Hauj lwm
Khoom Specifications & Parameters
khoom
lub npe |
khoom
Npe 2 |
xim |
raug
Viscosity
(cps) Cov |
Ntsuas piv |
Thawj Fixation Sijhawm /
Fixation puv |
TG/°C |
Hardness / D |
Kub
Kuj / ° C |
Khaws cia |
Yam khoom
daim ntawv sau npe |
DM-6060 F |
UV noo noo dual curing nplaum |
Translucent Lub teeb xiav |
18000 |
tib
tivthaiv |
<10s@100mW/cm 2Humidity 8 hnub |
75 |
76 |
-55 ° C-120 ° C |
2-8 ° C |
Tsis-ntws, UV / noo noo curing encapsulation rau tshuaj pleev thaiv kab thaiv kev tiv thaiv. Cov khoom no yog fluorescent nyob rau hauv UV teeb (Dub). Feem ntau yog siv rau kev tiv thaiv hauv zos ntawm WLCSP thiab BGA ntawm Circuit Boards. |
DM-6061 F |
UV noo noo dual curing nplaum |
Translucent Lub teeb xiav |
23000 |
tib
tivthaiv |
<10s@100mW/cm 2Humidity 7 hnub |
56 |
75 |
-55 ° C-120 ° C |
2-8 ° C |
Tsis-ntws, UV / noo noo curing encapsulation rau tshuaj pleev thaiv kab thaiv kev tiv thaiv. Cov khoom no yog fluorescent nyob rau hauv UV teeb (Dub). Feem ntau yog siv rau kev tiv thaiv hauv zos ntawm WLCSP thiab BGA ntawm Circuit Boards. |
DM-6290 |
UV ya raws
dual curing
nplaum |
Pob tshab amber |
100 ~ 350 |
Hardness:
60 ~ 90 |
<20s@100mW/cm2Moisture curing rau 5 hnub |
-45 |
|
-53 ° C - 204 ° C |
2-8 ° C |
Nws yog siv los tiv thaiv cov ntawv luam tawm hauv Circuit Court boards thiab lwm yam khoom siv hluav taws xob rhiab heev. Nws yog tsim los muab kev tiv thaiv ib puag ncig. Cov khoom siv feem ntau yog siv los ntawm -53 ° C txog 204 ° C. |
DM-6040 |
UV ya raws
dual curing
nplaum |
Pob tshab
kua |
500 |
tib
tivthaiv |
<30s@300mW/cm 2Moisture 2-3 hnub |
* |
80 |
-40 ° C - 135 ° C |
20-30 ° C |
Nws yog ib feem, VOC dawb conformable txheej. Cov khoom yog tsim tshwj xeeb rau gel thiab kho sai sai thaum raug UV teeb thiab tom qab ntawd kho thaum raug huab cua noo, yog li ua kom muaj kev ua tau zoo txawm tias nyob hauv qhov chaw ntxoov ntxoo. Cov txheej nyias nyias ntawm cov txheej tuaj yeem teeb tsa yuav luag tam sim ntawd mus rau qhov tob ntawm 7mils. Cov khoom lag luam muaj qhov muaj zog Dub fluorescence thiab zoo heev adhesion rau ntau yam hlau, ceramic thiab iav ntim epoxy nto, ua tau raws li qhov xav tau ntawm cov kev xav tau tshaj plaws ntawm kev siv ib puag ncig. |
khoom nta
Ceev ceev |
High toughness, zoo heev thermal cycling zog |
Haum rau cov ntaub ntawv muaj kev ntxhov siab |
Resistant mus rau lub sij hawm ya raws los yog dej immersion |
High viscosity, siab thixotropy |
Cov nplaum muaj zog |
Khoom Zoo
UV / moisture curing encapsulation rau tshuaj pleev thaiv kab thaiv kev tiv thaiv. Cov khoom no yog fluorescent nyob rau hauv UV teeb (dub). Nws yog tsuas yog siv rau kev tiv thaiv hauv zos ntawm WLCSP thiab BGA ntawm cov laug cam. Cov khoom yog tsim tshwj xeeb rau kev ceev ceev gelation thiab kho thaum raug UV teeb thiab tom qab ntawd kho thaum raug huab cua noo, yog li ua kom muaj kev ua haujlwm zoo.