Kufotokozera
Ma Parameters a Zamalonda
| Mtundu wa Zamalonda |
Name mankhwala |
mtundu |
Chitsanzo
Viscosity (cps) |
Nthawi Yokonzekera |
ntchito |
Kusiyanitsa |
| Chithunzi cha DM-6513 |
Zomatira zomata za epoxy |
Opaque Creamy Yellow |
3000 ~ 6000 |
@100℃
30min
120 ℃ 15 min
150 ℃ 10 min |
Reusable CSP (FBGA) kapena BGA filler |
Chimodzi-gawo epoxy utomoni zomatira ndi reusable wodzazidwa utomoni CSP (FBGA) kapena BGA. Amachiritsa mwamsanga akangotenthedwa. Zapangidwa kuti zipereke chitetezo chabwino kuti chiteteze kulephera chifukwa cha kupsinjika kwamakina. Low mamasukidwe akayendedwe amalola kudzaza mipata pansi CSP kapena BGA. |
| Chithunzi cha DM-6517 |
Epoxy pansi filler |
Black |
2000 ~ 4500 |
@ 120 ℃ 5min 100 ℃ 10min |
CSP (FBGA) kapena BGA yodzazidwa |
Gawo limodzi, thermosetting epoxy resin ndi CSP (FBGA) kapena BGA filler yomwe imagwiritsidwanso ntchito kuteteza malo olumikizirana kupsinjika kwamakina pamagetsi am'manja. |
| Chithunzi cha DM-6593 |
Zomatira zomata za epoxy |
Black |
3500 ~ 7000 |
@ 150 ℃ 5min 165 ℃ 3min |
Capillary Flow Wodzaza Chip Size Packaging |
Kuchiritsa mwachangu, madzi othamanga a epoxy resin, opangidwa kuti azidzaza ma capillary chip size. Izo lakonzedwa kuti ndondomeko liwiro monga nkhani yofunika kwambiri kupanga. Kapangidwe kake ka rheological kamalola kuti ilowe mumpata wa 25μm, kuchepetsa kupsinjika komwe kunayambitsa, kupititsa patsogolo kutentha kwa njinga, ndikukhala ndi mphamvu zokana mankhwala. |
| Chithunzi cha DM-6808 |
Epoxy underfill zomatira |
Black |
360 |
@130℃ 8min 150℃ 5min |
CSP (FBGA) kapena BGA kudzaza pansi |
Zomatira zomatira zam'munsi zokhala ndi viscosity yotsika kwambiri pamapulogalamu ambiri osadzaza. |
| Chithunzi cha DM-6810 |
Reworkable epoxy underfill zomatira |
Black |
394 |
@130℃ 8min |
Reusable CSP (FBGA) kapena BGA pansi
kudzaza |
The reusable epoxy primer idapangidwira CSP ndi BGA application. Imachiritsa mwamsanga pa kutentha kwapakati kuti muchepetse kupsinjika pazigawo zina. Akachiritsidwa, zinthuzo zimakhala ndi makina abwino kwambiri kuti ateteze mafupa a solder panthawi yotentha. |
| Chithunzi cha DM-6820 |
Reworkable epoxy underfill zomatira |
Black |
340 |
@130 ℃ 10min 150 ℃ 5min 160 ℃ 3min |
Reusable CSP (FBGA) kapena BGA pansi
kudzaza |
The underfill reusable anapangidwira makamaka CSP, WLCSP ndi BGA ntchito. Amapangidwa kuti azichiza mofulumira pa kutentha kwapakati kuti achepetse nkhawa pazinthu zina. Zinthuzo zimakhala ndi kutentha kwa magalasi apamwamba komanso kulimba kwambiri kwapang'onopang'ono kuti zitetezedwe bwino pamalumikizidwe a solder panthawi yanjinga yotentha. |
Zambiri Zamalonda
| Zingatheke |
Kuchiza mwachangu pa kutentha kwapakati |
| Kutentha kwamphamvu kwa galasi komanso kulimba kwapang'onopang'ono |
Kukhuthala kotsika kwambiri pamapulogalamu ambiri osadzaza |
Zopindulitsa Zamagulu
Ndi CSP (FBGA) yogwiritsidwanso ntchito kapena BGA filler yomwe imagwiritsidwa ntchito kuteteza ma solder kupsinjika kwamakina pazida zamagetsi zam'manja. Amachiritsa mwamsanga akangotenthedwa. Zapangidwa kuti zipereke chitetezo chabwino pakulephera chifukwa cha kupsinjika kwamakina. Low mamasukidwe akayendedwe amalola mipata kudzazidwa pansi CSP kapena BGA.
