatikizika kwakukulu mkati mwa phukusi la semiconductor. Zomwe zimapangidwira zimasakanizidwa mwachindunji mu nkhungu, kulola kusakanikirana kosasunthika kwa underfill ndi encapsulation process. Kuphatikizika kumeneku kumathetsa kufunikira kwa sitepe yocheperako yosiyana, kufewetsa njira yopangira ndikuchepetsa nthawi yopangira ndi ndalama. Imawonetsetsanso kugawidwa kosasunthika komanso kofananako pa phukusi lonse, kuchepetsa voids ndikuwonjezera kukhulupirika kwadongosolo.

Kuphatikiza apo, underfill yowumbidwa imapereka zinthu zabwino kwambiri zochotsera matenthedwe. Gulu la nkhungu limapangidwa kuti likhale ndi matenthedwe apamwamba kwambiri, kuti lizitha kusamutsa kutentha kutali ndi chip bwino. Izi ndizofunikira kwambiri pakusunga kutentha kwabwino kwa chipangizocho ndikupewa kutenthedwa, zomwe zingayambitse kuwonongeka kwa magwiridwe antchito komanso kudalirika. Kuwonjezeka kwa kutentha kwapang'onopang'ono kumapangitsa kuti chipangizo chamagetsi chikhale chodalirika komanso kukhala ndi moyo wautali.

Kuphatikiza apo, kudzaza kowumbidwa kumathandizira kuti miniaturization ichuluke komanso kukhathamiritsa kwa mawonekedwe. Njira ya encapsulation imatha kukonzedwa kuti igwirizane ndi kukula kwake ndi mawonekedwe osiyanasiyana, kuphatikiza zovuta za 3D. Kusinthasintha uku kumathandizira kuphatikiza tchipisi tambirimbiri ndi zida zina kukhala phukusi lophatikizana, lopanda danga. Kutha kukwaniritsa magawo apamwamba ophatikizika popanda kusokoneza kudalirika kumapangitsa kuti kusungunuka kukhala kofunikira kwambiri pamapulogalamu omwe kukula ndi zolemetsa ndizofunikira kwambiri, monga zida zam'manja, zobvala, ndi zamagetsi zamagalimoto.

Phukusi la Chip Scale (CSP) Zosakwanira: Miniaturization ndi High Density

Chip Scale Package (CSP) underfill ndi ukadaulo wofunikira kwambiri womwe umathandizira kuti miniaturization ndi kuphatikiza zida zamagetsi zochulukirapo. Pamene zipangizo zamagetsi zikupitiriza kuchepa kukula pamene zikupereka ntchito zowonjezereka, CSP imakwaniritsa ntchito yofunika kwambiri powonetsetsa kudalirika ndi kugwira ntchito kwa zipangizozi.

CSP ndi ukadaulo wolongedza womwe umalola kuti chip cha semiconductor chikhazikitsidwe mwachindunji pagawo laling'ono kapena losindikizidwa (PCB) osafunikira phukusi lina. Izi zimathetsa kufunika kwa pulasitiki yachikhalidwe kapena chidebe cha ceramic, kuchepetsa kukula ndi kulemera kwa chipangizocho. CSP imakwaniritsa njira yomwe chinthu chamadzimadzi kapena encapsulant chimagwiritsidwa ntchito kudzaza kusiyana pakati pa chip ndi gawo lapansi, kupereka chithandizo chamakina ndi kuteteza chip kuzinthu zachilengedwe monga chinyezi ndi kupsinjika kwamakina.

Miniaturization imatheka kudzera mu CSP underfill pochepetsa mtunda pakati pa chip ndi gawo lapansi. Zomwe zimadzaza pansi zimadzaza mpata wopapatiza pakati pa chip ndi gawo lapansi, kupanga chomangira cholimba ndikuwongolera kukhazikika kwamakina kwa chip. Izi zimalola zipangizo zing'onozing'ono ndi zowonda, zomwe zimapangitsa kuti zitheke kunyamula ntchito zambiri pamalo ochepa.

Kuphatikizana kwapamwamba kwambiri ndi mwayi wina wa CSP underfill. Pochotsa kufunikira kwa phukusi lapadera, CSP imathandiza kuti chipcho chiyike pafupi ndi zigawo zina pa PCB, kuchepetsa kutalika kwa kugwirizana kwa magetsi ndikuwongolera kukhulupirika kwa chizindikiro. Zomwe zimadzaza pansi zimagwiranso ntchito ngati chowongolera chotenthetsera, kutulutsa bwino kutentha kopangidwa ndi chip. Kuthekera koyang'anira kutentha kumeneku kumalola kuchulukitsitsa kwamphamvu kwamphamvu, kupangitsa kuphatikizika kwa tchipisi zovuta komanso zamphamvu mu zida zamagetsi.

Zida zodzaza pansi za CSP ziyenera kukhala ndi mawonekedwe apadera kuti zikwaniritse zofunikira za miniaturization ndi kuphatikiza kwapamwamba kwambiri. Ayenera kukhala otsika mamasukidwe akayendedwe kuti atsogolere kudzazidwa kwa mipata yopapatiza, komanso otaya katundu kuonetsetsa yunifolomu Kuphunzira ndi kuthetsa voids. Zipangizozi ziyeneranso kukhala zomatira bwino ku chip ndi gawo lapansi, kupereka chithandizo cholimba cha makina. Kuphatikiza apo, amayenera kuwonetsa matenthedwe apamwamba kwambiri kuti asamutsire kutentha kutali ndi chip bwino.

Wafer-Level CSP Underfill: Yotsika mtengo komanso Yokolola Kwambiri

Phukusi la Wafer-level Chip Scale Package (WLCSP) ndi njira yopangira zinthu zotsika mtengo komanso zokolola zambiri zomwe zimapereka maubwino angapo pakupanga bwino komanso mtundu wazinthu zonse. WLCSP underfill ntchito underfill zinthu tchipisi angapo nthawi imodzi akadali mu mawonekedwe yopyapyala pamaso iwo singulated mu phukusi payekha. Njirayi imapereka maubwino ambiri okhudzana ndi kuchepetsa mtengo, kuwongolera njira, komanso zokolola zambiri.

