1. Mbido
2.  >
3. Product
4.  >
5. Epoxy nrapado

Epoxy nrapado

DeepMaterial na-enye ihe njupụta nke capillary ọhụrụ maka mgbape, CSP na ngwaọrụ BGA. DeepMaterial ọhụrụ capillary eruba n'okpuru na-ejuputa bụ mmiri dị elu, ịdị ọcha dị elu, ihe nwere otu akụkụ nke na-etolite otu, akwa akwa na-enweghị ihe na-eme ka ọ dịkwuo mma ntụkwasị obi na akụrụngwa akụrụngwa nke akụrụngwa site na iwepu nrụgide sitere na ihe na-ere ahịa. DeepMaterial na-enye usoro maka imeju ngwa ngwa nke akụkụ dị mma nke ukwuu, ike ọgwụgwọ ngwa ngwa, ogologo ọrụ na ogologo ndụ, yana arụkwa ọrụ. Reworkability na-azọpụta ụgwọ site n'ikwe ka mwepụ nke underfill maka ojiji nke osisi.

Mgbakọ mgbawa na-achọ enyemaka mgbakasị ahụ nke eriri ịgbado ọkụ ọzọ maka ogologo ịka nká na ndụ okirikiri. Mgbakọ CSP ma ọ bụ BGA chọrọ iji ihe eji eme ihe na-eme ka ọ dịkwuo mma n'ezi ihe n'ike nke mgbakọ n'oge ule mgbanwe, ịma jijiji ma ọ bụ dobe.

DeepMaterial's flip-chip underfills nwere ọdịnaya njupụta dị elu ka ọ na-ejigide ọsọ ọsọ na obere olulu, na-enwe ike inwe okpomọkụ mgbanwe iko dị elu na modul dị elu. Ihe mkpuchi CSP anyị dị na ọkwa dị iche iche, ahọpụtara maka ọnọdụ mgbanwe iko na modul maka ngwa ezubere.

Enwere ike iji COB encapsulant maka njikọ waya iji nye nchebe gburugburu ebe obibi na ịbawanye ike igwe. Ihe mkpuchi mkpuchi nke ibe ejikọtara waya gụnyere mkpuchi elu, cofferdam, na ndochi oghere. A chọrọ nrapado nwere ọrụ nhazi nke ọma, n'ihi na ike ịgbasa ha ga-ahụrịrị na wires ndị ahụ kpuchiri ekpuchi, na nrapado agaghị esi na mgbawa ahụ pụta, wee hụ na enwere ike iji ya mee ihe dị mma.

DeepMaterial's COB encapsulating adhesives nwere ike ịbụ thermally ma ọ bụ UV gwọrọ DeepMaterial's COB encapsulation adhesive nwere ike gwọọ ọkụ ma ọ bụ gwọọ UV na ntụkwasị obi dị elu yana ọnụọgụ ọzịza dị ala, yana nnukwu mgbanwe mgbanwe iko na ọdịnaya ion dị ala. DeepMaterial's COB encapsulating adhesives na-echebe ụzọ na plumbum, chrome na silicon wafers site na gburugburu mpụta, mmebi akụrụngwa na corrosion.

A na-eji epoxy na-agwọ ọkụ, UV-curing acrylic, ma ọ bụ silicone chemistries maka ezigbo mkpuchi ọkụ. DeepMaterial COB encapsulating adhesives na-enye ezigbo nkwụsi ike dị elu nke okpomọkụ na nkwụsi ike ọkụ ọkụ, ihe mkpuchi ọkụ eletrik n'elu oke okpomọkụ, na nkwụsịtụ dị ala, nrụgide dị ala, na nguzogide kemịkal mgbe a gwọrọ ya.

Deepmaterial kasị mma n'elu waterproof structural nrapado gluu maka plastic ka metal na iko emeputa, ọkọnọ non conductive epoxy nrapado sealant gluu maka underfill pcb electronic components, semiconductor adhesives maka electronic mgbakọ, ala okpomọkụ ọgwụgwọ bga tụgharịa mgbawa underfill pcb epoxy usoro nrapado gluu ihe na otú na

DeepMaterial Epoxy Resin Base Chip Na-ejuputa na Tebụl Nhọrọ Ihe Ngwa.
Nhọrọ ngwaahịa Epoxy Underfill

Nhọrọ ngwaahịa OLED Edge Banding

Nhọrọ ngwaahịa nrapado na-agbanye oyi

Nhọrọ ngwaahịa nrapado na-ekpo ọkụ

NR magnetik Nhọrọ ngwaahịa nrapado

Nhọrọ ngwaahịa mkpuchi mkpuchi mkpuchi dị elu