Me nā keʻena ma ka honua holoʻokoʻa, hāʻawi ʻo Deepmaterial i ke kōkua ʻenehana loea, nā ʻōlelo aʻoaʻo huahana, nā laʻana, nā hoʻokolohua hoʻokolohua, a i ʻole ka hoʻomohala ʻana i nā hana maʻamau no nā ʻoihana āpau. Hāʻawi mākou i nā manawa alakaʻi pōkole a me nā helu haʻahaʻa haʻahaʻa haʻahaʻa, ʻoiai no nā hana maʻamau.
Hāʻawi ʻo Deepmaterial i nā huahana adhesive kiʻekiʻe kiʻekiʻe e hōʻoia i ka holo wikiwiki ʻana o nā laina hana o nā mea kūʻai aku, E kelepona mai iā mākou no kahi loiloi laina hana manuahi a i ʻole kōkua me ka hoʻokomo ʻana i nā mea hoʻopili ʻenehana i loko o nā laina hana automated a manual paha.
Kōkua i ka hāʻawi ʻana i nā hoʻonā
Kākoʻo ʻia kā mākou mau mea kūʻai aku a me nā loea loea e kahi pūnaewele puni honua o nā mea hoʻolaha e kōkua iā ʻoe me kāu mau mea paʻa a pau. No ka ʻike e pili ana i ka nui o ka pūʻolo huahana, ka loaʻa ʻana o ka mea hoʻopili, a me nā kikoʻī pili o nā mea hoʻolaha kūloko, e ʻoluʻolu e kelepona iā Deepmaterial ma kou wahi.
Shenzhen Deepmaterial Technologies Co., Ltd
ʻO Shenzhen Deepmaterial Technologies Co., Ltd, he hui hana adhesives, a he ʻoihana hou i ʻike ʻia i nā adhesives no nā semiconductor a me nā noi uila a me nā mea pale o ka ʻili no ka ʻeke chip a me ka hoʻāʻo. Hāʻawi mākou i nā ʻenehana loea adhesive i nā ʻenekinia a puni ka honua.
Ma muli o ka ʻenehana koʻikoʻi o nā adhesives, ua hoʻomohala ʻo DeepMaterial i nā mea hoʻopili no ka hoʻopili ʻana i ka chip a me ka hoʻāʻo ʻana, nā mea hoʻopili papa kaapuni, a me nā mea hoʻopili no nā huahana uila. Ma muli o nā adhesives, ua hoʻomohala ʻo ia i nā kiʻiʻoniʻoni pale, nā mea hoʻopiha semiconductor, a me nā mea hoʻopihapiha no ka hoʻoheheʻe ʻana i ka wafer semiconductor a me ka hōʻiliʻili chip a me ka hoʻāʻo.
ʻO nā mea hoʻopili uila he mau mea kūikawā ia e hoʻopaʻa ai i nā mea uila, e like me nā kaapuni i hoʻohui ʻia, nā resistors, capacitors, a me nā transistors, i nā papa kaapuni, substrates, a me nā mea uila ʻē aʻe. ʻO kēia mau mea hoʻopili e hōʻoia i ka hilinaʻi, ka hana, a me ka lōʻihi o nā huahana uila.
Inā ʻoe e hana i ka hoʻomaikaʻi ʻana i kāu huahana a i ʻole kaʻina hana, mai nānā ʻoe ma mua o nā mea hoʻopili Deepmaterial. Hoʻohana ʻia nā mea hoʻopili ʻoihana e hoʻopaʻa i nā substrate like ʻole ma o ka hoʻopili ʻana (ka hoʻopaʻa ʻana i luna) a me ka cohesion (ikaika kūloko).
DeepMaterial Electronic Adhesive Pruducts
DeepMaterial, ma ke ʻano he mea hana epoxy adhesive ʻoihana, ua nalowale mākou i ka noiʻi e pili ana i ka underfill epoxy, non conductive glue no ka uila, non conductive epoxy, adhesives no ka hui uila, underfill adhesive, high refractive index epoxy. Ma muli o kēlā, loaʻa iā mākou ka ʻenehana hou o ka ʻenehana epoxy adhesive.
Hoʻopuka ʻo Deepmaterial mai nā ʻenehana hoʻopili like ʻole e hāʻawi i nā hoʻonā paʻa no ka hoʻopaʻa ʻana, hoʻopaʻa ʻana, a me nā noi potting. Hāʻawi mākou i nā lawelawe adhesive maʻamau i kāu koi, nā mea hoʻopili uila maʻamau, PUR structural adhesive, UV moisture curing adhesive, epoxy adhesive, conductive silver glue, epoxy underfill adhesive, epoxy encapsulant, functional film pale, semiconductor pale kiʻi.
ʻO ka mea hoʻopaʻa hoʻopaʻa magnet, ʻike ʻia hoʻi he magnetic glue a i ʻole magnet adhesive, he ʻano mea hoʻopili i hoʻohana ʻia no ka hoʻopaʻa ʻana i nā magnet i nā ʻano like ʻole. Ua lilo ia i mea kaulana ma muli o kāna mau waiwai kūikawā e hiki ai ke hoʻokomo maʻalahi a paʻa paʻa. Ma kēia ʻatikala, e ʻimi mākou i ka honua o ka magnet bonding adhesive a e ʻimi i kona mau hiʻohiʻona, nā pono, nā noi, a me nā mea hou aku.
ʻO Deepmaterial ka mea hoʻolako waiwai mua no ka hui uila a me nā ʻoihana hoʻopihapiha semiconductor. Hoʻokomo ʻia kā mākou papa hana kiʻekiʻe i kahi ʻano o nā huahana e hoʻomaʻamaʻa i ka pilina uila, hāʻawi i ka kūpaʻa ʻana, hāʻawi i ka pale koʻikoʻi, a me ka hoʻololi ʻana i ka wela no ka hana hilinaʻi. Haʻaheo mākou i ka hana ʻana i nā huahana e hoʻomaikaʻi i nā ʻenehana uila o kēia lā a hiki i ka holomua o ka lā ʻapōpō.