Chimodzi mwazabwino za WLCSP underfill ndi mtengo wake. Kuyika zinthu zodzaza pansi pamlingo wawafa kumapangitsa kuti ma CD apangidwe azikhala osavuta komanso othandiza. Zinthu zosadzazidwa pang'ono zimaperekedwa pa chowotcha pogwiritsa ntchito njira yoyendetsedwa ndi makina, kuchepetsa zinyalala zakuthupi ndikuchepetsa ndalama zogwirira ntchito. Kuphatikiza apo, kuchotseratu kasamalidwe ka phukusi la munthu aliyense ndi kuyanjanitsa kumachepetsa nthawi yonse yopanga komanso zovuta zake, zomwe zimapangitsa kuti pakhale ndalama zambiri poyerekeza ndi njira zamapaketi zachikhalidwe.

Kuphatikiza apo, WLCSP underfill imapereka njira zowongolera bwino komanso zokolola zambiri. Popeza kuti zinthu zodzaza pansi zimayikidwa pamlingo wawafa, zimathandizira kuwongolera bwino njira yoperekera, kuwonetsetsa kuti chiphuphu chilichonse chili pamtengowo chizikhala chokhazikika komanso chofananira. Izi zimachepetsa chiopsezo cha voids kapena kudzaza kosakwanira, zomwe zingayambitse kudalirika. Kuthekera koyang'ana ndikuyesa mtundu wa underfill pamlingo wawafer kumathandizanso kuzindikira zolakwika kapena kusiyanasiyana kwazinthu, zomwe zimathandiza kukonza nthawi yake ndikuchepetsa mwayi wapaketi zolakwika. Zotsatira zake, WLCSP underfill imathandizira kukwaniritsa zokolola zapamwamba komanso mtundu wazinthu zonse.

Njira yophatikizira yophatikizika imathandiziranso kuwongolera kwamatenthedwe ndi makina. The underfill zinthu ntchito WLCSP zambiri-otsika mamasukidwe akayendedwe, capillary-oyenda zinthu zimene efficiently kudzaza mipata yopapatiza pakati tchipisi ndi yopyapyala. Izi zimapereka chithandizo cholimba cha makina ku tchipisi, kukulitsa kukana kwawo kupsinjika kwamakina, kugwedezeka, komanso kutentha kwa njinga. Kuonjezera apo, zinthu zomwe zimadzaza pansi zimagwira ntchito ngati kondakitala wamafuta, zomwe zimathandizira kutenthedwa kwa kutentha komwe kumapangidwa ndi tchipisi, motero kuwongolera kasamalidwe kamafuta ndikuchepetsa kuopsa kwa kutentha.

Flip Chip Underfill: High I/O Density and Performance

Flip chip underfill ndi ukadaulo wofunikira kwambiri womwe umathandizira kachulukidwe kachulukidwe kakulowetsa/kutulutsa (I/O) ndikuchita mwapadera pazida zamagetsi. Imakhala ndi gawo lofunikira pakukulitsa kudalirika ndi magwiridwe antchito a flip-chip mapaketi, omwe amagwiritsidwa ntchito kwambiri pamapulogalamu apamwamba a semiconductor. Nkhaniyi iwunikanso tanthauzo la flip chip underfill ndi momwe zimakhudzira kukwaniritsa kachulukidwe ka I/O ndi magwiridwe antchito.

Ukadaulo wa Flip chip umaphatikizapo kulumikizidwa kwamagetsi mwachindunji kwa gawo lophatikizika (IC) kapena semiconductor kufa ku gawo lapansi, kuchotsa kufunikira kwa mawaya. Izi zimabweretsa phukusi lophatikizana komanso logwira ntchito bwino, popeza mapepala a I / O ali pansi pa kufa. Komabe, kuyika kwa flip-chip kumapereka zovuta zapadera zomwe ziyenera kuthetsedwa kuti zitsimikizire kuti zikuyenda bwino komanso kudalirika.

Chimodzi mwazovuta kwambiri pakuyika kwa chip chip ndikuletsa kupsinjika kwamakina ndi kusagwirizana kwamafuta pakati pa kufa ndi gawo lapansi. Panthawi yopanga ndi ntchito yotsatira, kusiyana kwa ma coefficients of thermal expansion (CTE) pakati pa kufa ndi gawo lapansi kungayambitse kupsinjika kwakukulu, zomwe zimapangitsa kuwonongeka kwa ntchito kapena kulephera. Flip chip underfill ndi chinthu choteteza chomwe chimatsekereza chip, kupereka chithandizo chamakina komanso mpumulo wopsinjika. Imagawa bwino kupsinjika komwe kumachitika panthawi yanjinga yotentha ndikulepheretsa kuti zisakhudze zolumikizana zolimba.

Kuchuluka kwa I / O ndikofunikira kwambiri pazida zamakono zamakono, pomwe mawonekedwe ang'onoang'ono ndi magwiridwe antchito ndizofunikira. Flip chip underfill imathandizira kachulukidwe ka I/O kapamwamba popereka kutsekemera kwamagetsi kwapamwamba komanso kuthekera kowongolera matenthedwe. Zomwe zimadzaza pansi zimadzaza kusiyana pakati pa kufa ndi gawo lapansi, kupanga mawonekedwe olimba ndikuchepetsa chiwopsezo cha mabwalo amfupi kapena kutayikira kwamagetsi. Izi zimapangitsa kuti ma I/O atalikirane kwambiri, zomwe zimapangitsa kuti kachulukidwe ka I/O achuluke popanda kusiya kudalirika.

Komanso, flip chip underfill imathandizira kuti magetsi aziyenda bwino. Imachepetsa ma parasitic amagetsi pakati pa kufa ndi gawo lapansi, kuchepetsa kuchedwa kwa ma siginecha ndikukulitsa kukhulupirika kwa ma sign. Zomwe zimadzaza pansi zimawonetsanso zinthu zabwino kwambiri zamatenthedwe, zimachotsa bwino kutentha kopangidwa ndi chip panthawi yogwira ntchito. Kutentha kwabwino kumatsimikizira kuti kutentha kumakhalabe m'malire ovomerezeka, kuteteza kutentha ndi kusunga ntchito yabwino.

Kupita patsogolo kwa zida za flip chip underfill kwathandizira kuchulukira kwa I/O komanso magwiridwe antchito. Nanocomposite underfills, mwachitsanzo, amawonjezera ma nanoscale fillers kuti apititse patsogolo matenthedwe komanso mphamvu zamakina. Izi zimathandiza kuti kutentha kuwonongeke komanso kudalirika, zomwe zimathandiza kuti zipangizo zogwirira ntchito kwambiri.

