Epoxy Encapsulant

He maikaʻi ke kūʻē ʻana o ka ʻāina i ka huahana a hiki ke hoʻololi i ke ʻano kūlohelohe. ʻO ka hana hoʻoheheʻe uila maikaʻi loa, hiki ke pale i ka hopena ma waena o nā ʻāpana a me nā laina, ka wai hoʻoheheʻe wai kūikawā, hiki ke pale i nā ʻāpana mai ka hoʻopili ʻia e ka makū a me ka haʻahaʻa, maikaʻi ka wela wela, hiki ke hoʻemi i ka mahana o nā mea uila e hana ana, a hoʻolōʻihi i ke ola lawelawe.

Māhele: Pahu Epoxy

Description

Description

Nā Palapala Ho'ākāka Huahana

Product kükohu	Product inoa	kala like 'ole	KOLOHE ʻO ka viscosity (cps)	Manawa hoʻōla	hoʻohana	e pono ai
DM-6016E	Epoxy potting adhesive	ʻeleʻele	58000 ~ 62000	@ 150℃ 20min	ʻO nā mea hoʻokomo koʻikoʻi PCB, transistors, IC kāleka akamai kāʻei kāleka	No nā noi i makemake ʻia nā waiwai mālama maikaʻi. Loaʻa nā mea i hoʻōla ʻia no ka haʻalulu wela nui a hāʻawi i ke kūpaʻa wela mau i 177°C. Hiki ke hoʻohana ʻia no ka hoʻopili ʻana o nā transistors a me nā semiconductor like, hiki ke hoʻohana ʻia no ka hoʻopili ʻana i nā mākaʻikaʻi i hoʻohui ʻia, nā mea hoʻopili encapsulation, no ka PCB board sensitive inserts, transistors, smart card IC card packaging.
DM-6058E	Epoxy potting adhesive	ʻeleʻele	50,000	@ 120℃ 12min	Packaging o nā mīkini paʻi a pololei eiiiiiaiou	Hāʻawi kēia huahana i ka pale kūlohelohe maikaʻi a me ka wela no nā ʻāpana paʻi, a kūpono loa no ka pale ʻana i nā mea ʻike a me nā ʻāpana kikoʻī i hoʻohana ʻia i nā wahi paʻakikī e like me nā kaʻa.
DM-6061E	Epoxy potting adhesive	ʻeleʻele	32500 ~ 50000	@ 140°C 3H	ʻO nā mea hoʻokomo koʻikoʻi PCB, transistors, IC kāleka akamai kāʻei kāleka	Component encapsulation glue, hoʻohana ʻia no ka hoʻopili ʻana i nā plug-in PCB boards, ʻoi aku ka maikaʻi o ka viscosity paʻa, maʻalahi ke kāohi i ka nui o ke kāpili. Ma hope o ka hala ʻana o 1000H wela / humidity / deviation hōʻike a me ka pōʻai wela i 125 ℃. ʻO ka viscosity kūikawā i hoʻopaʻa ʻia ma 25 ° C e hāʻawi i ka nui maʻalahi i ka hoʻohana ʻana i nā mea hoʻopuka manawa / kaomi maʻamau.
DM-6086E	Epoxy potting adhesive	ʻeleʻele	62500	@ 120 ℃ 30min 150 ℃ 15 min	IC a me Semiconductor Packaging	Hoʻohana ʻia i nā noi e koi ana i nā waiwai mālama maikaʻi. No ka IC a me ka semiconductor packaging me ka hiki ke hoʻololi wela, hiki i nā mea ke kū i ka haʻalulu wela mau a hiki i 177°C

Nā Huahana Huahana
· Hāʻawi ʻoi aku ka maikaʻi o ke kaiapuni a me ka pale wela
· Paʻa viscosity maikaʻi, maʻalahi ke kāohi i ka nui o ka hāʻawi ʻana
· Hiki i ke kaʻa paikikala wela maikaʻi, hiki i nā mea ke kū i ka haʻalulu wela a hiki i 177°C mau
· No nā noi e koi ana i ka hana ʻoi aku ka maikaʻi

Nā Pono Huahana
ʻO ka huahana he epoxy resin encapsulant, kūpono no nā noi e koi ana i nā waiwai mālama maikaʻi. Component encapsulation glue, hoʻohana ʻia no ka PCB board sensitive plug-in packaging, maikaʻi viscosity stability, maʻalahi ke kāohi i ka nui o ke kāpili. Hoʻolālā ʻia nā encapsulants epoxy resin no nā noi e koi ana i nā waiwai mālama maikaʻi. Hoʻohana ʻia no ka IC a me semiconductor packaging, loaʻa iā ia ka hiki ke hoʻololi wela, a hiki i ka mea ke kū i ka haʻalulu wela mau a hiki i 177 ° C.