800 × 600-003

ʻO ka hoʻopili ʻana o UV Moisture Dual Curing Adhesive

ʻO ka lāʻau epoxy hoʻōla haʻahaʻa haʻahaʻa no nā hāmeʻa koʻikoʻi a me ka pale kaapuni
ʻO ke kāpili kala kala no ka hoʻopaʻa ʻana a me ka hoʻopaʻa ʻana

ʻAʻohe kahe ʻana o ke kāʻei Acrylic, UV pulu ʻelua-lāʻau encapsulation kūpono no ka pale ʻana o ka papa kaapuni kūloko. He fluorescent kēia huahana ma lalo o UV (ʻeleʻele). Hoʻohana nui ʻia no ka pale kūloko o WLCSP a me BGA ma nā papa kaapuni. Hoʻohana ʻia ka silicone organik e pale i nā papa kaapuni i paʻi ʻia a me nā ʻāpana uila ʻē aʻe. Hoʻolālā ʻia ia e hāʻawi i ka palekana kaiapuni. Hoʻohana maʻamau ka huahana mai -53°C a i 204°C.

Māhele:

Description

Nā ʻōlelo kikoʻī a me nā ʻāpana

Product

inoa

 Product

Inoa 2

 kala like 'ole KOLOHE

ʻO ka'ikehue

(cps)

 Laki Hoʻohui Ka manawa hoʻoponopono mua /

Hoʻopaʻa piha

 TG/°C Paʻakiki/D mahana

Kū'ē/°C

 Ua mālama ʻia Huahana maʻamau

noi
DM-6060F ʻO ka lāʻau lapaʻau hoʻōla ʻelua o UV Pōuliuli ʻulaʻula 18000 Single

Wahi

 <10s@100mW/cm 2He 8 lā 75 76 -55 ° C-120 ° C 2-8 ° C ʻAʻohe kahe, UV/moisture curing encapsulation no ka pale ʻana i ka papa kaapuni topical. ʻO kēia huahana he fluorescent ma lalo o ke kukui UV (ʻeleʻele). Hoʻohana nui ʻia no ka pale kūloko o WLCSP a me BGA ma nā papa kaapuni.
DM-6061F ʻO ka lāʻau lapaʻau hoʻōla ʻelua o UV Pōuliuli ʻulaʻula 23000 Single

Wahi

 <10s@100mW/cm 2He 7 lā 56 75 -55 ° C-120 ° C 2-8 ° C ʻAʻohe kahe, UV/moisture curing encapsulation no ka pale ʻana i ka papa kaapuni topical. ʻO kēia huahana he fluorescent ma lalo o ke kukui UV (ʻeleʻele). Hoʻohana nui ʻia no ka pale kūloko o WLCSP a me BGA ma nā papa kaapuni.
DM-6290 ʻO ka mākū o UV

lua ho'ōla

hoʻopili

 ʻAmbar mālohi 100 ~ 350 'Oke:

60 ~ 90

 <20s@100mW/cm2Hoʻomaʻamaʻa wai no 5 mau lā -45 -53 ° C - 204 ° C 2-8 ° C Hoʻohana ʻia ia no ka pale ʻana i nā papa kaapuni paʻi a me nā ʻāpana uila ʻē aʻe. Hoʻolālā ʻia ia e hāʻawi i ka palekana kaiapuni. Hoʻohana maʻamau ka huahana mai -53°C a i 204°C.
DM-6040 ʻO ka mākū o UV

lua ho'ōla

hoʻopili

 ka aniani moakaka

wai a

 500 Single

Wahi

 <30s@300mW/cm 2Mākū 2-3 lā * 80 -40 ° C - 135 ° C 20-30 ° C He ʻāpana hoʻokahi, VOC free conformable coating. Hoʻonohonoho kūikawā ʻia ka huahana i ka gel a hoʻoponopono koke i ka wā e ʻike ʻia ai i ke kukui UV a laila hoʻōla i ka wā e ʻike ʻia ai i ka wai o ka lewa, no laila e hōʻoia i ka hana maikaʻi loa ma nā wahi malu. Hiki ke hoʻonohonoho koke ʻia nā ʻāpana lahilahi o ka uhi i kahi hohonu o 7mils. Loaʻa i ka huahana kahi fluorescence ʻeleʻele ikaika a me ka hoʻopili maikaʻi ʻana i kahi ākea o ka metala, ka seramika a me ke aniani i piha i ka epoxy surfaces, e hālāwai ana i nā pono o nā noi pili kaiapuni.

Nā Huahana Huahana

Ho'ōla wikiwiki ʻO ka paʻakikī kiʻekiʻe, nā waiwai paikikala wela maikaʻi He kūpono no nā mea pilikia
Kūleʻa i ka makū lōʻihi a i ʻole ka hoʻokomo wai Kiʻekiʻe viscosity, kiʻekiʻe thixotropy Nā mea paʻa laka

Nā Pono Huahana

ʻO ka hoʻopaʻa ʻana o UV/moisture curing encapsulation no ka pale o ka papa kaapuni topical. ʻO kēia huahana he fluorescent ma lalo o ke kukui UV (ʻeleʻele). Hoʻohana nui ʻia ia no ka pale kūloko o WLCSP a me BGA ma nā papa kaapuni. Hoʻonohonoho kūikawā ʻia ka huahana no ka gelation wikiwiki a me ka hoʻoponopono ʻana i ka wā e ʻike ʻia ai i ke kukui UV a laila hoʻōla i ka wā e ʻike ʻia ai i ka wai o ka lewa, no laila e hōʻoia i ka hana maikaʻi loa.