Ball Grid Array (BGA) Underfill: High Thermal and Mechanical Performance

Ball Grid Array (BGA) imakwaniritsa ukadaulo wofunikira womwe umapereka magwiridwe antchito apamwamba komanso amakina pazida zamagetsi. Zimagwira ntchito yofunika kwambiri pakukulitsa kudalirika ndi magwiridwe antchito a phukusi la BGA, lomwe limagwiritsidwa ntchito kwambiri pazinthu zosiyanasiyana. M'nkhaniyi, tiwona kufunikira kwa BGA underfill ndi momwe zimakhudzira kuchita bwino kwamatenthedwe ndi makina.

Ukadaulo wa BGA umaphatikizapo kapangidwe ka phukusi komwe gawo lophatikizika (IC) kapena kufa kwa semiconductor kumayikidwa pagawo laling'ono, ndipo kulumikizana kwamagetsi kumapangidwa kudzera mumipira yambiri yogulitsa yomwe ili pansi pa phukusi. BGA underfills zinthu anagawira kusiyana pakati kufa ndi gawo lapansi, encapsulating mipira solder ndi kupereka mawotchi thandizo ndi chitetezo kwa msonkhano.

Chimodzi mwazovuta kwambiri pakuyika kwa BGA ndikuwongolera kupsinjika kwamafuta. Panthawi yogwira ntchito, IC imapanga kutentha, ndipo kuwonjezereka kwa kutentha ndi kutsika kungayambitse kupanikizika kwakukulu pazitsulo zogulitsira zomwe zimagwirizanitsa kufa ndi gawo lapansi. BGA imakwaniritsa gawo lofunikira pakuchepetsa kupsinjika kumeneku popanga mgwirizano wolimba ndi kufa ndi gawo lapansi. Zimagwira ntchito ngati chotchinga kupsinjika, kutengera kufalikira kwa matenthedwe ndi kutsika ndikuchepetsa kupsinjika pamagulu a solder. Izi zimathandiza kusintha phukusi lonse kudalirika ndi kuchepetsa chiopsezo solder olowa kulephera.

Chinthu chinanso chovuta kwambiri pa kudzaza kwa BGA ndikuthekera kwake kupititsa patsogolo magwiridwe antchito a phukusi. Maphukusi a BGA nthawi zambiri amakumana ndi zovuta zamakina pakugwira, kusonkhana, ndi kugwira ntchito. Zomwe zimadzaza pansi zimadzaza kusiyana pakati pa kufa ndi gawo lapansi, kupereka chithandizo chamapangidwe ndi kulimbikitsanso zolumikizira zogulitsira. Izi zimakulitsa mphamvu yamakina onse agululo, ndikupangitsa kuti isagonjetse kugwedezeka kwamakina, kugwedezeka, ndi mphamvu zina zakunja. Pogawa bwino kupsinjika kwamakina, BGA underfill imathandizira kupewa kusweka kwa phukusi, delamination, kapena kulephera kwina kwamakina.

Kuchita kwapamwamba kwamafuta ndikofunikira pazida zamagetsi kuti zitsimikizire magwiridwe antchito komanso kudalirika. BGA underfill zida zidapangidwa kuti zikhale ndi mawonekedwe abwino kwambiri opangira matenthedwe. Izi zimawathandiza kuti asamutsire kutentha kutali ndi kufa ndikugawira gawo lonselo, kupititsa patsogolo kayendetsedwe ka kutentha kwa phukusi. Kutentha kogwira mtima kumathandiza kuti kutentha kukhale kochepa, kuteteza malo otentha komanso kuwonongeka kwa ntchito. Zimathandizanso kuti bokosi likhale ndi moyo wautali mwa kuchepetsa zigawozo 'kupsinjika kwa kutentha.

Kupita patsogolo kwa zida zodzaza ndi BGA kwapangitsa kuti pakhale kutentha kwambiri komanso kumakina. Mapangidwe opangidwa bwino ndi zida zodzaza, monga ma nanocomposites kapena zodzaza ndi matenthedwe apamwamba, zathandiza kuti kutentha kwabwinoko komanso mphamvu zamakina, kupititsa patsogolo magwiridwe antchito a phukusi la BGA.

Phukusi la Quad Flat (QFP) Losakwanira: Kuwerengera Kwakukulu kwa I/O ndi Kulimba

Phukusi la Quad Flat (QFP) ndi phukusi lophatikizika (IC) lomwe limagwiritsidwa ntchito kwambiri pamagetsi. Imakhala ndi masikweya kapena amakona anayi okhala ndi zowongolera zoyambira mbali zonse zinayi, zomwe zimapereka zolumikizira zambiri / zotulutsa (I/O). Kuti muwonjezere kudalirika komanso kulimba kwa mapaketi a QFP, zida zocheperako zimagwiritsidwa ntchito nthawi zambiri.

Underfill ndi chinthu choteteza chomwe chimagwiritsidwa ntchito pakati pa IC ndi gawo lapansi kuti kulimbikitsa mphamvu zamakina azitsulo zogulitsira ndikupewa kulephera koyambitsa kupsinjika. Ndikofunikira kwambiri kwa ma QFP okhala ndi ma I/O ambiri, chifukwa kuchuluka kwa maulumikizidwe kumatha kubweretsa zovuta zamakina panthawi yoyendetsa njinga yamoto komanso momwe amagwirira ntchito.

Zomwe zimagwiritsidwa ntchito pamaphukusi a QFP ziyenera kukhala ndi mawonekedwe apadera kuti zitsimikizire kulimba. Choyamba, iyenera kukhala yomatira bwino ku IC ndi gawo lapansi kuti apange chomangira cholimba ndikuchepetsa chiwopsezo cha delamination kapena detachment. Kuonjezera apo, iyenera kukhala ndi coefficient yotsika yowonjezera kutentha (CTE) kuti ifanane ndi CTE ya IC ndi gawo lapansi, kuchepetsa kusokonezeka maganizo komwe kungayambitse ming'alu kapena fractures.

