DeepMaterial Electronic Adhesive Pruducts

ʻO kēia huahana kahi ʻāpana wela hoʻōla epoxy me ka hoʻopili maikaʻi ʻana i kahi ākea o nā mea. ʻO kahi mea hoʻopili maʻamau me ka viscosity ultra-haʻahaʻa kūpono no ka hapa nui o nā noi underfill. Hoʻolālā ʻia ka primer epoxy reusable no nā noi CSP a me BGA.

Māhele Huahana: Conductive Silver Adhesive

Hoʻolaʻa ʻia nā huahana kalahala conductive me ka conductivity kiʻekiʻe, conductivity thermal, kūpaʻa wela kiʻekiʻe a me nā hana hilinaʻi kiʻekiʻe. He kūpono ka huahana no ka hāʻawi ʻana i ka wikiwiki, ka hāʻawi ʻana i ka conformability maikaʻi, ʻaʻole deform ke kiko o ke kāpili, ʻaʻole hāʻule, ʻaʻole pālahalaha; hoʻōla ʻia ka makū mea, wela, kiʻekiʻe a me ka haʻahaʻa haʻahaʻa. 80 ℃ ho'ōla wikiwiki, ho'ōla uila maikaʻi a me ka hana wela.

ʻAʻohe kahe ʻana o ke kāʻei Acrylic, UV pulu ʻelua-lāʻau encapsulation kūpono no ka pale ʻana o ka papa kaapuni kūloko. He fluorescent kēia huahana ma lalo o UV (ʻeleʻele). Hoʻohana nui ʻia no ka pale kūloko o WLCSP a me BGA ma nā papa kaapuni. Hoʻohana ʻia ka silicone organik e pale i nā papa kaapuni i paʻi ʻia a me nā ʻāpana uila ʻē aʻe. Hoʻolālā ʻia ia e hāʻawi i ka palekana kaiapuni. Hoʻohana maʻamau ka huahana mai -53°C a i 204°C.

ʻO kēia pūʻulu he epoxy resin epoxy hoʻoheheʻe wela hoʻokahi no ka mālama haʻahaʻa haʻahaʻa me ka hoʻopili maikaʻi ʻana i kahi ākea o nā mea i loko o kahi manawa pōkole loa. ʻO nā noi maʻamau me nā kāleka hoʻomanaʻo, nā pūʻulu papahana CCD/CMOS. He kūpono kūpono no nā ʻāpana thermosensitive kahi e koi ʻia ai nā mahana curing haʻahaʻa.

Ho'ōla ka huahana ma ka lumi wela a hiki i kahi papa hoʻopili liʻiliʻi liʻiliʻi me ka hopena maikaʻi loa. Ke ho'ōla piha ʻia, kūpaʻa ka epoxy resin i ka hapa nui o nā kemika a me nā mea hoʻoheheʻe a loaʻa ke kūpaʻa maikaʻi ma luna o kahi ākea ākea.

ʻO ka huahana he mea hoʻokahi mea hoʻoheheʻe polyurethane hoʻoheheʻe wela hoʻoheheʻe. Hoʻohana ʻia ma hope o ka hoʻomehana ʻana no kekahi mau minuke a hiki i ka hoʻoheheʻe ʻia, me ka ikaika paʻa mua maikaʻi ma hope o ka hoʻoluʻu ʻana no kekahi mau minuke ma ke ana wela. A me ka manawa hāmama kūpono, a me ka elongation maikaʻi loa, ka hui wikiwiki, a me nā pono ʻē aʻe. ʻO ka hoʻomaʻemaʻe ʻana i ka maʻamau o ka huahana ma hope o 24 mau hola he 100% paʻa, a hiki ʻole ke hoʻololi.

He maikaʻi ke kūʻē ʻana o ka ʻāina i ka huahana a hiki ke hoʻololi i ke ʻano kūlohelohe. ʻO ka hana hoʻoheheʻe uila maikaʻi loa, hiki ke pale i ka hopena ma waena o nā ʻāpana a me nā laina, ka wai hoʻoheheʻe wai kūikawā, hiki ke pale i nā ʻāpana mai ka hoʻopili ʻia e ka makū a me ka haʻahaʻa, maikaʻi ka wela wela, hiki ke hoʻemi i ka mahana o nā mea uila e hana ana, a hoʻolōʻihi i ke ola lawelawe.

DeepMaterial optical glass UV adhesion reduction film hāʻawi haʻahaʻa birefringence, kiʻekiʻe clarity, maikaʻi loa ka wela a me ka haʻahaʻa kūpaʻa, a me ka laulā o nā kala a me ka mānoanoa. Hāʻawi pū mākou i nā ʻāpana anti-glare a me nā uhi conductive no nā kānana laminated acrylic.

ʻO ka huahana he kiʻiʻoniʻoni pale anti-static maʻemaʻe kiʻekiʻe, nā waiwai mechanical huahana a me ka paʻa o ka nui, maʻalahi e haehae a haehae ʻole me ka waiho ʻole ʻana i ke koena adhesive. He kū'ē maikaʻi i ka wela kiʻekiʻe a me ka pau. He kūpono no ka hoʻoili waiwai, pale panel a me nā hiʻohiʻona hoʻohana ʻē aʻe.

Māhele Huahana: Pale Pale

Hōʻike uila / pale pale
· Abrasion-pale
· Paʻa kemika
· Kūleʻa-pale
· UV-pale

Led Scribing/Huli Crystal/Reprinting Semiconductor PVC Pale Film

Hoʻohana ka huahana i ka PO ma ke ʻano he mea pale o ka ʻili, hoʻohana nui ʻia no ka ʻokiʻoki QFN, SMD microphone substrate cutting, FR4 substrate cutting (LED).