Kuphatikiza apo, zinthu zocheperako ziyenera kukhala ndi mawonekedwe oyenda bwino kuti zitsimikizire kuphimba kofanana ndikudzaza kwathunthu kusiyana pakati pa IC ndi gawo lapansi. Izi zimathandizira kuchotsa voids, zomwe zimatha kufooketsa ma solder ndikuthandizira kudalirika kocheperako. Zinthuzo ziyeneranso kukhala ndi zinthu zabwino zochiritsira, zomwe zimalola kuti zipange zotchinga zolimba komanso zolimba zitatha kuzigwiritsa ntchito.

Pankhani yakulimba kwamakina, kudzaza kumayenera kukhala ndi kukameta ubweya wambiri komanso mphamvu ya peel kuti ipirire mphamvu zakunja ndikupewa kupunduka kapena kupatukana. Iyeneranso kuwonetsa kukana bwino kwa chinyezi ndi zinthu zina zachilengedwe kuti zisunge zoteteza pakapita nthawi. Izi ndizofunikira makamaka pamapulogalamu omwe phukusi la QFP likhoza kukumana ndi zovuta kapena kusinthasintha kwa kutentha.

Zida zosiyanasiyana zodzaza pansi zilipo kuti zikwaniritse zomwe mukufuna, kuphatikiza ma epoxy-based formulations. Kutengera ndi zofunikira za pulogalamuyo, zidazi zitha kuperekedwa pogwiritsa ntchito njira zosiyanasiyana, monga kuthamanga kwa capillary, jetting, kapena kusindikiza pazenera.

System-in-Package (SiP) Underfill: Integration ndi Performance

System-in-Package (SiP) ndiukadaulo wapamwamba wophatikizira wophatikizira tchipisi tating'onoting'ono ta semiconductor, zida zongokhala, ndi zinthu zina kukhala phukusi limodzi. SiP imapereka zabwino zambiri, kuphatikiza mawonekedwe ocheperako, magwiridwe antchito amagetsi, komanso magwiridwe antchito owonjezera. Kuwonetsetsa kudalirika ndi magwiridwe antchito amisonkhano ya SiP, zida zocheperako zimagwiritsidwa ntchito nthawi zambiri.

Underfill in SiP applications ndizofunikira kuti pakhale kukhazikika kwamakina ndi kulumikizana kwamagetsi pakati pazigawo zosiyanasiyana mkati mwa phukusi. Zimathandiza kuchepetsa chiopsezo cha kupsinjika maganizo, monga ming'alu ya solder kapena fractures, zomwe zingachitike chifukwa cha kusiyana kwa coefficients of thermal expansion (CTE) pakati pa zigawozo.

Kuphatikizira zigawo zingapo mu phukusi la SiP kumabweretsa zovuta zolumikizirana, zokhala ndi zida zambiri zogulitsira komanso zozungulira kwambiri. Zida zodzaza pansi zimathandizira kulimbikitsa kulumikizana uku, kukulitsa mphamvu zamakina ndi kudalirika kwa msonkhanowo. Iwo amathandiza olowa solder, kuchepetsa chiwopsezo cha kutopa kapena kuwonongeka chifukwa matenthedwe njinga kapena kupsyinjika makina.

Ponena za magwiridwe antchito amagetsi, zida zotsika pansi ndizofunikira kwambiri pakuwongolera kukhulupirika kwa ma sign ndi kuchepetsa phokoso lamagetsi. Mwa kudzaza mipata pakati pa zigawo ndi kuchepetsa mtunda pakati pawo, underfill kumathandiza kuchepetsa parasitic capacitance ndi inductance, kuloleza mofulumira ndi kothandiza kwambiri kufala chizindikiro.

Kuonjezera apo, zipangizo zochepetsera ntchito za SiP ziyenera kukhala ndi matenthedwe abwino kwambiri kuti athetse kutentha kopangidwa ndi zigawo zophatikizidwa bwino. Kutentha kwachangu ndikofunikira kuti tipewe kutenthedwa ndi kusunga kudalirika kwathunthu ndi ntchito ya msonkhano wa SiP.

Zida zodzaza pansi pamapaketi a SiP ziyenera kukhala ndi zinthu zenizeni kuti zikwaniritse izi kuphatikiza ndi magwiridwe antchito. Ayenera kukhala ndi flowability wabwino kuonetsetsa Kuphunzira wathunthu ndi kudzaza mipata pakati pa zigawo zikuluzikulu. Zomwe zimadzaza pansi ziyeneranso kukhala ndi mawonekedwe otsika-makamaka kuti alole kugawa mosavuta ndikudzaza mabowo opapatiza kapena malo ang'onoang'ono.

Kuphatikiza apo, zinthu zodzaziramo ziyenera kuwonetsa kumamatira kolimba kumalo osiyanasiyana, kuphatikiza tchipisi ta semiconductor, ma substrates, ndi ma passives, kuti atsimikizire kulumikizana kodalirika. Iyenera kukhala yogwirizana ndi zomangira zosiyanasiyana, monga magawo a organic kapena zoumba, ndikuwonetsa zinthu zamakina abwino, kuphatikiza kumeta ubweya wambiri komanso kulimba kwa peel.

Kusankha kwa zinthu zocheperako komanso njira yogwiritsira ntchito kumadalira kapangidwe ka SiP, zofunikira zamagulu, ndi njira zopangira. Njira zoperekera monga capillary flow, jetting, kapena njira zothandizidwa ndi filimu nthawi zambiri zimagwiritsa ntchito kuperewera mumisonkhano ya SiP.

Optoelectronics Underfill: Optical Alignment ndi Chitetezo

Optoelectronics underfill imaphatikizapo kutsekereza ndi kuteteza zida za optoelectronic ndikuwonetsetsa kuti zikuyenda bwino. Zida za Optoelectronic, monga ma lasers, ma photodetectors, ndi ma switch optical, nthawi zambiri zimafuna kuyanjanitsa kwamphamvu kwa zida za kuwala kuti zitheke bwino. Panthawi imodzimodziyo, amafunika kutetezedwa kuzinthu zachilengedwe zomwe zingakhudze ntchito yawo. Optoelectronics underfill imakwaniritsa zofunikira zonsezi popereka kulumikizana kwa kuwala ndi chitetezo munjira imodzi.

Kuyanjanitsa kwa Optical ndi gawo lofunikira kwambiri pakupanga zida za optoelectronic. Zimaphatikizapo kugwirizanitsa zinthu zooneka, monga ma fiber, ma waveguide, ma lens, kapena ma gratings, kuti awonetsetse kuti kuwala kumayenda bwino komanso kulandiridwa. Kuyanjanitsa bwino ndikofunikira kuti chipangizocho chizigwira ntchito kwambiri komanso kusunga kukhulupirika kwa chizindikiro. Njira zoyankhulirana zachikale zimaphatikizanso kusanja pamanja pogwiritsa ntchito kuyang'ana kowoneka kapena kuwongolera kodzipangira pogwiritsa ntchito magawo owongolera. Komabe, njirazi zimatha kutenga nthawi, zovutirapo, komanso zolakwitsa.

Optoelectronics imakwaniritsa yankho laukadaulo pophatikiza zinthu zolumikizana mwachindunji ndi zinthu zomwe sizingakwaniritsidwe. Zida zosadzaza nthawi zambiri zimakhala zamadzimadzi kapena zamadzimadzi zomwe zimatha kuyenda ndikudzaza mipata pakati pa zinthu zowoneka bwino. Powonjezera mawonekedwe a mayikidwe, monga ma microstructures kapena mafiducial marks, mkati mwa zinthu zomwe sizingakwaniritsidwe, njira yolumikizira imatha kukhala yosavuta komanso yokhazikika. Zinthuzi zimagwira ntchito ngati zitsogozo panthawi yosonkhanitsa, kuwonetsetsa kugwirizanitsa bwino kwa zigawo za kuwala popanda kufunikira kwa njira zovuta zogwirizanitsa.

Kuphatikiza pa kuyanjanitsa kwa kuwala, zida zosadzaza zimateteza zida za optoelectronic. Zida za Optoelectronic nthawi zambiri zimakumana ndi zovuta, kuphatikiza kusinthasintha kwa kutentha, chinyezi, komanso kupsinjika kwamakina. Zinthu zakunja izi zimatha kusokoneza magwiridwe antchito ndi kudalirika kwa zida pakapita nthawi. Zida zosadzaza zimagwira ntchito ngati chotchinga chotchinga, chotsekereza zigawo za kuwala ndikuziteteza ku zowononga zachilengedwe. Amaperekanso kulimbitsa kwamakina, kuchepetsa chiopsezo cha kuwonongeka chifukwa cha kugwedezeka kapena kugwedezeka.

Zida zomwe sizingakwaniritsidwe zomwe zimagwiritsidwa ntchito popanga ma optoelectronics nthawi zambiri zimapangidwira kuti zikhale ndi index yotsika ya refractive komanso kuwonekera bwino kwambiri. Izi zimatsimikizira kusokoneza kochepa ndi zizindikiro za kuwala zomwe zimadutsa pa chipangizocho. Kuphatikiza apo, amawonetsa kumamatira kwabwino ku magawo osiyanasiyana ndipo amakhala ndi ma coefficients owonjezera amafuta ochepa kuti achepetse kupsinjika kwa chipangizocho panthawi yanjinga yotentha.

Njira yodzaza pansi imaphatikizapo kugawa zinthu zomwe sizidzadzaza pa chipangizocho, kuzilola kuti ziziyenda ndikudzaza mipata pakati pa zinthu zowoneka bwino, kenako ndikuchiza kuti apange encapsulation yolimba. Kutengera ndikugwiritsa ntchito, zinthu zomwe sizingakwaniritsidwe zitha kugwiritsidwa ntchito pogwiritsa ntchito njira zosiyanasiyana, monga capillary flow, jet dispensing, kapena kusindikiza pazenera. Njira yochiritsa imatha kutheka chifukwa cha kutentha, kuwala kwa UV, kapena zonse ziwiri.

Medical Electronics Underfill: Biocompatibility ndi Kudalirika

Zamagetsi zamankhwala zimakwaniritsa njira yapadera yomwe imaphatikizapo kuyika ndi kuteteza zida zamagetsi zomwe zimagwiritsidwa ntchito pazida zamankhwala. Zipangizozi zimagwira ntchito yofunika kwambiri pazachipatala zosiyanasiyana, monga zida zoikidwiratu, zida zowunikira, zowunikira, ndi njira zoperekera mankhwala. Zamagetsi zamankhwala zikulephera kuwunikira mbali ziwiri zofunika: biocompatibility ndi kudalirika.

Biocompatibility ndichinthu chofunikira kwambiri pazida zamankhwala zomwe zimalumikizana ndi thupi la munthu. Zida zosadzaza zomwe zimagwiritsidwa ntchito mumagetsi azachipatala ziyenera kukhala zogwirizana ndi biocompatible, kutanthauza kuti siziyenera kuyambitsa zoyipa kapena zoyipa zikakhudzana ndi minofu yamoyo kapena madzi am'thupi. Zidazi zikuyenera kutsatira malamulo okhwima, monga ISO 10993, yomwe imalongosola njira zoyeserera ndi kuwunika kwa biocompatibility.

Zida zosadzaza zamagetsi azachipatala zimasankhidwa mosamala kapena kupangidwa kuti zitsimikizire kuti zimagwirizana. Zapangidwa kuti zikhale zopanda poizoni, zosakwiyitsa, komanso zopanda allergenic. Zidazi siziyenera kutulutsa zinthu zovulaza kapena kuwonongeka pakapita nthawi, chifukwa izi zitha kuwononga minofu kapena kutupa. Zida zodzaza ndi biocompatible zilinso ndi mayamwidwe ochepa amadzi kuti ateteze kukula kwa mabakiteriya kapena bowa omwe angayambitse matenda.

Kudalirika ndi gawo lina lofunikira lamagetsi azachipatala osakwanira. Zida zamankhwala nthawi zambiri zimakumana ndi zovuta zogwirira ntchito, monga kutentha kwambiri, chinyezi, madzi am'thupi, komanso kupsinjika kwamakina. Zida zosakwanira ziyenera kuteteza zida zamagetsi, kuwonetsetsa kudalirika kwawo kwanthawi yayitali komanso magwiridwe antchito. Kudalirika ndikofunikira kwambiri pazachipatala pomwe kulephera kwa chipangizo kumatha kusokoneza kwambiri chitetezo ndi thanzi la odwala.

Zida zamagetsi zamagetsi zachipatala ziyenera kukhala zolimba kukana chinyezi ndi mankhwala kuti zipirire kukhudzana ndi madzi am'thupi kapena njira zoletsera. Ayeneranso kuwonetsa kumamatira kwabwino ku magawo osiyanasiyana, kuwonetsetsa kutetezedwa kwa zida zamagetsi. Amakina, monga ma coefficients otsika akukula kwamafuta komanso kukana kugwedezeka kwabwino, ndikofunikira kuti muchepetse kupsinjika pazambiri panthawi yoyendetsa njinga yamoto kapena potsegula.

Njira yocheperako yamagetsi azachipatala imaphatikizapo:

• Kugawira zinthu zosadzazira kuzinthu zamagetsi.
• Kudzaza mipata.
• Kuchiza kupanga zoteteza ndi makina khola encapsulation.

Chisamaliro chiyenera kuchitidwa kuti zitsimikizidwe zonse za mawonekedwe ndi kusakhalapo kwa voids kapena matumba a mpweya omwe angasokoneze kudalirika kwa chipangizocho.

Kuphatikiza apo, zinthu zinanso zimaganiziridwa pakuchepetsa zida zamankhwala. Mwachitsanzo, zinthu zodzazirapo ziyenera kugwirizana ndi njira zotsekera zomwe zimagwiritsidwa ntchito pa chipangizocho. Zida zina zimatha kukhala zokhudzidwa ndi njira zina zotsekera, monga nthunzi, ethylene oxide, kapena ma radiation, ndi zina zingafunike kusankhidwa.

Aerospace Electronics Underfill: Kutentha Kwambiri ndi Kukaniza Kugwedezeka

Zamagetsi zam'mlengalenga zimakwaniritsa njira yapadera yolumikizira ndi kuteteza zida zamagetsi muzamlengalenga. Malo okhala mumlengalenga amakhala ndi zovuta zapadera, kuphatikiza kutentha kwambiri, kugwedezeka kwakukulu, komanso kupsinjika kwamakina. Chifukwa chake, kudzaza kwamagetsi mumlengalenga kumawunikira mbali ziwiri zofunika: kukana kutentha kwambiri komanso kukana kugwedezeka.

Kukana kutentha kwakukulu ndikofunika kwambiri pamagetsi apamlengalenga chifukwa cha kutentha kwakukulu komwe kumachitika panthawi yogwira ntchito. Zida zosadzaza zomwe zimagwiritsidwa ntchito pazamlengalenga ziyenera kupirira kutentha kwakukulu popanda kusokoneza magwiridwe antchito ndi kudalirika kwa zida zamagetsi. Ayenera kusonyeza kukula kochepa kwa kutentha ndikukhala okhazikika pa kutentha kwakukulu.

Zida zosadzaza zamagetsi zam'mlengalenga zimasankhidwa kapena kupangidwira kutentha kwa magalasi apamwamba (Tg) ndi kukhazikika kwamafuta. Tg yapamwamba imatsimikizira kuti zinthuzo zimasunga makina ake pa kutentha kwakukulu, kuteteza kusinthika kapena kutayika kwa adhesion. Zidazi zimatha kupirira kutentha kwambiri, monga ponyamuka, kulowanso mumlengalenga, kapena kugwira ntchito m'zigawo za injini zotentha.

Kuphatikiza apo, zida zocheperako pazamagetsi zam'mlengalenga ziyenera kukhala ndi ma coefficients otsika a thermal expansion (CTE). CTE imayesa kuchuluka kwa zinthu zomwe zimakula kapena kugwirizanitsa ndi kusintha kwa kutentha. Pokhala ndi CTE yotsika, zida zotsika pansi zimatha kuchepetsa kupsinjika pazigawo zamagetsi zomwe zimayambitsidwa ndi njinga zamatenthedwe, zomwe zingayambitse kulephera kwamakina kapena kutopa kwa solder.

Kukaniza kugwedezeka ndichinthu china chofunikira pakudzaza kwamagetsi mumlengalenga. Magalimoto apamlengalenga amatha kugwedezeka mosiyanasiyana, kuphatikiza injini, kugwedezeka kwa ndege, komanso kugwedezeka kwamakina poyambitsa kapena kutera. Kugwedezeka uku kungawononge ntchito ndi kudalirika kwa zipangizo zamagetsi ngati sizitetezedwa mokwanira.

Zida zosadzaza zomwe zimagwiritsidwa ntchito muzamagetsi zam'mlengalenga ziyenera kuwonetsa zinthu zabwino kwambiri zochepetsera kugwedezeka. Ayenera kuyamwa ndikutaya mphamvu zomwe zimapangidwa ndi kugwedezeka, kuchepetsa kupsinjika ndi kupsinjika pazigawo zamagetsi. Izi zimathandiza kupewa kupangika kwa ming'alu, fractures, kapena kulephera kwina kwamakina chifukwa chowonekera kwambiri kugwedezeka.

Kuphatikiza apo, zida zodzaza ndi zomatira kwambiri komanso mphamvu zolumikizana ndizokonda pazogwiritsa ntchito zakuthambo. Zinthu izi zimawonetsetsa kuti zinthu zomwe sizingakwaniritsidwe zimakhalabe zomangika kuzinthu zamagetsi ndi gawo lapansi, ngakhale pakugwedezeka kwakukulu. Kumamatira mwamphamvu kumalepheretsa zinthu zodzaza pansi kuti zisawonongeke kapena kupatukana ndi zinthu, kusunga kukhulupirika kwa encapsulation ndikuteteza ku chinyezi kapena zinyalala kulowa.

Njira yothirira pansi pazamagetsi zam'mlengalenga nthawi zambiri imaphatikizapo kugawa zinthu zomwe sizidzadzaza pazida zamagetsi, kuzilola kuti ziziyenda ndikudzaza mipata, kenako ndikuzichiritsa kuti zipange encapsulation yolimba. Kuchiritsa kumatha kuchitika pogwiritsa ntchito njira zochiritsira zotentha kapena za UV, kutengera zomwe mukufuna.

Kukana kwapanjinga yamatenthedwe ndichinthu china chofunikira pakudzaza kwamagetsi pamagalimoto. Magalimoto amakumana ndi kutentha kwanthawi zonse, makamaka poyambitsa injini ndikugwira ntchito, ndipo kutentha kumeneku kumatha kuyambitsa kupsinjika kwamagetsi pamagetsi ndi zinthu zozungulira zozungulira. Zida zosadzaza zomwe zimagwiritsidwa ntchito pamagalimoto ziyenera kukhala zolimba kwambiri zolimbana ndi kusinthasintha kwa kutentha kumeneku popanda kusokoneza magwiridwe ake.

Zida zamagetsi zamagetsi zamagalimoto ziyenera kukhala ndi ma coefficients ocheperako amafuta (CTE) kuti muchepetse kupsinjika kwa zida zamagetsi panthawi yanjinga yotentha. CTE yogwirizana bwino pakati pa zinthu zosadzaza ndi zosakaniza zimachepetsa chiopsezo cha kutopa kwa solder, kusweka, kapena kulephera kwina kwa makina chifukwa cha kupsinjika kwa kutentha. Kuonjezera apo, zipangizo zomwe sizidzadzaza ziyenera kuwonetsa bwino kutentha kwa kutentha kuti zithetse kutentha bwino, kuteteza malo omwe ali ndi malo omwe angakhudze magwiridwe antchito ndi kudalirika kwa zigawozo.

Kuphatikiza apo, zida zamagetsi zamagetsi zamagalimoto ziyenera kukana chinyezi, mankhwala, ndi madzi. Ayenera kukhala ndi madzi otsika kuti ateteze nkhungu kapena kuwonongeka kwa zipangizo zamagetsi. Kukana kwa Chemical kumawonetsetsa kuti zinthu zomwe sizidzadzadzidwa bwino zimakhalabe zokhazikika zikakhala ndi madzi amgalimoto, monga mafuta, mafuta, kapena zoyeretsa, kupewa kuwonongeka kapena kutayika.

Njira yodzaza ndi zida zamagetsi zamagalimoto nthawi zambiri imaphatikizapo kugawa zinthu zomwe sizidzadzaza pazida zamagetsi, kuzilola kuti ziziyenda ndikudzaza mipata, kenako ndikuchiza kuti apange encapsulation yokhazikika. Njira yochiritsa imatha kukwaniritsidwa kudzera mu njira zochiritsira zotenthetsera kapena za UV, kutengera zomwe mukufuna komanso zomwe zagwiritsidwa ntchito.

Kusankha Oyenera Underfill Epoxy

Kusankha underfill epoxy yoyenera ndi chisankho chofunika kwambiri pa msonkhano ndi kuteteza zipangizo zamagetsi. Underfill epoxies amapereka kulimbikitsa makina, kasamalidwe ka kutentha, ndi chitetezo ku zinthu zachilengedwe. Nazi zina zofunika pakusankha epoxy yoyenera yodzaza pansi:

1. Thermal Properties: Imodzi mwa ntchito zoyambira za underfill epoxy ndikutaya kutentha kopangidwa ndi zida zamagetsi. Chifukwa chake, ndikofunikira kuganizira momwe ma epoxy amatenthetsera komanso kukana kwamafuta. High matenthedwe madutsidwe amathandiza kutentha kutentha, kuteteza malo otentha ndi kusunga chigawo chodalirika. Epoxy iyeneranso kukhala ndi kukana kwamafuta ochepa kuti muchepetse kupsinjika kwa kutentha pazigawo panthawi ya kutentha kwa njinga.
2. Match a CTE: The underfill epoxy's thermal expansion coefficient (CTE) iyenera kugwirizana bwino ndi CTE ya zida zamagetsi ndi gawo lapansi kuti muchepetse kupsinjika kwamafuta ndikupewa kulephera kwa solder. CTE yogwirizana kwambiri imathandizira kuchepetsa chiopsezo cha kulephera kwa makina chifukwa cha njinga zamatenthedwe.
3. Kuthekera kwa Kuyenda ndi Kudzaza Mpata: Epoxy yodzaza pansi iyenera kukhala ndi makhalidwe abwino othamanga komanso kutha kudzaza mipata pakati pa zigawo bwino. Izi zimatsimikizira kuphimba kwathunthu ndikuchepetsa ma voids kapena matumba a mpweya omwe angakhudze kukhazikika kwamakina a msonkhano ndi magwiridwe antchito amafuta. Kukhuthala kwa epoxy kuyenera kukhala koyenera pakugwiritsa ntchito ndi njira yolumikizira, kaya ndi capillary flow, jet dispensing, kapena kusindikiza pazenera.
4. Kumamatira: Kumamatira mwamphamvu ndikofunikira pakudzaza epoxy kuti zitsimikizire kulumikizana kodalirika pakati pa zigawo ndi gawo lapansi. Iyenera kuwonetsa kumamatira kwabwino kuzinthu zosiyanasiyana, kuphatikiza zitsulo, ceramics, ndi mapulasitiki. The epoxy adhesion katundu amathandiza kuti msonkhano kukhulupirika makina ndi kudalirika kwa nthawi yaitali.
5. Njira Yochiritsira: Ganizirani njira yochiritsira yomwe ikugwirizana bwino ndi zomwe mumapangira. Ma epoxies osadzaza amatha kuchiritsidwa ndi kutentha, kuwala kwa UV, kapena kuphatikiza zonse ziwiri. Njira iliyonse yochiritsa ili ndi zabwino ndi zofooka, ndipo kusankha yomwe ikugwirizana ndi zomwe mukufuna kupanga ndikofunikira.
6. Kukaniza Kwachilengedwe: Unikani kukana kwa epoxy kokwanira kuzinthu zachilengedwe monga chinyezi, mankhwala, ndi kutentha kwambiri. Epoxy iyenera kupirira kukhudzana ndi madzi, kuteteza kukula kwa nkhungu kapena dzimbiri. Kukaniza mankhwala kumatsimikizira bata mukakumana ndi zamadzimadzi zamagalimoto, zoyeretsera, kapena zinthu zina zomwe zitha kuwononga. Kuonjezera apo, epoxy iyenera kukhala ndi makina ndi magetsi pa kutentha kwakukulu.
7. Kudalirika ndi Moyo Wautali: Ganizirani mbiri yakale ya epoxy ndi data yodalirika. Yang'anani zida za epoxy zoyesedwa ndikutsimikiziridwa kuti zikuyenda bwino pamapulogalamu ofanana kapena kukhala ndi ziphaso zamakampani ndikutsata miyezo yoyenera. Ganizirani zinthu monga kukalamba, kudalirika kwa nthawi yayitali, komanso kuthekera kwa epoxy kusunga zinthu zake pakapita nthawi.

Mukasankha epoxy yoyenera kudzaza, ndikofunikira kuti muganizire zomwe mukufuna kugwiritsa ntchito, kuphatikiza kasamalidwe kamafuta, kukhazikika kwamakina, kutetezedwa kwa chilengedwe, komanso kugwirizanirana ndi kupanga. Kufunsana ndi ogulitsa epoxy kapena kufunafuna upangiri waukatswiri kungakhale kopindulitsa popanga chisankho mwanzeru chomwe chimakwaniritsa zosowa za pulogalamu yanu ndikuwonetsetsa kuti mukuchita bwino komanso kudalirika.

Zam'tsogolo mu Underfill Epoxy

Underfill epoxy ikusintha mosalekeza, motsogozedwa ndi kupita patsogolo kwaukadaulo wamagetsi, mapulogalamu omwe akubwera, komanso kufunikira kochita bwino komanso kudalirika. Zochitika zingapo zamtsogolo zitha kuwoneka pakukula ndi kugwiritsa ntchito underfill epoxy:

1. Miniaturization and Higher Density Packaging: Pamene zida zamagetsi zikupitilira kuchepa ndikukhala ndi kachulukidwe kagawo kakang'ono, ma epoxies a underfill ayenera kusintha moyenerera. Zomwe zidzachitike m'tsogolomu zidzayang'ana pakupanga zinthu zomwe sizingakwaniritsidwe zomwe zimalowa ndikudzaza mipata yaying'ono pakati pa zigawo, kuwonetsetsa kutetezedwa kwathunthu ndi chitetezo chodalirika pamisonkhano yamagetsi yocheperako.
2. Kugwiritsa Ntchito Nthawi zambiri: Ndi kuchuluka kwa kufunikira kwa zida zamagetsi zothamanga kwambiri komanso zothamanga kwambiri, ma formulations a epoxy osadzaza adzafunika kuthana ndi zofunikira pakugwiritsa ntchito izi. Zida zotsika pansi zokhala ndi ma dielectric otsika nthawi zonse komanso otsika otayika zidzakhala zofunikira kuti muchepetse kutayika kwa ma siginecha ndikusunga kukhulupirika kwa ma siginecha apamwamba pamakina apamwamba olumikizirana, ukadaulo wa 5G, ndi mapulogalamu ena omwe akubwera.
3. Kuwongolera Kutentha Kwambiri: Kuwonongeka kwa kutentha kumakhalabe vuto lalikulu pazida zamagetsi, makamaka ndi kuchuluka kwa mphamvu zamagetsi. Mapangidwe a epoxy amtsogolo adzayang'ana kwambiri kuwongolera kwamafuta kuti apititse patsogolo kusamutsa kutentha ndikuwongolera bwino nkhani zamatenthedwe. Zodzaza zapamwamba ndi zowonjezera zidzaphatikizidwa mu underfill epoxies kuti mukwaniritse matenthedwe apamwamba ndikusunga zinthu zina zomwe mukufuna.
4. Flexible and Stretchable Electronics: Kukwera kwamagetsi osinthika komanso otambasuka kumatsegula mwayi watsopano wodzaza zinthu za epoxy. Ma epoxies osinthika ocheperako ayenera kuwonetsa kumamatira kwabwino komanso makina amakina ngakhale akupindika mobwerezabwereza kapena kutambasula. Zida izi zithandizira kutsekeka ndi kuteteza zamagetsi pazida zovala, zowonetsera zopindika, ndi ntchito zina zomwe zimafunikira kusinthasintha kwamakina.
5. Mayankho Othandiza Pachilengedwe: Kukhazikika komanso kuganizira zachilengedwe kudzakhala ndi gawo lalikulu pakukulitsa zida za epoxy zosadzaza. Padzakhala kuyang'ana kwambiri pakupanga mapangidwe a epoxy opanda zinthu zowopsa ndipo achepetsa kuwononga chilengedwe m'moyo wawo wonse, kuphatikiza kupanga, kugwiritsa ntchito, ndi kutaya. Zida zochokera ku bio kapena zongowonjezedwanso zitha kutchuka ngati njira zokhazikika.
6. Njira Zopangira Zotsogola: Zomwe zikuchitika m'tsogolomu pakudzaza epoxy zidzayang'ana kwambiri zakuthupi ndi kupita patsogolo kwazinthu zopanga. Njira monga zopangira zowonjezera, kugawa kosankhidwa, ndi njira zochiritsira zapamwamba zidzafufuzidwa kuti zitheke kugwiritsa ntchito bwino komanso magwiridwe antchito a underfill epoxy m'njira zosiyanasiyana zochitira misonkhano yamagetsi.
7. Kuphatikizika kwa Njira Zapamwamba Zoyesera ndi Makhalidwe: Ndi zovuta zomwe zikuchulukirachulukira komanso zofunikira pazida zamagetsi, padzakhala kufunikira kwa njira zoyesera zotsogola ndi mawonekedwe kuti zitsimikizire kudalirika ndi magwiridwe antchito a epoxy osadzaza. Njira monga kuyesa kosawononga, kuyang'anira mu-situ, ndi zida zofananira zithandizira pakupanga ndi kuwongolera kwabwino kwa zida za epoxy zosadzaza.

Kutsiliza

Underfill epoxy imagwira ntchito yofunika kwambiri pakukulitsa kudalirika ndi magwiridwe antchito a zida zamagetsi, makamaka pakuyika kwa semiconductor. Mitundu yosiyanasiyana ya underfill epoxy imapereka maubwino angapo, kuphatikiza kudalirika kwakukulu, kudzipangira tokha, kachulukidwe kakang'ono, komanso magwiridwe antchito apamwamba komanso amakina. Kusankha underfill epoxy yoyenera pakugwiritsa ntchito ndi phukusi kumatsimikizira mgwirizano wolimba komanso wokhalitsa. Pamene ukadaulo ukupita patsogolo ndi kukula kwa phukusi, tikuyembekeza mayankho ochulukirapo a epoxy omwe amapereka magwiridwe antchito apamwamba, kuphatikiza, ndi miniaturization. Underfill epoxy yakhazikitsidwa kuti ikhale ndi gawo lofunikira kwambiri mtsogolo mwamagetsi, kutipangitsa kuti tikwaniritse kudalirika komanso magwiridwe antchito apamwamba m'mafakitale osiyanasiyana.